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STB11N52K3

STMicroelectronics

STB11N52K3 by STMicroelectronics

STB11N52K3 by STMicroelectronics is a N-CHANNEL FET with 525V DS Breakdown Voltage, 40A IDM, and 0.51 ohm RDS(on). It is used for SWITCHING applications in ENHANCEMENT MODE. The transistor features a built-in DIODE, operates in SINGLE configuration, and has GULL WING terminals.

Median Price

$2.670

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,821 parts In-Stock

1+ parts

$2.670

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1,821

$2.670

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Vyrian

USA . 8,314 parts In-Stock

1+ parts

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8,314

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Anansix

USA . 2,140 parts In-Stock

1+ parts

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2,140

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Flip Electronics

USA . 1,000 parts In-Stock

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1,000

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R&J Components

USA . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,918 parts In-Stock

1+ parts

$0.749

100+ parts

-

1k+ parts

$0.674

10k+ parts

-

1,918

$0.749

-

$0.674

-

MKK Technologies

India . 863 parts In-Stock

1+ parts

$1.408

100+ parts

-

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863

$1.408

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DigiPath Technology Company

USA . 863 parts In-Stock

1+ parts

$1.408

100+ parts

-

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863

$1.408

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Ampacity Inc.

Singapore . 708 parts In-Stock

1+ parts

$2.390

100+ parts

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708

$2.390

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Corphita

USA . 246 parts In-Stock

1+ parts

$2.529

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246

$2.529

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Component Stockers USA

USA . 8,500 parts In-Stock

1+ parts

$16.860

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8,500

$16.860

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 27,116 parts In-Stock

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Perfect Parts

USA . 3,232 parts In-Stock

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3,232

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Alle Elektronik GmbH

Germany . 2,083 parts In-Stock

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2,083

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Parana Technologies

USA . 1,652 parts In-Stock

1+ parts

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100+ parts

$0.895

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1,652

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$0.895

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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GreenTree Electronics

Israel . 964 parts In-Stock

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964

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Overview

Unlock the power of innovation with the STB11N52K3 by STMicroelectronics. This high-quality Power Field Effect Transistor (FET) boasts a single configuration with a built-in diode, making it ideal for switching applications. With a minimum DS breakdown voltage of 525V and a maximum pulsing drain current of 40A, this transistor delivers reliable performance in a compact package. Whether you're looking to enhance your electronic designs or improve efficiency, the STB11N52K3 offers unparalleled value and benefits to customers seeking cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Offers better performance and efficiency compared to P-channel FETs in various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the circuit design by eliminating the need for an external diode, reducing component count and saving space.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient operation.

Surface Mount: YES

Can be easily mounted on the surface of a circuit board, saving assembly time and space.

Minimum DS Breakdown Voltage: 525 V

Provides high voltage handling capability, making it suitable for high-power applications.

Package Shape: RECTANGULAR

Facilitates easy installation and placement on a circuit board.

Terminal Form: GULL WING

Enables easy soldering and solid electrical connections on the circuit board.

Operating Mode: ENHANCEMENT MODE

Allows for easy control of the FET's conductivity, enhancing switching performance.

Maximum Pulsed Drain Current (IDM): 40 A

Capable of handling high current loads during short pulses, ensuring reliable operation in demanding conditions.

Avalanche Energy Rating (EAS): 170 mJ

Provides protection against avalanche breakdown, ensuring the FET's durability in high-voltage applications.

No. of Terminals: 2

Simplified two-terminal design for easy integration into circuit layouts.

Package Style (Meter): SMALL OUTLINE

Compact package design that saves space on the circuit board and allows for dense circuit layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced MOSFET technology for improved performance and efficiency.

Transistor Element Material: SILICON

Silicon material offers high thermal conductivity and reliability for stable operation.

Maximum Drain Current (ID): 10 A

Capable of handling high continuous current, suitable for various power applications.

Maximum Drain-Source On Resistance: 0.51 ohm

Low on-resistance ensures minimal power loss and efficient operation of the FET.

Terminal Position: SINGLE

Single terminal positioning simplifies circuit connections and layout design.

Technical Specifications

Power Field Effect Transistors (FET) STB11N52K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

170 mJ

Minimum DS Breakdown Voltage:

525 V

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.51 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

40 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB11N52K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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