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SPC58EC80E7G0C1X

STMicroelectronics

SPC58EC80E7G0C1X by STMicroelectronics

SPC58EC80E7G0C1X by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 40 MHz, supporting AEC-Q100 screening for automotive applications. It features integrated cache and up to 64 DMA channels for efficient data handling. With a wide operating temp range (-40 °C to 105 °C), it's ideal for robust automotive systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,822 parts In-Stock

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11,822

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Digiode

USA . 663 parts In-Stock

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663

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Anansix

USA . 523 parts In-Stock

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523

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Distributors (Availability)

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AZTECH Wire

Italy . 864 parts In-Stock

1+ parts

$13.530

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864

$13.530

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IDEA Electronic Components Group

UK . 2,178 parts In-Stock

1+ parts

$23.611

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$21.250

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2,178

$23.611

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$21.250

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MKK Technologies

India . 1,200 parts In-Stock

1+ parts

$44.399

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1,200

$44.399

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DigiPath Technology Company

USA . 1,200 parts In-Stock

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$44.399

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1,200

$44.399

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Microchip USA

USA . 1,792 parts In-Stock

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$51.310

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1,792

$51.310

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Corphita

USA . 4,276 parts In-Stock

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4,276

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Parana Technologies

USA . 1,480 parts In-Stock

1+ parts

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$28.230

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1,480

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$28.230

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Overview

Elevate your designs with the SPC58EC80E7G0C1X microcontroller from STMicroelectronics, a leader in cutting-edge technology. This versatile powerhouse thrives in diverse applications, offering exceptional reliability and performance. With its AEC-Q100 screening level, it’s ideal for automotive solutions, ensuring quality and longevity under extreme conditions. Enjoy benefits like low power consumption, integrated peripherals, and robust connectivity options, making it a smart choice for innovators seeking excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliability and longevity in various applications.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, making it suitable for demanding tasks.

Surface Mount: YES

Provides reduced footprint and allows for high-density assembly, ideal for compact electronic designs.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage contributes to energy efficiency, making it suitable for battery-powered devices.

On Chip Data RAM Width: 8

8-bit RAM width allows for efficient data processing and storage in various applications.

Screening Level: AEC-Q100

Compliance with automotive standards ensures reliability in automotive and industrial environments.

Package Shape: SQUARE

Square package shape facilitates easier PCB design and placement, enhancing manufacturing efficiency.

Bit Size: 32

32-bit architecture enables handling of larger data sets and complex calculations, suitable for advanced applications.

No. of Terminals: 176

Ample terminals provide extensive connectivity options, accommodating complex interfacing needs.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Low-profile design supports modern compact electronics, with heat sink integration enhancing thermal management.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage supports operation in low-power applications, contributing to overall energy savings.

Maximum Operating Temperature: 105 °C

High temperature tolerance makes it suitable for harsh environments, enhancing versatility and reliability.

CPU Family: E200Z4

The E200Z4 family offers proven performance, making it ideal for a range of embedded applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for reliable performance in extreme conditions.

ADC Channels: YES

Integrated ADC channels enhance data acquisition capabilities, making it ideal for sensor-based applications.

DMA Channels: YES

Support for DMA improves data transfer efficiency, offloading the CPU and allowing for faster operations.

Terminal Position: QUAD

Quad terminal positioning aids in effective thermal management and signal integrity.

ROM Words: 4194304

Large ROM capacity allows for complex firmware and application storage, enhancing functionality.

Maximum Seated Height: 1.6 mm

Low seated height promotes compact design, suitable for space-constrained applications.

Width: 24 mm

Standard width complements a variety of PCB designs and layouts, enhancing compatibility.

Data EEPROM Size: 128K

Generous EEPROM size facilitates data retention capabilities for configurations and settings.

Boundary Scan: YES

Boundary scan support enhances testability and reliability in manufacturing processes.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Extensive peripheral support enhances versatility, allowing integration of various functions in a single device.

Maximum Clock Frequency: 40 MHz

High clock frequency ensures fast processing speeds for demanding applications.

Length: 24 mm

Standard length adds to flexibility in PCB design, promoting easy integration.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers power efficiency and performance, making it suitable for a wide range of applications.

No. of Timers: 12

Multiple timers allow for complex time-based operations, enhancing performance in real-time applications.

RAM Bytes: 393216

Substantial RAM enables efficient handling of multiple tasks and improves application performance.

Technology: CMOS

CMOS technology ensures low power consumption and is suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and improve mechanical stability.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADC capabilities facilitate accurate measurement and data conversion, vital for sensor applications.

Maximum Supply Current: 50 mA

Low supply current ensures compatibility with energy-efficient designs and prolongs battery life.

Nominal Supply Voltage: 1.2 V

The nominal voltage aligns with modern low-power requirements, enhancing energy efficiency.

No. of DMA Channels: 64

66 DMA channels significantly improve data transfer rates while freeing up the CPU for other tasks.

No. of Serial I/Os: 26

Multiple serial I/O channels support extensive connectivity, making it suitable for diverse applications.

PWM Channels: YES

PWM support facilitates motor control and LED dimming applications, enhancing versatility.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Diverse connectivity options open up possibilities for communication with various devices, enhancing integration.

ROM Programmability: FLASH

Flash memory allows for easy updates and modifications, increasing the adaptability of the microcontroller.

Terminal Pitch: 0.5 mm

Fine pitch terminals provide more surface area for soldering, supporting more compact layouts.

Format: FLOATING POINT

Floating point format enhances mathematical computations, beneficial for complex algorithms.

Speed: 180 rpm

An efficient speed rating supports various applications, particularly in robotics and automation.

Low Power Mode: YES

Low power mode extends battery life and promotes energy savings in portable devices.

On Chip Program ROM Width: 8

8-bit ROM width supports a wide array of applications, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers SPC58EC80E7G0C1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E7G0C1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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