Loading...

STB15NK50ZT4

STMicroelectronics

STB15NK50ZT4 by STMicroelectronics

STB15NK50ZT4 from STMicroelectronics is a robust N-channel FET designed for efficient switching applications. It features a 500V breakdown voltage, 14A max drain current, and operates at up to 150 °C. Ideal for power management in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,711 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,711

-

-

-

-

Digiode

USA . 3,348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,348

-

-

-

-

Anansix

USA . 416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

416

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 179 parts In-Stock

1+ parts

$1.214

100+ parts

-

1k+ parts

$1.093

10k+ parts

-

179

$1.214

-

$1.093

-

MKK Technologies

India . 713 parts In-Stock

1+ parts

$2.284

100+ parts

-

1k+ parts

-

10k+ parts

-

713

$2.284

-

-

-

DigiPath Technology Company

USA . 713 parts In-Stock

1+ parts

$2.284

100+ parts

-

1k+ parts

-

10k+ parts

-

713

$2.284

-

-

-

AZTECH Wire

Italy . 798 parts In-Stock

1+ parts

$15.300

100+ parts

-

1k+ parts

-

10k+ parts

-

798

$15.300

-

-

-

Kepictronics

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,000

-

-

-

-

Alle Elektronik GmbH

Germany . 3,457 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,457

-

-

-

-

Parana Technologies

USA . 2,124 parts In-Stock

1+ parts

-

100+ parts

$1.452

1k+ parts

-

10k+ parts

-

2,124

-

$1.452

-

-

Corphita

USA . 468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

468

-

-

-

-

Overview

Unleash the power of innovation with the STB15NK50ZT4 from STMicroelectronics. Renowned for its exceptional quality and reliability, this N-channel FET is engineered for efficient switching applications, offering a robust performance that stands the test of time. Designed for versatility, it excels in various industries, delivering outstanding value with lower energy consumption and enhanced durability. Trust STMicroelectronics to elevate your designs with superior components that empower your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability, low weight, and effective insulation, making the transistor suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide higher electron mobility, enabling better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode facilitates circuit protection and allows for easy integration in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures efficient and reliable operation in various electronic devices.

Surface Mount: YES

Surface mount capabilities support automated assembly processes and reduce overall PCB space.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage allows this FET to handle demanding applications without failure.

Package Shape: RECTANGULAR

The rectangular shape contributes to efficient space management on PCBs.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve mechanical stability on the circuit board.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for better control and higher efficiency, making it ideal for modern electronic systems.

Maximum Pulsed Drain Current (IDM): 56 A

Able to handle high pulsed currents, this FET is suitable for applications requiring robust performance under transient conditions.

Avalanche Energy Rating (EAS): 300 mJ

A high avalanche energy rating enhances reliability in applications where voltage spikes may occur.

Maximum Drain Current (Abs) (ID): 14 A

The ability to safely handle a maximum continuous drain current of 14 A makes it versatile for various applications.

No. of Terminals: 2

Having only two terminals simplifies the design and integration into electronic circuits.

Maximum Power Dissipation (Abs): 160 W

High power dissipation capability allows the device to handle significant power loads without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline packaging minimizes space requirements and is suitable for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables faster switching speeds and improved energy efficiency, making this FET a suitable choice for high-performance applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliability and performance in demanding environments.

Transistor Element Material: SILICON

Silicon ensures good thermal stability and performance, making it an excellent choice for FET applications.

Terminal Finish: MATTE TIN

The matte tin finish provides reliable solder connections while minimizing oxidation.

Maximum Drain Current (ID): 14 A

This specification indicates the FET's capability to perform in various applications reliably under standard load.

Maximum Drain-Source On Resistance: 0.34 ohm

Low on-resistance leads to lower heat generation and higher efficiency in power management.

Terminal Position: SINGLE

A single terminal position simplifies circuit design and layout, enhancing manufacturability.

Technical Specifications

Power Field Effect Transistors (FET) STB15NK50ZT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH VOLTAGE

Avalanche Energy Rating (EAS):

300 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.34 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

56 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB15NK50ZT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20