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STB80NF03L-04T

STMicroelectronics

STB80NF03L-04T by STMicroelectronics

STB80NF03L-04T by STMicroelectronics is a N-CHANNEL FET with 80A ID and 300W power dissipation. Ideal for high-power applications, it operates in enhancement mode with a max temp of 175°C. Suitable for surface mount configurations, this MOSFET features matte tin terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,148 parts In-Stock

1+ parts

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3,148

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Anansix

USA . 2,255 parts In-Stock

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2,255

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Vyrian

USA . 500 parts In-Stock

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500

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 689 parts In-Stock

1+ parts

$0.830

100+ parts

-

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689

$0.830

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IDEA Electronic Components Group

UK . 371 parts In-Stock

1+ parts

$1.043

100+ parts

-

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$0.939

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371

$1.043

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$0.939

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Corohmni

South Africa . 168 parts In-Stock

1+ parts

$1.391

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168

$1.391

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MKK Technologies

India . 1,537 parts In-Stock

1+ parts

$1.962

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1,537

$1.962

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DigiPath Technology Company

USA . 1,537 parts In-Stock

1+ parts

$1.962

100+ parts

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1,537

$1.962

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AZTECH Wire

Italy . 832 parts In-Stock

1+ parts

$5.177

100+ parts

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832

$5.177

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Ampacity Inc.

Singapore . 443 parts In-Stock

1+ parts

$65.050

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443

$65.050

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Corphita

USA . 3,368 parts In-Stock

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3,368

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Parana Technologies

USA . 1,776 parts In-Stock

1+ parts

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$1.247

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1,776

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$1.247

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Argo Parts USA

USA . 1,725 parts In-Stock

1+ parts

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1,725

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Continental Prestige Electronics

USA . 1,292 parts In-Stock

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1,292

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Overview

Discover the power of STMicroelectronics with the STB80NF03L-04T Power Field Effect Transistor. Designed for high performance and reliability, this N-CHANNEL FET offers a maximum drain current of 80A and a power dissipation of 300W. Whether you're in the automotive, industrial, or consumer electronics industry, this SINGLE configuration FET delivers enhanced efficiency and durability to your applications. Trust in STMicroelectronics for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and efficiency compared to P-channel FETs, making this product a good choice for high-power applications.

Configuration: SINGLE

Single configuration simplifies the design and makes it easier to integrate into circuits, enhancing the overall reliability of the product.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and enabling compact designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides greater control and efficiency in switching applications, making this product suitable for high-performance systems.

Maximum Drain Current (Abs) (ID): 80 A

High maximum drain current rating of 80A allows for handling large amounts of power, making this product ideal for high-current applications.

Maximum Power Dissipation (Abs): 300 W

High power dissipation capability of 300W ensures reliable operation under heavy loads, making it a dependable choice for demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers better performance, lower on-resistance, and improved thermal stability, making this product a reliable choice for power applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature of 175°C ensures reliability in harsh environments and extends product lifespan, making it suitable for industrial applications.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish provides good solderability and ensures a reliable electrical connection, making it easy to integrate into electronic circuits.

Technical Specifications

Power Field Effect Transistors (FET) STB80NF03L-04T attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Trade Compliance

STB80NF03L-04T Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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