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SPC58EG80E5PEC0X

STMicroelectronics

SPC58EG80E5PEC0X by STMicroelectronics

SPC58EG80E5PEC0X by STMicroelectronics is a 32-bit microcontroller with 144 terminals, 40 MHz clock frequency, and automotive-grade temperature range. It features 96 DMA channels, 12 timers, and ADC with 5-Ch 12-Bit resolution. Ideal for automotive applications requiring high-speed processing and multiple peripherals like Ethernet and LIN connectivity.

Median Price

$27.335

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 63 parts In-Stock

1+ parts

$27.335

100+ parts

-

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-

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-

63

$27.335

-

-

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Digiode

USA . 3,844 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,844

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-

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Anansix

USA . 2,632 parts In-Stock

1+ parts

-

100+ parts

-

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2,632

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-

-

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Vyrian

USA . 2,609 parts In-Stock

1+ parts

-

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2,609

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 652 parts In-Stock

1+ parts

$14.817

100+ parts

-

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-

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652

$14.817

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Ampacity Inc.

Singapore . 1,610 parts In-Stock

1+ parts

$15.000

100+ parts

-

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-

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-

1,610

$15.000

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Vigor

Singapore . 1,865 parts In-Stock

1+ parts

$24.090

100+ parts

-

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1,865

$24.090

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$27.335

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2,000

$27.335

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IDEA Electronic Components Group

UK . 72 parts In-Stock

1+ parts

$43.628

100+ parts

-

1k+ parts

$39.265

10k+ parts

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72

$43.628

-

$39.265

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Microchip USA

USA . 2,175 parts In-Stock

1+ parts

$63.945

100+ parts

-

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2,175

$63.945

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MKK Technologies

India . 1,265 parts In-Stock

1+ parts

$82.040

100+ parts

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1,265

$82.040

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DigiPath Technology Company

USA . 1,265 parts In-Stock

1+ parts

$82.040

100+ parts

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1,265

$82.040

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Corphita

USA . 2,740 parts In-Stock

1+ parts

-

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2,740

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Parana Technologies

USA . 1,355 parts In-Stock

1+ parts

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100+ parts

$52.164

1k+ parts

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10k+ parts

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1,355

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$52.164

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Overview

Elevate your automotive designs with the SPC58EG80E5PEC0X microcontroller from STMicroelectronics. As a reputable manufacturer in the industry, STMicroelectronics delivers top-tier quality and reliability in their products. This microcontroller is ideal for a wide range of applications, offering customers advanced features such as DMA channels, ADC channels, and PWM channels. With its high performance and automotive grade temperature tolerance, the SPC58EG80E5PEC0X provides unparalleled value and benefits to customers looking to create cutting-edge solutions for the automotive industry. Step up your game with this innovative microcontroller and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures lightweight construction and good resistance to external impacts, making the product durable and reliable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration into circuit boards, saving time and effort during assembly processes.

Maximum Supply Voltage: 1.26 V

A higher maximum supply voltage ensures compatibility with a wide range of power sources, offering flexibility in design and operation.

Screening Level: AEC-Q100

AEC-Q100 screening level certification signifies automotive-grade quality and reliability, making the product suitable for use in automotive applications where stringent standards must be met.

RAM Bytes: 622592

Large RAM capacity enables efficient data processing and storage, allowing the product to handle complex tasks and calculations with speed and accuracy.

Technical Specifications

Microcontrollers SPC58EG80E5PEC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

SPC58

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of DMA Channels:

96

No. of Terminals:

144

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

622592

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

256K

Connectivity:

DSPI(10), ETHERNET, I2C, LIN(18)

Peripherals:

DMA(96), TIMER(12), RTC, WDT(4)

Analog To Digital Convertors:

5-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EG80E5PEC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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