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SPC58NE80E7QMHAY

STMicroelectronics

SPC58NE80E7QMHAY by STMicroelectronics

SPC58NE80E7QMHAY by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 40 MHz. Ideal for automotive applications, it features ADC and DMA channels, along with Ethernet, I2C, PSI5, SENT, and SPI connectivity options. With a temperature range of -40 to 125 °C, this CMOS technology-based microcontroller offers 622592 bytes of RAM and 256K data EEPROM size.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,262 parts In-Stock

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12,262

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Digiode

USA . 1,570 parts In-Stock

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1,570

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Anansix

USA . 1,193 parts In-Stock

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1,193

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Ampacity Inc.

Singapore . 486 parts In-Stock

1+ parts

$3.000

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-

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486

$3.000

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AZTECH Wire

Italy . 912 parts In-Stock

1+ parts

$16.850

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912

$16.850

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Vigor

Singapore . 1,928 parts In-Stock

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$28.210

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1,928

$28.210

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IDEA Electronic Components Group

UK . 442 parts In-Stock

1+ parts

$29.199

100+ parts

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$26.279

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442

$29.199

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$26.279

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Corohmni

South Africa . 212 parts In-Stock

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$51.164

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212

$51.164

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MKK Technologies

India . 1,762 parts In-Stock

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$54.907

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1,762

$54.907

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DigiPath Technology Company

USA . 1,762 parts In-Stock

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$54.907

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$54.907

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Microchip USA

USA . 1,562 parts In-Stock

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$75.976

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1,562

$75.976

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Component Stockers USA

USA . 53 parts In-Stock

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$487.100

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53

$487.100

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Argo Parts USA

USA . 5,306 parts In-Stock

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Corphita

USA . 4,237 parts In-Stock

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Continental Prestige Electronics

USA . 2,382 parts In-Stock

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2,382

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Parana Technologies

USA . 1,591 parts In-Stock

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$34.912

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1,591

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$34.912

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Overview

Discover the cutting-edge SPC58NE80E7QMHAY microcontroller by STMicroelectronics, a leader in the industry known for superior quality and reliability. Ideal for automotive applications, this advanced device offers unmatched performance and functionality with its extensive range of peripherals, including DMA, RTC, and multiple timers. With a wide operating temperature range and high clock frequency, this microcontroller provides exceptional value and flexibility for your projects. Trust STMicroelectronics to deliver innovative solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount feature allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.26 V

Operating within a maximum supply voltage of 1.26V ensures safe and reliable performance of the microcontroller.

Screening Level: AEC-Q100; ISO 26262

Compliance with AEC-Q100 and ISO 26262 standards ensures high quality and reliability, making it suitable for automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy placement on the PCB.

Bit Size: 32

32-bit architecture provides faster processing speed and increased efficiency in handling complex computations.

No. of Terminals: 176

176 terminals offer a wide range of connectivity options and interfaces for versatile use in different systems.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Variety of package styles allow for flexibility in design and application, catering to different requirements.

Minimum Supply Voltage: 1.14 V

Operating at a minimum voltage of 1.14V ensures energy efficiency and low power consumption.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliable performance in harsh environments and industrial applications.

Technical Specifications

Microcontrollers SPC58NE80E7QMHAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO AVAILABLE GTM(40 I/P CH, 104 O/P CH), CAN(8)

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

622592

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; ISO 26262

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

256K

Connectivity:

ETHERNET(2), I2C, PSI5(2), SENT(15), SPI(10)

Peripherals:

DMA(96), RTC, TIMER(12), WDT(4)

Analog To Digital Convertors:

6-Ch 16-Bit, 5-Ch 12-Bit, 3-Ch 10-Bit

Trade Compliance

SPC58NE80E7QMHAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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