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ST7FOXK1T6TR

STMicroelectronics

ST7FOXK1T6TR by STMicroelectronics

ST7FOXK1T6TR microcontroller from STMicroelectronics features a 5V supply, 32 terminals, and operates in -40 °C to 85°C. It includes a 10-channel ADC and supports I2C connectivity. Ideal for industrial applications requiring low-profile design and efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,507 parts In-Stock

1+ parts

-

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3,507

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Digiode

USA . 3,106 parts In-Stock

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3,106

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Anansix

USA . 2,534 parts In-Stock

1+ parts

-

100+ parts

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2,534

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 4,492 parts In-Stock

1+ parts

$0.990

100+ parts

-

1k+ parts

-

10k+ parts

-

4,492

$0.990

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-

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Microchip USA

USA . 137 parts In-Stock

1+ parts

$5.057

100+ parts

-

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-

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-

137

$5.057

-

-

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AZTECH Wire

Italy . 714 parts In-Stock

1+ parts

$8.800

100+ parts

-

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-

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-

714

$8.800

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Ampacity Inc.

Singapore . 390 parts In-Stock

1+ parts

$33.000

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-

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390

$33.000

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IDEA Electronic Components Group

UK . 961 parts In-Stock

1+ parts

$41.729

100+ parts

-

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$37.556

10k+ parts

-

961

$41.729

-

$37.556

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MKK Technologies

India . 840 parts In-Stock

1+ parts

$78.469

100+ parts

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840

$78.469

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DigiPath Technology Company

USA . 840 parts In-Stock

1+ parts

$78.469

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840

$78.469

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Component Stockers USA

USA . 390 parts In-Stock

1+ parts

$99.990

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390

$99.990

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A-Z Elektronik GmbH

Germany . 13,301 parts In-Stock

1+ parts

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13,301

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QUARKTWIN TECHNOLOGY LTD

USA . 12,862 parts In-Stock

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12,862

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Kepictronics

USA . 6,867 parts In-Stock

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6,867

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Authorized Procurement Solutions

USA . 3,188 parts In-Stock

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3,188

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Parana Technologies

USA . 1,630 parts In-Stock

1+ parts

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$49.894

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1,630

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$49.894

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Corphita

USA . 305 parts In-Stock

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305

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Overview

Unlock endless possibilities with the ST7FOXK1T6TR microcontroller from STMicroelectronics, a trusted name in innovation and quality. Ideal for industrial applications, this compact powerhouse delivers unmatched reliability and versatility, boasting low power consumption and robust performance even in extreme conditions. Elevate your designs with seamless connectivity and advanced features that enhance efficiency, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a lightweight and durable package, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space.

Maximum Supply Voltage: 5.5 V

This allows for flexible power supply options, accommodating a wide range of applications.

Package Shape: SQUARE

The square package shape aids in efficient space usage on PCBs, allowing for more components in a smaller area.

Bit Size: 8

An 8-bit architecture is sufficient for many applications, offering a good balance of performance and simplicity.

Power Supplies (V): 5

A standard 5V supply is commonly available, making integration into existing systems easier.

No. of Terminals: 32

With 32 terminals, this microcontroller offers ample connectivity for various peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design enhances thermal performance and can fit into tight spaces.

Minimum Supply Voltage: 4.5 V

A minimum voltage of 4.5V ensures reliable operation in less demanding power environments.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes it suitable for use in industrial applications.

CPU Family: ST72

Being part of the ST72 family means proven reliability and support in many embedded systems.

Minimum Operating Temperature: -40 °C

This wide temperature range makes the microcontroller ideal for use in extreme environments.

ADC Channels: YES

Integrated ADC channels allow for easy conversion of analog signals to digital, a key feature for many applications.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and helps in better grounding and power distribution.

ROM Words: 4096

4096 ROM words provide decent program memory for application development, enabling complex functionalities.

Maximum Seated Height: 1.6 mm

A low seated height is beneficial for low-profile applications, enhancing overall design flexibility.

Width: 7 mm

A compact width of 7 mm makes it suitable for space-constrained designs.

Peripherals: TIMER(5)

Multiple timer peripherals enhance the usability of the microcontroller for time-based operations.

Maximum Clock Frequency: 16 MHz

A 16 MHz clock frequency provides sufficient processing speed for many embedded applications.

Length: 7 mm

A compact length of 7 mm fits well in miniaturized electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure reliability and performance in varying industrial conditions.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it provides optimized performance for control applications.

RAM Bytes: 384

384 bytes of RAM allows for effective data processing in smaller applications.

Technology: CMOS

CMOS technology provides lower power consumption, enhancing battery life in portable applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly on PCBs.

Analog To Digital Converters: 10-Ch 10-Bit

Ten channel 10-bit ADCs enable precise and multiple simultaneous analog signal conversions.

Maximum Supply Current: 9 mA

A low maximum supply current allows for energy-efficient designs, essential for battery-powered devices.

Nominal Supply Voltage: 5 V

A common nominal supply voltage simplifies design and component selection.

PWM Channels: YES

Support for PWM channels enables effective control of motors and other devices, enhancing versatility.

Connectivity: I2C

I2C connectivity simplifies communication with other ICs, making integration easier.

ROM Programmability: FLASH

Flash programmability allows for easier updates and modifications to the firmware after deployment.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch enhances the component's adaptability for various PCB designs.

Speed: 8 rpm

This operational speed is sufficient for many low-speed applications, allowing for energy-efficient motion control.

On Chip Program ROM Width: 8

An 8-bit ROM width is suitable for many applications requiring moderate program sizes.

No. of I/O Lines: 24

With 24 I/O lines, the microcontroller can interact with multiple peripherals and interfaces efficiently.

Technical Specifications

Microcontrollers ST7FOXK1T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C

Peripherals:

TIMER(5)

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

ST7FOXK1T6TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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