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SPC58EC80E7QMC1Y

STMicroelectronics

SPC58EC80E7QMC1Y by STMicroelectronics

SPC58EC80E7QMC1Y from STMicroelectronics is a 32-bit microcontroller ideal for automotive applications, featuring AEC-Q100 screening. It supports up to 40 MHz clock speed, has integrated cache, and offers extensive connectivity options like Ethernet and FlexRay. With a wide operating temp range (-40 °C to 125 °C) and low power modes, it's perfect for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,370 parts In-Stock

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11,370

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Digiode

USA . 4,613 parts In-Stock

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4,613

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Anansix

USA . 986 parts In-Stock

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986

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Distributors (Availability)

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AZTECH Wire

Italy . 1,153 parts In-Stock

1+ parts

$18.340

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1,153

$18.340

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IDEA Electronic Components Group

UK . 367 parts In-Stock

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$20.754

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$18.679

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367

$20.754

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$18.679

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MKK Technologies

India . 2,269 parts In-Stock

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$39.027

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2,269

$39.027

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DigiPath Technology Company

USA . 2,269 parts In-Stock

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$39.027

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2,269

$39.027

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Microchip USA

USA . 1,838 parts In-Stock

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$58.149

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1,838

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Component Stockers USA

USA . 241 parts In-Stock

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$319.370

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241

$319.370

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Parana Technologies

USA . 1,879 parts In-Stock

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$24.815

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$24.815

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Corphita

USA . 1,332 parts In-Stock

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1,332

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Overview

Elevate your projects with the SPC58EC80E7QMC1Y microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for high-performance applications, this 32-bit powerhouse combines reliability with efficiency, boasting AEC-Q100 certification for automotive excellence. Its versatile connectivity options and integrated peripherals empower developers to create smarter, more responsive devices while ensuring optimal power management. Experience unparalleled quality and support, backed by ST's commitment to excellence, and unlock new possibilities in your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, allowing for quicker access to frequently used data.

Surface Mount: YES

Surface mount technology minimizes space requirements and enables automated assembly, which is ideal for compact designs.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage contributes to energy efficiency, making it a good choice for battery-powered and low-power applications.

On Chip Data RAM Width: 8

With an 8-bit RAM width, it allows for efficient data handling in microcontroller applications.

Screening Level: AEC-Q100

The AEC-Q100 screening level indicates reliability and suitability for automotive applications, ensuring performance under harsh conditions.

Package Shape: SQUARE

The square package shape optimizes PCB space and makes it easier for designers to integrate into compact layouts.

Bit Size: 32

A 32-bit architecture enables better performance and supports more complex computations and larger data sets.

No. of Terminals: 176

Having 176 terminals provides ample connectivity options for various peripherals and functionalities.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This package style facilitates efficient heat dissipation and allows flexible board design options.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage allows for wider application potential in low-power environments.

Maximum Operating Temperature: 125 °C

High operating temperature limits enable use in demanding environments, suitable for industrial applications.

CPU Family: E200Z4

The E200Z4 CPU family is designed for efficient performance, ideal for controlling various tasks in embedded systems.

Minimum Operating Temperature: -40 °C

The ability to operate at a low minimum temperature makes it suitable for extreme environments, such as outdoor or automotive applications.

ADC Channels: YES

Integrated analog-to-digital conversion channels enhance the microcontroller's ability to process analog signals.

DMA Channels: YES

Direct Memory Access (DMA) support improves data transfer efficiency and frees up CPU time for other tasks.

Terminal Position: QUAD

Quad terminal positioning facilitates better connectivity and ease of soldering on PCBs.

ROM Words: 4194304

A large ROM space allows for extensive firmware or application storage, maximizing the functionality of the microcontroller.

Maximum Seated Height: 1.6 mm

A low seated height is beneficial for space-constrained designs and thin form factors.

Width: 24 mm

Standard width allows for compatibility with numerous PCB designs and layouts.

Data EEPROM Size: 128K

A sizable EEPROM provides ample non-volatile storage for user settings and important data retention.

Boundary Scan: YES

Boundary scan support simplifies testing and debugging of circuit boards during development.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals enhances functionality for real-time applications and system automation.

Maximum Clock Frequency: 40 MHz

A high clock frequency ensures faster processing speeds, beneficial for time-sensitive applications.

Length: 24 mm

Moderate length allows for a balanced design suitable for various applications without compromising performance.

Peripheral IC Type: MICROCONTROLLER, RISC

This type ensures efficient processing and lower power consumption, ideal for embedded systems.

No. of Timers: 12

Multiple timers provide versatile timing functions necessary for various applications such as motor control and event scheduling.

RAM Bytes: 393216

An adequate amount of RAM supports complex applications by allowing for more operational data and program execution.

Technology: CMOS

CMOS technology supports low power consumption and high performance, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal forms are a reliable choice for surface mount technology, ensuring strong solder joints.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADCs are essential for accurate analog signal processing, enhancing the microcontroller's capabilities.

Maximum Supply Current: 50 mA

Low current consumption enhances the energy efficiency of the device, suitable for portable applications.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V supports effective power management in low-power designs.

No. of DMA Channels: 64

With 64 DMA channels, this microcontroller can efficiently handle numerous data transfer operations simultaneously.

No. of Serial I/Os: 18

Having 18 serial I/O channels provides versatile interfacing options for communication with external devices.

PWM Channels: YES

Support for Pulse Width Modulation (PWM) enables control of motors and other devices, ideal for automation projects.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Broad connectivity options increase versatility in application design, making it suitable for communication-intensive tasks.

ROM Programmability: FLASH

Flash programmability allows for easy field updates and flexibility in applications that require software modifications.

Terminal Pitch: 0.5 mm

A fine terminal pitch permits high-density board designs, maximizing the number of connections in compact PCB layouts.

Format: FLOATING POINT

Floating-point format enhances computational capabilities, crucial for applications requiring precise calculations.

Speed: 180 rpm

A speed capability of 180 rpm makes this microcontroller suitable for applications involving motors or rotating systems.

Low Power Mode: YES

Low power mode capabilities extend battery life and enhance energy efficiency for portable applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides compatibility with various programming tasks and enhances speed in data processing.

Technical Specifications

Microcontrollers SPC58EC80E7QMC1Y attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E7QMC1Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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