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SPC58EC80E3QMC0X

STMicroelectronics

SPC58EC80E3QMC0X by STMicroelectronics

SPC58EC80E3QMC0X from STMicroelectronics is a 32-bit microcontroller ideal for automotive applications, featuring AEC-Q100 screening. It supports up to 40 MHz clock speed, has integrated cache, and offers extensive connectivity options like Ethernet and FlexRay. With a wide temperature range (-40 °C to 125 °C) and low power consumption (1.2V nominal), it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,414 parts In-Stock

1+ parts

-

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9,414

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Digiode

USA . 2,710 parts In-Stock

1+ parts

-

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2,710

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Anansix

USA . 303 parts In-Stock

1+ parts

-

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303

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,149 parts In-Stock

1+ parts

$16.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,149

$16.800

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Vigor

Singapore . 4,287 parts In-Stock

1+ parts

$18.690

100+ parts

-

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-

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-

4,287

$18.690

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IDEA Electronic Components Group

UK . 286 parts In-Stock

1+ parts

$20.230

100+ parts

-

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$18.207

10k+ parts

-

286

$20.230

-

$18.207

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Microchip USA

USA . 136 parts In-Stock

1+ parts

$25.657

100+ parts

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136

$25.657

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MKK Technologies

India . 1,071 parts In-Stock

1+ parts

$38.041

100+ parts

-

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1,071

$38.041

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DigiPath Technology Company

USA . 1,071 parts In-Stock

1+ parts

$38.041

100+ parts

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1,071

$38.041

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BidChips

USA . 138,000 parts In-Stock

1+ parts

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$13.880

10k+ parts

$13.880

138,000

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$13.880

$13.880

Corphita

USA . 4,475 parts In-Stock

1+ parts

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4,475

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Parana Technologies

USA . 1,287 parts In-Stock

1+ parts

-

100+ parts

$24.188

1k+ parts

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10k+ parts

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1,287

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$24.188

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Overview

Elevate your projects with the SPC58EC80E3QMC0X microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for automotive applications, this robust MCU offers exceptional performance and reliability under extreme conditions, ensuring your designs exceed expectations. Benefit from advanced connectivity options and integrated features that enhance efficiency while minimizing power consumption, making it the perfect choice for cutting-edge solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durability and lightweight characteristics of plastic/epoxy make this microcontroller suitable for a wide range of applications.

Integrated Cache: YES

Having integrated cache improves performance and efficiency, allowing for faster data retrieval.

Surface Mount: YES

Surface mount technology enables compact design and easy integration into advanced PCB layouts.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage ensures energy efficiency, making it ideal for battery-powered applications.

On Chip Data RAM Width: 8

An 8-bit RAM width allows for efficient data handling in various microcontroller tasks.

Screening Level: AEC-Q100

This screening level indicates reliability and suitability for automotive applications, enhancing marketability.

Package Shape: SQUARE

The square package shape maximizes space efficiency on PCBs.

Bit Size: 32

A 32-bit architecture supports advanced computing tasks and larger data manipulation.

No. of Terminals: 100

A high number of terminals allows for versatile connectivity options and extensive interfacing capabilities.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The flatpack design optimized for thermal management and compact PCB utilization is ideal for high-performance applications.

Minimum Supply Voltage: 1.14 V

Only requiring 1.14 V minimizes power consumption while maintaining performance.

Maximum Operating Temperature: 125 C

This high-temperature rating allows the microcontroller to function in demanding environments.

CPU Family: E200Z4

The E200Z4 family supports enhanced performance and optimizations for embedded applications.

Minimum Operating Temperature: -40 C

With a wide temperature range, this microcontroller performs reliably in extreme conditions.

ADC Channels: YES

Integrated ADC channels provide advanced analog interfacing solutions for sensor applications.

DMA Channels: YES

DMA capabilities significantly enhance data transfer efficiency, relieving CPU workload.

Terminal Position: QUAD

Quad terminal positions ensure ease of access for connections and signal integrity.

ROM Words: 4194304

A large ROM size supports extensive firmware and application development.

Maximum Seated Height: 1.2 mm

A low height profile is suitable for space-constrained designs, contributing to miniaturization.

Width: 14 mm

A compact width aligns with modern equipment design needs to save space.

Data EEPROM Size: 128K

Ample EEPROM storage enables efficient data logging and backup functionalities.

Boundary Scan: YES

Boundary scan support allows for better testing and debugging, enhancing reliability.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

An extensive set of peripherals increases functional versatility, catering to multiple application scenarios.

Maximum Clock Frequency: 40 MHz

A high clock frequency enables the microcontroller to handle demanding processing tasks efficiently.

Length: 14 mm

With a standard length, this microcontroller fits well within typical configurations for ease of use.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller promotes efficiency and speed in processing applications.

No. of Timers: 12

A large number of timers allows for precise timing operations and multitasking capabilities.

RAM Bytes: 393216

Substantial RAM space enables complex applications and multitasking in embedded systems.

Technology: CMOS

CMOS technology ensures low power consumption and high integration density, enhancing device performance.

Terminal Form: GULL WING

Gull wing terminals offer stability during soldering processes, ensuring reliable connectivity.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple ADC channels with high resolution allow for precise analog signal processing.

Maximum Supply Current: 50 mA

A low maximum supply current contributes to energy efficiency and prolongs battery life in portable devices.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures optimal energy consumption while providing adequate performance.

No. of DMA Channels: 64

A high number of DMA channels allows for concurrent data transfers, improving overall throughput.

No. of Serial I/Os: 18

Eighteen serial I/Os provide abundant interfacing options for multiple peripheral connections.

PWM Channels: YES

PWM support allows for control of motors and other devices, enhancing application versatility.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Rich connectivity options facilitate communication with a variety of devices and networks.

ROM Programmability: FLASH

Flash programmability enables easy updates and flexibility in application development.

Terminal Pitch: 0.5 mm

A fine terminal pitch is compatible with modern compact PCBs, promoting integration in advanced products.

Format: FLOATING POINT

Floating point capabilities provide improved accuracy in mathematical calculations and data processing.

Speed: 180 rpm

Operating at this speed supports applications requiring efficient processing and response times.

Low Power Mode: YES

Low power mode enhances energy efficiency, making it suitable for battery-powered applications.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for efficient program execution and memory usage.

Technical Specifications

Microcontrollers SPC58EC80E3QMC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC80E3QMC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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