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ST60A2G0C1C7GYO

STMicroelectronics

ST60A2G0C1C7GYO by STMicroelectronics

ST60A2G0C1C7GYO by STMicroelectronics is a telecom interface IC designed for high-speed applications, featuring a data rate of 100 Mbps. It operates within -40 °C to 105 °C and comes in a very thin profile grid array package with 25 terminals. Ideal for compact telecom systems, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,109 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,109

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-

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Vyrian

USA . 3,783 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,783

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Anansix

USA . 1,008 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,008

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 48 parts In-Stock

1+ parts

$11.860

100+ parts

-

1k+ parts

$10.674

10k+ parts

-

48

$11.860

-

$10.674

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MKK Technologies

India . 2,015 parts In-Stock

1+ parts

$22.301

100+ parts

-

1k+ parts

-

10k+ parts

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2,015

$22.301

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DigiPath Technology Company

USA . 2,015 parts In-Stock

1+ parts

$22.301

100+ parts

-

1k+ parts

-

10k+ parts

-

2,015

$22.301

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-

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Corphita

USA . 3,059 parts In-Stock

1+ parts

-

100+ parts

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3,059

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Parana Technologies

USA . 2,299 parts In-Stock

1+ parts

-

100+ parts

$14.180

1k+ parts

-

10k+ parts

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2,299

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$14.180

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-

Authorized Procurement Solutions

USA . 200 parts In-Stock

1+ parts

-

100+ parts

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200

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Overview

Unleash unparalleled connectivity with the ST60A2G0C1C7GYO from STMicroelectronics, a leader in innovative solutions. Designed for telecom interfaces, this compact and robust IC excels in performance, delivering data rates up to 100 Mbps while operating seamlessly in extreme temperatures. Its fine-pitch design ensures easy integration, making it ideal for a variety of applications. Experience the reliability and quality that only STMicroelectronics can provide—empowering your projects with cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and excellent thermal performance, making it suitable for various applications.

Surface Mount: YES

Being surface-mounted allows for a smaller footprint on PCBs, facilitating compact designs and efficient manufacturing.

Package Shape: SQUARE

The square package shape supports efficient space utilization on the circuit board, ideal for high-density applications.

No. of Terminals: 25

With 25 terminals, this IC allows for versatile connectivity options, enhancing its functionality and integration into different systems.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The very thin profile and fine pitch design minimize space requirements while supporting high-density interconnections, crucial for modern telecom systems.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C ensures reliable performance in challenging environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C guarantees functionality in extreme conditions, suitable for outdoor and rugged applications.

Terminal Position: BOTTOM

Bottom terminal positioning aids in better thermal management and efficient routing on the PCB, enhancing overall performance.

Maximum Seated Height: 0.9 mm

A maximum seated height of 0.9 mm contributes to a low-profile design, enabling it to fit into tight spaces in compact electronic devices.

Width: 2.2 mm

The width of 2.2 mm permits integration into space-constrained applications while maintaining a robust connection.

Length: 2.2 mm

The equal length of 2.2 mm supports symmetrical design in PCB layouts, promoting uniformity and ease of assembly.

Terminal Form: BALL

The ball terminal form enhances connection reliability and allows for efficient soldering, reducing production costs and errors.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit IC, it is specifically designed for communication applications, ensuring optimal performance in data transmission.

Nominal Supply Voltage: 1.45 V

A low nominal supply voltage of 1.45 V is energy-efficient, making it suitable for battery-powered devices and helping to reduce power consumption.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm enables high-density mounting, making it ideal for modern circuit boards that require compact layouts.

Data Rate: 100 Mbps

With a data rate of 100 Mbps, this IC supports high-speed data transmission, crucial for maintaining performance in advanced telecom applications.

Technical Specifications

Other Function Telecom Interface ICs ST60A2G0C1C7GYO attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

Additional Features:

also operates with 1.8v supply

Data Rate:

100 Mbps

JESD-30 Code:

S-PBGA-B25

Length:

2.2 mm

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.45 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.2 mm

Trade Compliance

ST60A2G0C1C7GYO Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.6.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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