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SST89E58RD2-40-C-NJE

STMicroelectronics

SST89E58RD2-40-C-NJE by STMicroelectronics

STMicroelectronics SST89E58RD2-40-C-NJE is an 8-bit microcontroller with 32768 ROM words and 1024 RAM bytes. Operating at 40 rpm, it has a supply voltage of 5V and max current of 88mA. Ideal for commercial applications requiring a CPU from the 8051 family in a square chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,982 parts In-Stock

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3,982

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Vyrian

USA . 3,771 parts In-Stock

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3,771

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Chip Stock

USA . 2,930 parts In-Stock

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2,930

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Anansix

USA . 751 parts In-Stock

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751

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LWI Electronics Inc

India . 39 parts In-Stock

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39

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ACDS - Activité Composants Distribution Service

France . 22 parts In-Stock

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22

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 34 parts In-Stock

1+ parts

$78.390

100+ parts

-

1k+ parts

$70.551

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34

$78.390

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$70.551

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MKK Technologies

India . 808 parts In-Stock

1+ parts

$147.408

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808

$147.408

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DigiPath Technology Company

USA . 808 parts In-Stock

1+ parts

$147.408

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808

$147.408

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Corphita

USA . 3,412 parts In-Stock

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3,412

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Perfect Parts

USA . 3,248 parts In-Stock

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3,248

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 851 parts In-Stock

1+ parts

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100+ parts

$93.728

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851

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$93.728

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Microchip USA

USA . 355 parts In-Stock

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355

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Overview

Unleash the power of innovation with the SST89E58RD2-40-C-NJE microcontroller by STMicroelectronics. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability in a wide range of applications. From consumer electronics to industrial automation, this 8-bit marvel delivers seamless functionality and efficiency. Elevate your projects to new heights with the SST89E58RD2-40-C-NJE and experience the superior quality, value, and advantages that only STMicroelectronics can provide. Welcome to a world of endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and good protection for the microcontroller, ensuring reliable performance in various environmental conditions.

Surface Mount: YES

Surface mount feature allows for easy and efficient PCB assembly, saving time and cost in production processes.

Package Shape: SQUARE

Square package shape is easy to handle and mount on PCBs, optimizing space utilization and layout design.

Bit Size: 8

8-bit size is suitable for a wide range of applications, offering a balance between performance and cost efficiency.

Power Supplies (V): 5

5V power supply ensures compatibility with common power sources and simplifies voltage regulation requirements.

No. of Terminals: 44

44 terminals provide flexibility for connecting external components and peripherals, expanding the microcontroller's capabilities.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers enhanced thermal performance and compact size, suitable for space-constrained applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70 °C allows for reliable operation in elevated temperature environments without compromising performance.

CPU Family: 8051

8051 CPU family is well-established and widely supported, offering a comprehensive range of development tools and resources for designers.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0 °C ensures reliable functionality in colder climates or during startup conditions.

Terminal Position: QUAD

Quad terminal position provides easy access for soldering and connection, simplifying installation and maintenance processes.

ROM Words: 32768

32768 ROM words offer sufficient memory capacity for storing program instructions and data, supporting versatile application requirements.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures consistent performance in standard operating ranges, suitable for most commercial and industrial applications.

RAM Bytes: 1024

1024 RAM bytes provide ample working memory for temporary data storage and processing, improving system performance and responsiveness.

Terminal Form: J BEND

J bend terminal form facilitates easy installation and secure soldering connections, enhancing reliability and robustness of the microcontroller.

Maximum Supply Current: 88 mA

Maximum supply current of 88 mA ensures efficient power consumption and prevents overloading, contributing to energy efficiency and component longevity.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V is compatible with many standard power sources, simplifying system integration and power management.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible and secure firmware updates, enabling customization and future-proofing of the microcontroller.

Terminal Pitch: 1.27 mm

1.27mm terminal pitch offers easy soldering and PCB layout compatibility, ensuring reliable electrical connections and signal integrity.

Speed: 40 rpm

40 RPM speed rating meets the processing requirements for a wide range of applications, offering a good balance of performance and efficiency.

Technical Specifications

Microcontrollers SST89E58RD2-40-C-NJE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

8

CPU Family:

8051

JESD-30 Code:

S-PQCC-J44

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

88 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SST89E58RD2-40-C-NJE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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