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SST89E54RD-40-C-PIE

STMicroelectronics

SST89E54RD-40-C-PIE by STMicroelectronics

STMicroelectronics SST89E54RD-40-C-PIE is an 8-bit microcontroller with 16384 ROM words and 1024 RAM bytes. Operating at 5V, it has a speed of 40 rpm and max supply current of 88 mA. Ideal for commercial applications requiring a CPU from the 8051 family in temperatures ranging from 0 to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,720 parts In-Stock

1+ parts

-

100+ parts

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3,720

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Vyrian

USA . 3,451 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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3,451

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Anansix

USA . 1,752 parts In-Stock

1+ parts

-

100+ parts

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1,752

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 216 parts In-Stock

1+ parts

$14.217

100+ parts

-

1k+ parts

$12.795

10k+ parts

-

216

$14.217

-

$12.795

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MKK Technologies

India . 747 parts In-Stock

1+ parts

$26.734

100+ parts

-

1k+ parts

-

10k+ parts

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747

$26.734

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-

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DigiPath Technology Company

USA . 747 parts In-Stock

1+ parts

$26.734

100+ parts

-

1k+ parts

-

10k+ parts

-

747

$26.734

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-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

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4,000

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Corphita

USA . 2,083 parts In-Stock

1+ parts

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2,083

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Parana Technologies

USA . 44 parts In-Stock

1+ parts

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100+ parts

$16.998

1k+ parts

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44

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$16.998

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Overview

Unleash the power of innovation with the SST89E54RD-40-C-PIE microcontroller from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality products that are trusted by professionals worldwide. Designed for a wide range of applications, this 8-bit microcontroller offers unmatched performance and reliability. With a focus on value and customer satisfaction, the SST89E54RD-40-C-PIE provides endless possibilities for your next project. Experience the benefits of cutting-edge technology and take your designs to the next level with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan and reliability in various operating conditions.

Bit Size: 8

8-bit microcontrollers are cost-effective and suitable for applications that do not require complex processing, making this product a good choice for simpler projects.

Power Supplies (V): 5

Operating at 5V makes this microcontroller compatible with a wide range of standard power sources, simplifying integration into different systems.

No. of Terminals: 40

Having 40 terminals allows for versatile connections and interfacing with other components, enabling flexibility in design and functionality.

Package Style: IN-LINE

The in-line package style is space-efficient and suitable for applications where size constraints are a concern, making it a good option for compact designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this microcontroller can withstand relatively high temperatures, suitable for industrial and automotive applications.

CPU Family: 8051

The 8051 CPU family is known for its versatility and widespread use, offering a wide range of development tools and resources for programming and support.

ROM Words: 16384

With a ROM size of 16384 words, this microcontroller can store a significant amount of program code or data, allowing for more complex applications and functionality.

RAM Bytes: 1024

Having 1024 bytes of RAM provides sufficient memory for data storage and manipulation, enabling efficient operation and multitasking capabilities.

Maximum Supply Current: 88 mA

The maximum supply current of 88 mA indicates low power consumption, making this microcontroller energy-efficient and suitable for battery-powered applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate this microcontroller into existing systems.

ROM Programmability: FLASH

Being programmable with FLASH memory allows for easy updating and reprogramming of the microcontroller, facilitating development and future enhancements.

Speed: 40 rpm

Operating at a speed of 40 rpm, this microcontroller is suitable for applications that do not require high processing speeds, making it a cost-effective choice for various projects.

Technical Specifications

Microcontrollers SST89E54RD-40-C-PIE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

8

CPU Family:

8051

JESD-30 Code:

R-PDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

88 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SST89E54RD-40-C-PIE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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