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ST7FMC2R7T6

STMicroelectronics

ST7FMC2R7T6 by STMicroelectronics

ST7FMC2R7T6 microcontroller from STMicroelectronics features a 5V supply, 64 terminals, and operates in -40 °C to 85 °C. It includes 16 ADC channels and supports LIN/SPI connectivity. Ideal for industrial applications requiring reliable performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 8,400 parts In-Stock

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Digiode

USA . 3,166 parts In-Stock

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Anansix

USA . 536 parts In-Stock

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ComSIT Distribution GmbH

Germany . 97 parts In-Stock

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Inventory MP

USA . 13 parts In-Stock

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Bristol Electronics

USA . 13 parts In-Stock

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Vigor

Singapore . 2,159 parts In-Stock

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$7.970

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$7.970

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Microchip USA

USA . 256 parts In-Stock

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$14.807

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AZTECH Wire

Italy . 60 parts In-Stock

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$20.510

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60

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IDEA Electronic Components Group

UK . 2,061 parts In-Stock

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$45.228

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$40.705

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$40.705

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MKK Technologies

India . 1,584 parts In-Stock

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$85.049

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DigiPath Technology Company

USA . 1,584 parts In-Stock

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Component Stockers USA

USA . 422 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 6,672 parts In-Stock

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RC Electronics

USA . 5,870 parts In-Stock

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Futuretech Components

Singapore . 2,065 parts In-Stock

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Corphita

USA . 568 parts In-Stock

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Perfect Parts

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Parana Technologies

USA . 102 parts In-Stock

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$54.077

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$54.077

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Overview

Unlock the potential of your projects with the ST7FMC2R7T6 microcontroller from STMicroelectronics. Renowned for its quality and reliability, STMicroelectronics delivers cutting-edge solutions designed to elevate performance in diverse applications, from industrial automation to consumer electronics. With robust features and exceptional durability, this microcontroller ensures efficient operation even in demanding environments, providing undeniable value and lasting benefits for engineers and developers alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures the microcontroller is resistant to environmental factors, enhancing reliability in various applications.

Surface Mount: YES

Surface mount technology allows for smaller device footprints, making it ideal for compact designs.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage gives flexibility for a range of power supply options.

Package Shape: SQUARE

Square package shapes are often easier to layout on printed circuit boards, maximizing space efficiency.

Bit Size: 8

An 8-bit architecture is well-suited for many control and automation tasks, providing a balance between performance and resource usage.

Power Supplies (V): 5

Operating at a nominal voltage of 5V makes it compatible with many existing systems and components.

No. of Terminals: 64

A higher number of terminals enables more input/output connections, allowing for complex interfacing.

Package Style (Meter): FLATPACK, LOW PROFILE

Low-profile flatpack style helps save vertical space on the PCB, which is advantageous for compact designs.

Minimum Supply Voltage: 3.8 V

The low minimum supply voltage facilitates operation in battery-powered devices, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C makes it suitable for industrial applications where higher temperature tolerance is critical.

CPU Family: ST72

Being part of the well-known ST72 family, it ensures compatibility with a wide range of development tools and support.

Minimum Operating Temperature: -40 °C

The capability to function in extremely low temperatures enables use in harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent corrosion resistance, ensuring long-term reliability in varied environments.

ADC Channels: YES

Inclusion of ADC channels allows for direct sensing of analog signals, facilitating more complex functionality.

Terminal Position: QUAD

Quad terminal position aids in easy and reliable soldering connections on the PCB.

ROM Words: 49152

A generous amount of ROM helps in storing extensive application code, enabling sophisticated programs.

Maximum Seated Height: 1.6 mm

This low seated height is advantageous for applications with strict height limitations.

Width: 14 mm

Compact width aids in fitting the microcontroller into smaller designs without compromising performance.

Peripherals: TIMER(5)

Multiple timers enable precise timing operations, beneficial for various control tasks.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides adequate processing speed for many control applications.

Peak Reflow Temperature °C: 260

This high peak reflow temperature rating ensures compatibility with modern lead-free soldering processes.

Length: 14 mm

Short length facilitates integration into tight spaces and allows for flexible PCB designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees reliability and performance under challenging conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it serves as the central operational unit for a variety of embedded applications.

RAM Bytes: 1536

Adequate RAM allows for smooth multitasking and efficient handling of various data processes.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals are standard for surface-mount applications, ensuring compatibility with most PCB designs.

Analog To Digital Converters: 16-Ch 10-Bit

The presence of 16 channel 10-bit ADCs allows for sampling multiple analog signals, increasing design versatility.

Maximum Supply Current: 18 mA

Low maximum supply current helps in reducing power consumption, making it suitable for energy-efficient applications.

Nominal Supply Voltage: 5 V

Operating at a standard voltage of 5V ensures ease of integration into existing setups.

PWM Channels: YES

PWM channels supporting motor control and signal modulation enhance the microcontroller's applicability.

Connectivity: LIN, SCI, SPI

Multiple communication protocols (LIN, SCI, SPI) provide flexibility in device interfacing and networking.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the firmware, improving adaptability.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is common and facilitates compatibility with various PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate humidity sensitivity, thus suitable precautions should be taken during handling.

Speed: 8 rpm

An 8 rpm speed specification indicates suitability for slow-moving applications requiring precise control.

On Chip Program ROM Width: 8

The 8-bit width for on-chip program ROM supports efficient handling of data and instruction processing.

No. of I/O Lines: 44

Having 44 I/O lines allows for extensive interfacing capabilities for various peripherals and devices.

Technical Specifications

Microcontrollers ST7FMC2R7T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

44

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.6SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1536

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

LIN, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST7FMC2R7T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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