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STB13NM50N-1

STMicroelectronics

STB13NM50N-1 by STMicroelectronics

STB13NM50N-1 by STMicroelectronics is an N-channel MOSFET ideal for switching applications, featuring a 500V breakdown voltage and 12A max drain current. It offers a low on-resistance of 0.32Ω and operates at up to 150 °C. Its robust design ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,766 parts In-Stock

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4,766

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Digiode

USA . 4,151 parts In-Stock

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4,151

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Anansix

USA . 1,173 parts In-Stock

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1,173

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,234 parts In-Stock

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$1.626

100+ parts

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$1.463

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1,234

$1.626

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$1.463

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MKK Technologies

India . 296 parts In-Stock

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$3.057

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296

$3.057

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DigiPath Technology Company

USA . 296 parts In-Stock

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$3.057

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296

$3.057

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AZTECH Wire

Italy . 656 parts In-Stock

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$12.700

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656

$12.700

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Alle Elektronik GmbH

Germany . 4,634 parts In-Stock

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Corphita

USA . 3,247 parts In-Stock

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Parana Technologies

USA . 1,038 parts In-Stock

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$1.944

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1,038

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$1.944

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Overview

Unlock the potential of your designs with the STB13NM50N-1 from STMicroelectronics—a leader in semiconductor innovation. This powerful N-channel FET ensures reliable performance in high-voltage applications, making it ideal for switching tasks across industrial and consumer electronics. With superior quality and built-in diode functionality, you gain exceptional efficiency and durability, elevating your projects while reducing downtime. Choose STMicroelectronics for unmatched value and peace of mind in your electronic solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material offers good insulation and protects the transistor from environmental factors, enhancing reliability.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally provide better performance in terms of efficiency and speed, making this FET suitable for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode allows for easier integration into circuits and protection against reverse polarity, thus simplifying design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast operation and efficient performance in control circuits.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage ensures the transistor can handle high voltage applications, making it versatile and reliable.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient use of space on PCBs, contributing to compact design layouts.

Terminal Form: THROUGH-HOLE

Through-hole mounting offers robust mechanical support and is favorable for high-power applications, ensuring stable connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for greater control over the device's operating parameters, resulting in improved efficiency in switching.

Maximum Pulsed Drain Current (IDM): 48 A

A high pulsed drain current capability provides the ability to handle load surges, making it appropriate for transient conditions.

Avalanche Energy Rating (EAS): 200 mJ

The adequate avalanche energy rating ensures that the device can withstand voltage spikes, enhancing reliability in dynamic environments.

Maximum Drain Current (Abs) (ID): 12 A

This allows the transistor to handle substantial current loads, making it suitable for various high-power applications.

No. of Terminals: 3

With three terminals, this configuration is straightforward and easy to integrate into standard circuit designs.

Maximum Power Dissipation (Abs): 100 W

A high power dissipation rating means the transistor can handle significant power without overheating, crucial for performance stability.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy handling and placement on circuit boards, streamlining assembly processes.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-speed switching and low on-resistance, which are beneficial for power efficiency.

Maximum Operating Temperature: 150 °C

The high operating temperature rating ensures reliability in demanding environments, suitable for industrial applications.

Transistor Element Material: SILICON

Silicon as the semiconductor material is known for its stability and efficiency, making it a standard choice in FET technology.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing the longevity of connections.

Maximum Drain Current (ID): 12 A

This specification reinforces the transistor's capacity to manage substantial current loads, ensuring consistent performance.

Maximum Drain-Source On Resistance: 0.32 ohm

Low on-resistance leads to lower power loss and higher efficiency, making the transistor ideal for power management.

Terminal Position: SINGLE

A single terminal position makes this FET easy to integrate with various circuit designs, offering flexibility in applications.

Technical Specifications

Power Field Effect Transistors (FET) STB13NM50N-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.32 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

48 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB13NM50N-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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