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SPC58EC80E7G0C0X

STMicroelectronics

SPC58EC80E7G0C0X by STMicroelectronics

SPC58EC80E7G0C0X microcontroller from STMicroelectronics features a 32-bit E200Z4 CPU, operates at a max of 1.26V, and includes integrated cache for efficient processing. With AEC-Q100 screening, it's ideal for automotive applications. It supports multiple connectivity options like CAN and UART.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,440 parts In-Stock

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Digiode

USA . 3,226 parts In-Stock

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Anansix

USA . 2,199 parts In-Stock

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2,199

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Distributors (Availability)

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AZTECH Wire

Italy . 605 parts In-Stock

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$14.900

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605

$14.900

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Advanced Electronics

New Zealand . 81 parts In-Stock

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$51.755

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$47.097

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$42.439

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-

81

$51.755

$47.097

$42.439

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IDEA Electronic Components Group

UK . 1,745 parts In-Stock

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$52.616

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$47.354

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1,745

$52.616

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$47.354

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MKK Technologies

India . 142 parts In-Stock

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$98.940

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142

$98.940

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DigiPath Technology Company

USA . 142 parts In-Stock

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$98.940

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142

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Component Stockers USA

USA . 789 parts In-Stock

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$99.990

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789

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 13,035 parts In-Stock

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Vigor

Singapore . 6,802 parts In-Stock

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Microchip USA

USA . 5,582 parts In-Stock

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Corphita

USA . 4,830 parts In-Stock

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Parana Technologies

USA . 657 parts In-Stock

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$62.910

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$62.910

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Overview

Unlock the power of innovation with the SPC58EC80E7G0C0X microcontroller from STMicroelectronics, a leader in high-performance solutions. This robust 32-bit processor excels in automotive applications, delivering unparalleled reliability and efficiency even in extreme conditions. With advanced features like integrated cache, multiple communication interfaces, and low-power modes, it empowers your designs to meet evolving demands while maximizing performance and longevity. Experience superior quality and support that only ST can provide, ensuring your projects thrive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing durable materials ensures longevity and reliability, making it suitable for various applications.

Integrated Cache: YES

Integrated cache reduces memory access time, enhancing overall processing speed, which is critical for high-performance applications.

Surface Mount: YES

Surface mount technology offers smaller size and improved performance, allowing for compact designs.

Maximum Supply Voltage: 1.26 V

Low maximum voltage contributes to energy efficiency, making it ideal for battery-powered devices.

On Chip Data RAM Width: 8

An 8-bit RAM width supports efficient data handling, suitable for a variety of moderate workload tasks.

Screening Level: AEC-Q100

AEC-Q100 certification indicates high reliability and suitability for automotive applications, enhancing market trust.

Package Shape: SQUARE

Square package shape allows for improved PCB layout and component placement flexibility, optimizing design.

Bit Size: 32

A 32-bit architecture allows for more complex computations and better performance in processing tasks.

No. of Terminals: 176

A higher number of terminals allows for extensive connectivity options, supporting multiple peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This packaging style facilitates effective heat dissipation and easy integration into compact designs.

Minimum Supply Voltage: 1.14 V

Very low supply voltage helps extend battery life in portable devices, making it suitable for energy-sensitive applications.

Maximum Operating Temperature: 105 °C

High temperature tolerance ensures reliable operation in harsh environments, such as automotive and industrial applications.

CPU Family: E200Z4

The E200Z4 family provides optimized performance for embedded applications, ensuring efficiency.

Minimum Operating Temperature: -40 °C

Wide temperature range enables use in extreme environments, expanding application potential.

ADC Channels: YES

Integrated ADC channels support high-precision data acquisition, essential for sensor-based applications.

DMA Channels: YES

DMA support enhances data transfer efficiency, reducing CPU load and improving system performance.

Terminal Position: QUAD

Quad terminal positioning allows for effective routing on PCBs, simplifying design layout.

ROM Words: 4194304

Large ROM capacity supports complex firmware and applications, enabling advanced functionalities.

Maximum Seated Height: 1.6 mm

Low profile design aids in space-efficient applications, making it suitable for compact devices.

Width: 24 mm

Compact width allows for efficient integration into tight spaces on PCBs, promoting flexible design options.

Data EEPROM Size: 128K

Adequate EEPROM size provides ample storage for user data and configuration settings, enhancing usability.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging, ensuring product reliability during manufacturing.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Diverse peripheral options enable a variety of application scenarios, making the product versatile for different use cases.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency supports fast processing speeds for demanding applications, enhancing efficiency.

Length: 24 mm

Similar to its width, the length contributes to a compact form factor, beneficial for space-constrained designs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient processing with fewer cycles per instruction, leading to faster operation.

No. of Timers: 12

A variety of timers allows for advanced timing functions, enhancing control over tasks and processes in applications.

RAM Bytes: 393216

Ample RAM size supports more complex operations and multitasking capabilities, improving overall system performance.

Technology: CMOS

CMOS technology promotes low power consumption and high performance, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide reliable connections, improving manufacturability.

Analog To Digital Convertors: 4-Ch 12-Bit, 1-Ch 10-Bit

Multi-channel ADCs ensure high-resolution data acquisition, which is critical for many sensor applications.

Maximum Supply Current: 50 mA

Low supply current aids in energy efficiency, making it suitable for applications prioritizing battery longevity.

Nominal Supply Voltage: 1.2 V

A nominal operating voltage contributes to overall energy efficiency, ideal for low-power applications.

No. of DMA Channels: 64

A significant number of DMA channels allows for multiple simultaneous data transfers, enhancing overall system efficiency.

No. of Serial I/Os: 26

26 serial I/O lines provide extensive connectivity options, allowing for integration with multiple devices.

PWM Channels: YES

Support for PWM channels enables smooth control of motors and LED dimming, expanding application versatility.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Diverse connectivity options support various communication protocols, making the product versatile for different systems.

ROM Programmability: FLASH

Flash memory allows for easy updates to firmware, enhancing long-term adaptability and usability of the device.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for dense component packing, making it suitable for high-performance space-constrained applications.

Format: FLOATING POINT

Floating-point support enhances the ability to perform complex mathematical calculations, essential in advanced applications.

Speed: 180 rpm

The speed rating indicates potential applications in control systems, including motors and actuators, providing versatility.

Low Power Mode: YES

Low power mode capability extends battery life in portable applications, making it energy-efficient for prolonged use.

On Chip Program ROM Width: 8

An 8-bit program ROM width ensures compatibility with various instruction sets, providing flexibility in software development.

Technical Specifications

Microcontrollers SPC58EC80E7G0C0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E7G0C0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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