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SPC58EC74E3FMC0X

STMicroelectronics

SPC58EC74E3FMC0X by STMicroelectronics

SPC58EC74E3FMC0X from STMicroelectronics is a 32-bit microcontroller ideal for automotive applications, featuring AEC-Q100 screening. It supports up to 40 MHz clock speed, has integrated cache, and offers extensive connectivity options like Ethernet and UART. With a wide operating temp range (-40 °C to 105 °C), it ensures reliability in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Rebound Electronics

UK . 4,773 parts In-Stock

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Vyrian

USA . 4,698 parts In-Stock

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4,698

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Digiode

USA . 1,083 parts In-Stock

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1,083

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Anansix

USA . 267 parts In-Stock

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267

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Distributors (Availability)

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AZTECH Wire

Italy . 212 parts In-Stock

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$12.460

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212

$12.460

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Vigor

Singapore . 2,723 parts In-Stock

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$16.030

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2,723

$16.030

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Microchip USA

USA . 497 parts In-Stock

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$21.411

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497

$21.411

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Ampacity Inc.

Singapore . 1,317 parts In-Stock

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$22.000

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1,317

$22.000

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IDEA Electronic Components Group

UK . 169 parts In-Stock

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$74.980

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$67.482

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169

$74.980

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MKK Technologies

India . 503 parts In-Stock

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$140.995

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503

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DigiPath Technology Company

USA . 503 parts In-Stock

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$140.995

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503

$140.995

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Parana Technologies

USA . 1,874 parts In-Stock

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$89.650

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1,874

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 847 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the SPC58EC74E3FMC0X microcontroller from STMicroelectronics, a leader in innovation and reliability. Designed for automotive applications, it boasts robust features that ensure superior processing power while adhering to stringent quality standards. Experience seamless connectivity and low power consumption, making it perfect for advanced control systems and real-time data processing. Elevate your projects with ST's trusted technology and enjoy unmatched value and support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it reliable in various applications.

Integrated Cache: YES

The integration of cache allows for faster data access and processing, improving the overall performance of the microcontroller.

Surface Mount: YES

Surface mount technology leads to a smaller footprint and makes the microcontroller easier to integrate into compact designs.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage enhances efficiency and reduces power consumption, making it suitable for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows for efficient data processing, supporting a variety of applications with different data requirements.

Screening Level: AEC-Q100

Meeting AEC-Q100 standards means this microcontroller is suitable for automotive applications, ensuring reliability in harsh environments.

Package Shape: SQUARE

The square package shape is optimized for space-saving designs, facilitating integration on various circuit boards.

Bit Size: 32

A 32-bit architecture enables more complex computations and processing capabilities, ideal for demanding applications.

No. of Terminals: 100

A higher number of terminals allows for more peripherals and functionalities to be connected, enhancing flexibility in design.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style is designed for effective heat dissipation and compactness, ensuring efficient operation even under load.

Minimum Supply Voltage: 1.14 V

Supporting a low minimum supply voltage makes the chip energy-efficient and suitable for low-power applications.

Maximum Operating Temperature: 105 °C

Capable of operating at high temperatures allows this microcontroller to be used in demanding environments.

CPU Family: E200Z4

The E200Z4 CPU family is known for high performance, making it suitable for complex control tasks.

Minimum Operating Temperature: -40 °C

With a wide temperature range, this microcontroller can perform reliably in extreme conditions, important for industrial applications.

ADC Channels: YES

The presence of analog-to-digital converters enables the microcontroller to process real-world signals, vital for sensor applications.

DMA Channels: YES

Direct Memory Access channels increase data transfer efficiency and reduce CPU load, enhancing multitasking capabilities.

Terminal Position: QUAD

Quad terminal positioning provides good connectivity options and aids in easy soldering on PCB.

ROM Words: 3145728

A large ROM size allows for extensive software applications, enabling complex functionality and operations.

Maximum Seated Height: 1.2 mm

A low seated height allows for more compact designs, making it suitable for space-constrained applications.

Width: 14 mm

The compact width enables integration into small form factor designs without compromising performance.

Data EEPROM Size: 128K

A sizable EEPROM allows for storing configuration data and user preferences, supporting features like firmware updates.

Boundary Scan: YES

Boundary scan capability allows for easier testing and diagnostics of circuit boards, enhancing product reliability.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Multiple peripherals increase versatility, enabling complex tasks and interactions in various applications.

Maximum Clock Frequency: 40 MHz

A high clock frequency enhances processing capability, allowing for fast execution of programs.

Length: 14 mm

Similar to its width, the length of 14 mm supports compact designs without sacrificing features.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture ensures efficient processing and high performance per watt, ideal for embedded applications.

No. of Timers: 12

Having multiple timers allows for precise time management, crucial for real-time applications.

RAM Bytes: 393216

Ample RAM size supports complex computations and data handling, essential for modern applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing the microcontroller's performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and connectivity, important for manufacturing and assembly.

Analog To Digital Convertors: 4-Ch 12-Bit, 1-Ch 10-Bit

Versatile ADC configuration allows for precise measurements in various applications, expanding the microcontroller's utility.

Maximum Supply Current: 50 mA

A moderate maximum supply current ensures it can handle demanding operations without excessive power draw.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V keeps power consumption low, suitable for energy-sensitive applications.

No. of DMA Channels: 64

With a high number of DMA channels, the microcontroller can efficiently manage multiple data streams concurrently.

No. of Serial I/Os: 18

18 serial IOs enable extensive communication with other devices, enhancing connectivity options in projects.

PWM Channels: YES

PWM channel availability allows for precise control of motors and other devices, vital for automation.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Robust connectivity options ensure compatibility with various devices, making it ideal for modern IoT and automotive applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of the firmware, supporting long product lifetimes.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density packing on PCBs, accommodating more functionality in less space.

Format: FLOATING POINT

Support for floating-point format facilitates complex mathematical operations, crucial for calculations in scientific applications.

Speed: 160 rpm

A rotational speed of 160 rpm ensures that applications requiring precision control can be executed effectively.

Low Power Mode: YES

A low power mode enhances energy efficiency, extending the battery life of portable devices.

On Chip Program ROM Width: 8

The 8-bit program ROM width provides flexibility in programming options, supporting a variety of applications.

Technical Specifications

Microcontrollers SPC58EC74E3FMC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC74E3FMC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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