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SPC58EE80E7QMHAY

STMicroelectronics

SPC58EE80E7QMHAY by STMicroelectronics

SPC58EE80E7QMHAY by STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 1.26V and operates b/w -40 °C to 125 °C. It features 176 terminals, supports Ethernet connectivity, and includes advanced peripherals like DMA and ADC channels. Ideal for automotive applications requiring high reliability and performance under stringent conditions.

Median Price

$30.570

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 99 parts In-Stock

1+ parts

$30.570

100+ parts

$20.070

1k+ parts

$18.870

10k+ parts

-

99

$30.570

$20.070

$18.870

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 950 parts In-Stock

1+ parts

$34.029

100+ parts

-

1k+ parts

-

10k+ parts

-

950

$34.029

-

-

-

Vyrian

USA . 5,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,984

-

-

-

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Anansix

USA . 1,777 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,777

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$12.422

100+ parts

$11.304

1k+ parts

$10.186

10k+ parts

-

20

$12.422

$11.304

$10.186

-

Corphita

USA . 1,600 parts In-Stock

1+ parts

$32.238

100+ parts

-

1k+ parts

-

10k+ parts

-

1,600

$32.238

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-

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Vigor

Singapore . 75 parts In-Stock

1+ parts

$35.550

100+ parts

-

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-

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-

75

$35.550

-

-

-

IDEA Electronic Components Group

UK . 1,332 parts In-Stock

1+ parts

$44.205

100+ parts

-

1k+ parts

$39.785

10k+ parts

-

1,332

$44.205

-

$39.785

-

MKK Technologies

India . 1,693 parts In-Stock

1+ parts

$83.125

100+ parts

-

1k+ parts

-

10k+ parts

-

1,693

$83.125

-

-

-

DigiPath Technology Company

USA . 1,693 parts In-Stock

1+ parts

$83.125

100+ parts

-

1k+ parts

-

10k+ parts

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1,693

$83.125

-

-

-

Microchip USA

USA . 1,738 parts In-Stock

1+ parts

$92.506

100+ parts

-

1k+ parts

-

10k+ parts

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1,738

$92.506

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 27,974 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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27,974

-

-

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iodParts Technologies Inc.

India . 400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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400

-

-

-

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Parana Technologies

USA . 89 parts In-Stock

1+ parts

-

100+ parts

$52.854

1k+ parts

-

10k+ parts

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89

-

$52.854

-

-

Overview

Elevate your automotive projects with the SPC58EE80E7QMHAY microcontroller from STMicroelectronics, a leader in high-performance solutions. This robust 32-bit powerhouse ensures reliability under extreme conditions, boasting exceptional temperature resilience and advanced connectivity options. Designed for safety-critical applications, it enhances performance while minimizing power consumption. Experience unparalleled quality and innovation that empowers you to create smarter, safer vehicles.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint, enabling compact designs and efficient manufacturing processes.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage contributes to energy efficiency, making it ideal for battery-operated devices.

Screening Level: AEC-Q100; ISO 26262

Complying with automotive standards ensures reliability and safety in critical automotive applications.

Package Shape: SQUARE

The square package shape facilitates efficient use of board space and improves the thermal dissipation capabilities.

Bit Size: 32

A 32-bit architecture supports advanced computing capabilities, allowing for complex calculations and multitasking.

No. of Terminals: 176

A high number of terminals provides extensive connectivity options for peripherals and external devices.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This package style supports improved thermal management and compact design, suitable for space-constrained applications.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage enhances power efficiency and is beneficial for low-power applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature expands the range of environments in which the microcontroller can operate reliably.

Minimum Operating Temperature: -40 °C

The ability to function in extremely low temperatures makes it suitable for harsh outdoor and automotive environments.

ADC Channels: YES

Having ADC channels allows for real-time analog signal processing, making it versatile for various sensing applications.

DMA Channels: YES

Direct Memory Access capabilities enhance data throughput and efficiency by allowing peripherals to communicate directly with memory.

Terminal Position: QUAD

Quad terminal positioning improves soldering ease and reliability in surface mount applications.

ROM Words: 4194304

A large ROM capacity allows for extensive firmware storage and complex program implementations.

Maximum Seated Height: 1.6 mm

A low seated height contributes to space-saving designs and allows for better integration into compact devices.

Width: 24 mm

A standard width facilitates easier layout and integration with other components on the PCB.

Data EEPROM Size: 256K

An ample EEPROM size enables storage of configuration data and user settings, enhancing product flexibility.

Peripherals: DMA(96), RTC, TIMER(12), WDT(4)

Rich peripherals provide advanced features for timing, data handling, and power management, suitable for complex applications.

Maximum Clock Frequency: 40 MHz

A high clock frequency supports faster processing capabilities, improving overall performance.

Length: 24 mm

A consistent length with width ensures uniform packaging and design compatibility across different devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, this microcontroller guarantees reliability and performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance while keeping power consumption low, making it ideal for performance-sensitive applications.

RAM Bytes: 622592

A substantial RAM capacity supports complex applications and multi-threading capabilities, providing more flexibility in programming.

Technology: CMOS

CMOS technology enhances power efficiency and reduces heat generation, making it beneficial for low-power applications.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and robust mechanical stability, enhancing reliability.

Analog To Digital Converters: 6-Ch 16-Bit, 5-Ch 12-Bit, 3-Ch 10-Bit

Multiple ADC channels with varying resolution options allow for versatile signal acquisition tailored to application needs.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V optimizes energy consumption, making it suitable for low-power designs.

Connectivity: ETHERNET(2), I2C, PSI5(2), SENT(15), SPI(10)

Rich connectivity options provide flexibility for interfacing with various devices, enhancing the microcontroller's versatility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of firmware, promoting longevity of the device.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables high-density PCB layouts, maximizing available board space for additional components.

Speed: 180 rpm

A high operational speed allows for rapid processing and response times, contributing to improved overall system performance.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports a balance of performance and resource efficiency, adapting well to various applications.

Technical Specifications

Microcontrollers SPC58EE80E7QMHAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO AVAILABLE GTM(40 I/P CH, 104 O/P CH), CAN(8)

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

622592

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; ISO 26262

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

256K

Connectivity:

ETHERNET(2), I2C, PSI5(2), SENT(15), SPI(10)

Peripherals:

DMA(96), RTC, TIMER(12), WDT(4)

Analog To Digital Convertors:

6-Ch 16-Bit, 5-Ch 12-Bit, 3-Ch 10-Bit

Trade Compliance

SPC58EE80E7QMHAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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