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SST89E58RD2-40-C-TQJE

STMicroelectronics

SST89E58RD2-40-C-TQJE by STMicroelectronics

STMicroelectronics SST89E58RD2-40-C-TQJE is an 8-bit microcontroller with 32768 ROM words, 1024 RAM bytes, and operates at a speed of 40 rpm. It has a supply voltage of 5V and max operating temperature of 70 °C. Ideal for commercial applications requiring an efficient CPU like in automation systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,928 parts In-Stock

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3,928

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Vyrian

USA . 2,503 parts In-Stock

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2,503

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Anansix

USA . 911 parts In-Stock

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911

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,724 parts In-Stock

1+ parts

$40.072

100+ parts

-

1k+ parts

$36.064

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1,724

$40.072

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$36.064

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MKK Technologies

India . 1,149 parts In-Stock

1+ parts

$75.352

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1,149

$75.352

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DigiPath Technology Company

USA . 1,149 parts In-Stock

1+ parts

$75.352

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1,149

$75.352

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Corphita

USA . 4,833 parts In-Stock

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4,833

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Microchip USA

USA . 356 parts In-Stock

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356

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Kepictronics

USA . 98 parts In-Stock

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98

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Parana Technologies

USA . 41 parts In-Stock

1+ parts

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100+ parts

$47.912

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41

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$47.912

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Overview

Upgrade your electronic designs with the SST89E58RD2-40-C-TQJE microcontroller from STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers reliable and efficient solutions for a wide range of applications. This 8-bit microcontroller offers customers value by providing superior performance, low power consumption, and versatile functionality. Whether you're working on consumer electronics, industrial automation, or automotive systems, this microcontroller is sure to meet your needs and exceed your expectations. Trust STMicroelectronics for cutting-edge technology that drives innovation in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology makes the microcontroller easy to install and saves space on the PCB.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB and easy integration into the overall design.

Bit Size: 8

8-bit architecture allows for efficient processing of data and instructions suitable for a wide range of applications.

Power Supplies (V): 5

Operating at 5V makes this microcontroller compatible with standard power sources, simplifying the design process.

No. of Terminals: 44

Having 44 terminals allows for multiple connections and functionalities to be implemented with ease.

Package Style (Meter): FLATPACK

Flatpack package style offers a low profile and easy integration into compact designs.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70 °C ensures reliable performance in various environmental conditions.

CPU Family: 8051

Being part of the 8051 CPU family provides a proven and reliable architecture for the microcontroller.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0 °C allows for the microcontroller to function in cold environments.

Terminal Position: QUAD

Quad terminal position allows for better connectivity and versatility in the application of the microcontroller.

ROM Words: 32768

With 32,768 ROM words, the microcontroller can store a large amount of program instructions for various functionalities.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that the microcontroller meets the reliability standards for commercial applications.

RAM Bytes: 1024

1,024 RAM bytes provide sufficient memory for data storage and manipulation within the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form makes it easier to solder and connect the microcontroller to the PCB.

Maximum Supply Current: 88 mA

Maximum supply current of 88mA allows for efficient power consumption and extends the battery life in portable devices.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies the power management.

ROM Programmability: FLASH

ROM programmability using flash technology allows for easy updates and modifications to the program code without the need to replace the microcontroller.

Terminal Pitch: 0.8 mm

Terminal pitch of 0.8mm provides sufficient spacing for easy soldering and connections on the PCB.

Speed: 40 rpm

Operating speed of 40 rpm allows for fast processing and response times in real-time applications.

Technical Specifications

Microcontrollers SST89E58RD2-40-C-TQJE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

8

CPU Family:

8051

JESD-30 Code:

S-PQFP-G44

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

88 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

SST89E58RD2-40-C-TQJE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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