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ST7FLIT19BF1U6

STMicroelectronics

ST7FLIT19BF1U6 by STMicroelectronics

ST7FLIT19BF1U6 microcontroller from STMicroelectronics features a 5V nominal supply, operates in -40 °C to 85 °C range, and includes 7 ADC channels. With 4096 ROM words and 256 RAM bytes, it's ideal for industrial applications requiring compact design. Its quad terminal layout ensures efficient heat dissipation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,000 parts In-Stock

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8,000

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Anansix

USA . 2,521 parts In-Stock

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2,521

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Digiode

USA . 313 parts In-Stock

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313

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Distributors (Availability)

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AZTECH Wire

Italy . 677 parts In-Stock

1+ parts

$11.760

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677

$11.760

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IDEA Electronic Components Group

UK . 351 parts In-Stock

1+ parts

$62.160

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$55.944

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351

$62.160

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$55.944

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MKK Technologies

India . 2,236 parts In-Stock

1+ parts

$116.887

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2,236

$116.887

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DigiPath Technology Company

USA . 2,236 parts In-Stock

1+ parts

$116.887

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2,236

$116.887

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QUARKTWIN TECHNOLOGY LTD

USA . 23,290 parts In-Stock

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23,290

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Microchip USA

USA . 4,433 parts In-Stock

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4,433

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Corphita

USA . 3,094 parts In-Stock

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3,094

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Parana Technologies

USA . 1,365 parts In-Stock

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$74.322

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1,365

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$74.322

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Overview

Transform your designs with the ST7FLIT19BF1U6 microcontroller from STMicroelectronics! Renowned for their quality and innovation, STMicroelectronics offers this high-performance solution that excels in demanding industrial applications. With its compact size and versatile features, including ADC channels and PWM capabilities, it ensures seamless integration and reliability. Experience enhanced efficiency, lower power consumption, and the peace of mind that comes from choosing a trusted leader in the industry. Elevate your next project with ST's commitment to excellence!

Feature Benefit Bullets

Surface Mount: YES

This feature allows for compact designs and automated assembly processes, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

Supports a wide range of power supplies, accommodating various applications and enhancing design flexibility.

Package Shape: SQUARE

Square package shape facilitates efficient PCB layout and optimizes space, which is crucial for modern electronics.

Bit Size: 8

8-bit architecture is suitable for cost-effective applications with moderate processing needs, striking a good balance between performance and price.

No. of Terminals: 20

Provides sufficient I/O lines for a variety of applications while maintaining a compact form factor.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile reduces overall product height, making it ideal for portable and embedded applications.

Minimum Supply Voltage: 3.3 V

Low minimum supply voltage enables operation in battery-powered devices, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

Designed to operate in high-temperature environments, this microcontroller is suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Ability to function in extreme cold climates makes this part ideal for automotive and outdoor applications.

ADC Channels: YES

The presence of ADC channels allows for real-time data acquisition from analog sensors, expanding its application range.

Terminal Position: QUAD

Quad terminal position aids in easier soldering processes and enhances electrical performance.

ROM Words: 4096

Offers ample program memory for complex applications while maintaining efficient code execution.

Maximum Seated Height: 1 mm

Low height is perfect for slim form factor designs, enhancing portability for handheld devices.

Width: 5 mm

Compact width design facilitates easy integration into tight layouts without sacrificing performance.

Data EEPROM Size: 128

Sufficient EEPROM size allows for data storage, making it suitable for applications requiring non-volatile memory.

Peripherals: COMPARATOR, TIMER(5)

Includes essential peripherals for various tasks, saving on component costs and improving design simplicity.

Maximum Clock Frequency: 16 MHz

Provides adequate processing speed for many control applications, ensuring performance without unnecessary power consumption.

Length: 5 mm

Compact length supports efficient design and integration into tight spaces, accommodating modern PCB layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliable performance under harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates a variety of functionalities, reducing component count and complexity in designs.

RAM Bytes: 256

Moderate RAM size fits well for many applications, allowing for efficient temporary data storage during processing.

Technology: CMOS

CMOS technology offers low power consumption, which is critical for battery-operated devices.

Terminal Form: NO LEAD

No lead terminals improve reliability and reduce the chances of mechanical failure during operation.

Analog To Digital Converters: 7-Ch 10-Bit

7-channel ADC allows for multiple sensor inputs, enhancing the capability of the microcontroller in complex applications.

Nominal Supply Voltage: 5 V

Standard supply voltage simplifies power supply design, making it easier to integrate into existing systems.

PWM Channels: YES

PWM capability is ideal for applications involving motor control and signal modulation, increasing its versatility.

Connectivity: SPI

SPI connectivity enables high-speed communication with other devices, enhancing the overall system performance.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming, essential for development and field updates.

Terminal Pitch: 0.8 mm

Smaller terminal pitch contributes to denser designs and is suitable for advanced PCB layout techniques.

Speed: 8 rpm

Moderate speed suitable for many applications, particularly in embedded systems where power efficiency is essential.

On Chip Program ROM Width: 8

8-bit program ROM width allows efficient data handling for various applications while keeping designs simple.

No. of I/O Lines: 17

17 I/O lines provide versatility in interfacing with different peripherals, allowing for complex design implementations.

Technical Specifications

Microcontrollers ST7FLIT19BF1U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V SUPPLY @ 4MHZ

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N20

Length:

5 mm

No. of I/O Lines:

17

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

SPI

Peripherals:

COMPARATOR, TIMER(5)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7FLIT19BF1U6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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