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SPC58NG80E5QEC0X

STMicroelectronics

SPC58NG80E5QEC0X by STMicroelectronics

SPC58NG80E5QEC0X from STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 1.26V and operates b/w -40 °C to 125 °C. It features 96 DMA channels, 12 timers, and supports various connectivity options like Ethernet and I2C. Ideal for automotive applications requiring robust performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,604 parts In-Stock

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6,604

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Anansix

USA . 1,937 parts In-Stock

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1,937

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Digiode

USA . 693 parts In-Stock

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693

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Distributors (Availability)

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AZTECH Wire

Italy . 446 parts In-Stock

1+ parts

$10.540

100+ parts

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446

$10.540

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Vigor

Singapore . 4,230 parts In-Stock

1+ parts

$26.360

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-

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4,230

$26.360

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Ampacity Inc.

Singapore . 889 parts In-Stock

1+ parts

$27.000

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-

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889

$27.000

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IDEA Electronic Components Group

UK . 160 parts In-Stock

1+ parts

$28.379

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$25.541

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160

$28.379

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$25.541

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MKK Technologies

India . 22 parts In-Stock

1+ parts

$53.365

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22

$53.365

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DigiPath Technology Company

USA . 22 parts In-Stock

1+ parts

$53.365

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22

$53.365

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Microchip USA

USA . 3,014 parts In-Stock

1+ parts

$69.145

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3,014

$69.145

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Component Stockers USA

USA . 145 parts In-Stock

1+ parts

$419.370

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145

$419.370

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Corphita

USA . 2,447 parts In-Stock

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2,447

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Parana Technologies

USA . 900 parts In-Stock

1+ parts

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$33.932

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900

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$33.932

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Overview

Elevate your automotive projects with the SPC58NG80E5QEC0X microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, this advanced 32-bit MCU seamlessly integrates into various applications, ensuring optimal performance even in extreme temperatures. With robust connectivity options and built-in peripherals, it transforms your designs, enhancing efficiency and innovation. Trust in STMicroelectronics to deliver unparalleled value, empowering you to drive success in every endeavor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for automotive applications.

Surface Mount: YES

Surface mount capability allows for compact designs and ease of automated assembly, which is essential for modern electronic devices.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage contributes to energy efficiency, making it ideal for battery-operated applications.

Screening Level: AEC-Q100

Compliant with AEC-Q100 means this microcontroller meets stringent automotive standards, ensuring reliability in critical applications.

Package Shape: SQUARE

The square shape can simplify the PCB layout design and helps in better thermal management.

Bit Size: 32

A 32-bit architecture allows for efficient processing and handling of complex computations, enhancing overall performance.

No. of Terminals: 144

With 144 terminals, this microcontroller offers plenty of connectivity options for peripherals and other devices.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This versatile package style is suitable for various applications, ensuring efficient heat dissipation and space-saving designs.

Minimum Supply Voltage: 1.14 V

A minimum supply voltage of 1.14 V helps in supporting operation in low-power environments, enhancing the energy-saving capabilities.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in harsh environments, particularly in automotive settings.

CPU Family: SPC58

The SPC58 family is tailored for automotive applications, featuring advanced functionalities and performance optimizations.

Minimum Operating Temperature: -40 °C

This wide temperature range makes the product suitable for extreme environmental conditions, ensuring operation in various climates.

ADC Channels: YES

Integrated ADC channels allow for accurate analog signal measurement, critical for real-time monitoring and control systems.

DMA Channels: YES

Having direct memory access (DMA) channels enhances data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: QUAD

QUAD terminal positioning improves soldering quality and reduces the chances of interconnected failings in complex circuits.

ROM Words: 4194304

Extensive ROM capacity allows for larger programs and more complex algorithms, making it versatile for diverse applications.

Maximum Seated Height: 1.2 mm

A low maximum seated height contributes to a thin profile design, facilitating integration into compact devices.

Width: 20 mm

A standard width enables easy PCB layout design and compatibility with various mounting styles.

Data EEPROM Size: 256K

Ample EEPROM size allows for storage of critical data and configuration settings, essential for dynamic applications.

Peripherals: DMA(96), TIMER(12), RTC, WDT(4)

Multiple integrated peripherals increase functionality, enabling efficient multitasking and precise time management.

Maximum Clock Frequency: 40 MHz

A high clock frequency supports fast processing speeds, enabling real-time system responsiveness.

Length: 20 mm

Standard length ensures compatibility with various configurations and simplifies the PCB design process.

Temperature Grade: AUTOMOTIVE

Automotive temperature grading signifies high reliability and robustness, essential for use in vehicles.

Peripheral IC Type: MICROCONTROLLER

Microcontroller type allows for a vast range of applications from basic tasks to complex control systems.

No. of Timers: 12

Having a multitude of timers enhances capability for scheduling tasks and maintaining accurate timing in applications.

RAM Bytes: 622592

Substantial RAM size supports complex operations and data processing, accommodating advanced software requirements.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, beneficial for energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates reliable soldering and better thermal performance, ensuring robust connections.

Analog To Digital Converters: 5-Ch 12-Bit, 1-Ch 10-Bit

The presence of multiple ADCs enables precise sensor data acquisition, essential for various automotive functions.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V enhances efficiency and compatibility with low-power designs.

No. of DMA Channels: 96

A high count of DMA channels streamlines data handling processes, making the microcontroller more effective in data-intensive applications.

PWM Channels: YES

Integrated PWM channels allow for effective motor control and signal modulation in various applications.

Connectivity: DSPI(10), ETHERNET, I2C, LIN(18)

Diverse connectivity options facilitate integration into complex systems, promoting interoperability with various devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to software, enhancing product adaptability.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables more compact layouts, allowing for high-density designs in modern electronics.

Speed: 180 rpm

An operational speed of 180 rpm gives insight into the performance specs necessary for specific applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient data processing and program storage relative to the microcontroller's bit architecture.

Technical Specifications

Microcontrollers SPC58NG80E5QEC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

SPC58

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of DMA Channels:

96

No. of Terminals:

144

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

622592

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

256K

Connectivity:

DSPI(10), ETHERNET, I2C, LIN(18)

Peripherals:

DMA(96), TIMER(12), RTC, WDT(4)

Analog To Digital Convertors:

5-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58NG80E5QEC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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