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SPC58EC74E7P000X

STMicroelectronics

SPC58EC74E7P000X by STMicroelectronics

SPC58EC74E7P000X microcontroller by STMicroelectronics features a 32-bit E200Z4 CPU, operates at 1.14-1.26V, and supports up to 40MHz clock speed. With integrated DMA channels and AEC-Q100 screening, it's ideal for automotive applications. Its compact design includes 176 terminals in a low-profile package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 10,760 parts In-Stock

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Digiode

USA . 4,937 parts In-Stock

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Anansix

USA . 1,266 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 342 parts In-Stock

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$21.610

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342

$21.610

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IDEA Electronic Components Group

UK . 707 parts In-Stock

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$72.571

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$65.313

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707

$72.571

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$65.313

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MKK Technologies

India . 2,226 parts In-Stock

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$136.464

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2,226

$136.464

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DigiPath Technology Company

USA . 2,226 parts In-Stock

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$136.464

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$136.464

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QUARKTWIN TECHNOLOGY LTD

USA . 28,119 parts In-Stock

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Microchip USA

USA . 4,225 parts In-Stock

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Vigor

Singapore . 1,545 parts In-Stock

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Corphita

USA . 1,370 parts In-Stock

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Parana Technologies

USA . 155 parts In-Stock

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$86.769

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Overview

Elevate your automotive and industrial projects with the SPC58EC74E7P000X microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for optimal performance even in extreme environments, this 32-bit powerhouse delivers exceptional reliability and efficiency. With advanced features like integrated cache and robust connectivity options, it empowers developers to create cutting-edge applications while benefiting from ST's renowned commitment to excellence and support. Unlock unparalleled value and performance today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures environmental resistance and longevity, making it a reliable choice for various applications.

Integrated Cache: YES

With integrated cache, the microcontroller can process data faster, enhancing performance for time-sensitive applications.

Surface Mount: YES

The surface mount design allows for efficient PCB space utilization and easier assembly, making it suitable for modern compact devices.

Maximum Supply Voltage: 1.26 V

This low maximum supply voltage is advantageous for battery-operated systems, ensuring energy efficiency.

On Chip Data RAM Width: 8

The 8-bit wide RAM supports efficient data manipulation, crucial for the performance of embedded systems.

Screening Level: AEC-Q100

Meeting AEC-Q100 standards guarantees reliability in automotive applications, a significant advantage in the automotive industry.

Package Shape: SQUARE

The square package shape facilitates efficient PCB layout and thermal management, optimizing the product's performance.

Bit Size: 32

A 32-bit architecture allows for more complex calculations and processing capabilities, making it powerful for advanced applications.

No. of Terminals: 176

With 176 terminals, the microcontroller supports a wide range of peripherals, enhancing its versatility in various applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This packaging style ensures efficient heat dissipation and low-profile design, making it ideal for compact electronic assemblies.

Minimum Supply Voltage: 1.14 V

A minimum supply voltage of 1.14 V allows for low-power operations, crucial for power-sensitive applications.

Maximum Operating Temperature: 125 °C

Withstanding high temperatures makes this microcontroller suitable for high-performance applications in demanding environments.

CPU Family: E200Z4

The E200Z4 CPU family is optimized for low-power consumption and high performance, making it a smart choice for embedded systems.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme conditions, suitable for industrial and automotive applications.

ADC Channels: YES

The presence of ADC channels allows for real-time data acquisition from analog sensors, enhancing the microcontroller's application range.

DMA Channels: YES

DMA channels support efficient data transfers, freeing up CPU resources for critical tasks and improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning offers better grounding and signal integrity, vital for high-speed applications.

ROM Words: 3145728

A larger ROM allows for extensive program storage, making it suitable for complex applications and advanced functionalities.

Maximum Seated Height: 1.6 mm

The low height facilitates easy integration into compact designs, allowing for more design flexibility.

Width: 24 mm

A width of 24 mm makes it easy to fit into various PCB layouts, ensuring compatibility with existing designs.

Data EEPROM Size: 128K

With 128K of data EEPROM, this product can retain configuration data and critical information even after power loss.

Boundary Scan: YES

Boundary scan capability simplifies debugging and testing processes, reducing time and costs in product development.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals enhances the microcontroller's functionality, making it adaptable for a wide range of applications.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz enables fast processing and execution of tasks, beneficial for performance-critical applications.

Length: 24 mm

The 24 mm length allows for compact integration into devices, making it suitable for space-constrained designs.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it delivers high efficiency and performance for applications requiring fast processing.

No. of Timers: 12

Multiple timers allow for various time-based operations, enabling multitasking capabilities in complex applications.

RAM Bytes: 393216

The substantial RAM capacity supports complex data handling, making it effective for applications with intensive data processing.

Technology: CMOS

CMOS technology offers lower power consumption and higher density, making it suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals provide ease of handling and soldering, facilitating faster assembly and manufacturing processes.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

The combination of multiple ADC channels with varying resolutions allows for versatile sensor integration and accurate data acquisition.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA ensures efficiency in low-power applications, extending battery life in portable devices.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V is optimal for power-efficient designs, reducing overall energy consumption.

No. of DMA Channels: 64

Having 64 DMA channels maximizes data transfer capabilities, optimizing performance for data-heavy applications.

No. of Serial I/Os: 26

The 26 serial I/O lines offer extensive connectivity options for interfacing with various peripherals and components.

PWM Channels: YES

The presence of PWM channels enables precise control of motor speed and brightness in various applications, enhancing functionality.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Diverse connectivity options ensure compatibility with a wide range of devices and peripherals, increasing design flexibility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, making the microcontroller adaptable for evolving applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for denser packaging and more connections in a limited space, beneficial for compact designs.

Format: FLOATING POINT

Support for floating-point arithmetic enhances the capability to handle complex mathematical computations, crucial for advanced algorithms.

Speed: 160 rpm

A decent operational speed of 160 rpm is well-suited for many feedback control systems, ensuring responsive operation.

Low Power Mode: YES

Low power mode enables energy-saving operation, extending battery life for portable applications and eco-friendly designs.

On Chip Program ROM Width: 8

An 8-bit program ROM width enhances compatibility with various programming standards and can simplify software development.

Technical Specifications

Microcontrollers SPC58EC74E7P000X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC74E7P000X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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