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SST89E58RD2-40-I-NJE

STMicroelectronics

SST89E58RD2-40-I-NJE by STMicroelectronics

STMicroelectronics SST89E58RD2-40-I-NJE is an 8-bit microcontroller with 32768 ROM words, 1024 RAM bytes, and operates at a speed of 40 rpm. Ideal for industrial applications, it has a supply voltage of 5V and can handle temperatures ranging from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,793 parts In-Stock

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4,793

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Anansix

USA . 2,604 parts In-Stock

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2,604

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Vyrian

USA . 572 parts In-Stock

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572

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 392 parts In-Stock

1+ parts

$17.456

100+ parts

-

1k+ parts

$15.710

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392

$17.456

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$15.710

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MKK Technologies

India . 156 parts In-Stock

1+ parts

$32.825

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156

$32.825

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DigiPath Technology Company

USA . 156 parts In-Stock

1+ parts

$32.825

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156

$32.825

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Corphita

USA . 2,883 parts In-Stock

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2,883

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QUARKTWIN TECHNOLOGY LTD

USA . 2,309 parts In-Stock

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2,309

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Microchip USA

USA . 415 parts In-Stock

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415

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Parana Technologies

USA . 65 parts In-Stock

1+ parts

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$20.871

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65

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$20.871

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Overview

Experience the power of innovation with the SST89E58RD2-40-I-NJE microcontroller from STMicroelectronics. As a trusted leader in the industry, STMicroelectronics delivers top-quality products that exceed expectations. Perfect for a wide range of applications, this microcontroller provides unmatched performance and reliability. Unlock endless possibilities with the SST89E58RD2-40-I-NJE and discover the value it brings to your projects. Trust STMicroelectronics to deliver cutting-edge technology that empowers you to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides protection to the internal components of the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering of the microcontroller onto a PCB, saving space and making it suitable for compact designs.

Bit Size: 8

The 8-bit architecture allows for simpler programming and control in applications that do not require high computational power.

Power Supplies (V): 5

Operating at a voltage of 5V, this microcontroller is compatible with common power sources, making it easy to integrate into existing systems.

No. of Terminals: 44

Having 44 terminals provides a wide range of connectivity options for interfacing with other components or peripherals, enhancing the flexibility of the microcontroller.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good heat dissipation and compact size, making it suitable for applications where space is limited and thermal management is important.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in harsh environmental conditions where temperature fluctuations are common.

CPU Family: 8051

Belonging to the well-established 8051 CPU family, this microcontroller benefits from a rich ecosystem of development tools, resources, and community support.

RAM Bytes: 1024

With 1024 bytes of RAM, this microcontroller can efficiently handle data storage and processing requirements for a wide range of applications.

ROM Words: 32768

Featuring 32768 ROM words, this microcontroller offers ample memory space for storing program instructions and data, enabling complex functionality and features.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microcontroller meets stringent quality and reliability standards, making it suitable for demanding environments.

ROM Programmability: FLASH

The FLASH programmable ROM allows for easy and convenient reprogramming of the microcontroller, enabling firmware updates and customization without replacing the chip.

Speed: 40 rpm

With a speed of 40 rpm, this microcontroller can efficiently process instructions and data, making it well-suited for real-time control and communication applications.

Technical Specifications

Microcontrollers SST89E58RD2-40-I-NJE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

8

CPU Family:

8051

JESD-30 Code:

S-PQCC-J44

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

88 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SST89E58RD2-40-I-NJE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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