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SPC58EC74E3E0C1X

STMicroelectronics

SPC58EC74E3E0C1X by STMicroelectronics

SPC58EC74E3E0C1X by STMicroelectronics is a 32-bit microcontroller featuring integrated cache and AEC-Q100 screening, ideal for automotive applications. It operates at a max voltage of 1.26V with a clock frequency of 40 MHz, supporting various connectivity options like CAN and UART. With robust RAM (393216 bytes) and EEPROM (128K), it excels in real-time processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,461 parts In-Stock

1+ parts

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7,461

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Digiode

USA . 1,467 parts In-Stock

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1,467

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Anansix

USA . 519 parts In-Stock

1+ parts

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519

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 869 parts In-Stock

1+ parts

$21.580

100+ parts

-

1k+ parts

-

10k+ parts

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869

$21.580

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IDEA Electronic Components Group

UK . 1,678 parts In-Stock

1+ parts

$56.764

100+ parts

-

1k+ parts

$51.088

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1,678

$56.764

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$51.088

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MKK Technologies

India . 1,419 parts In-Stock

1+ parts

$106.741

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1,419

$106.741

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DigiPath Technology Company

USA . 1,419 parts In-Stock

1+ parts

$106.741

100+ parts

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1,419

$106.741

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Parana Technologies

USA . 1,460 parts In-Stock

1+ parts

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100+ parts

$67.870

1k+ parts

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1,460

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$67.870

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Corphita

USA . 757 parts In-Stock

1+ parts

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757

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Overview

Unlock limitless possibilities with the SPC58EC74E3E0C1X microcontroller from STMicroelectronics! Renowned for unmatched quality and reliability, this high-performance device excels in automotive applications, ensuring robust functionality even in extreme conditions. With integrated features like advanced ADC channels and extensive connectivity options, it empowers innovative designs while optimizing efficiency. Elevate your projects with a trusted brand that combines cutting-edge technology and exceptional value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durable protection against environmental factors, making the microcontroller suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves the overall processing speed and efficiency, which is crucial for high-performance applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier manufacturing processes, enhancing the versatility of the product.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage contributes to improved energy efficiency and makes it suitable for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit RAM width offers adequate performance for managing simple data processing tasks effectively.

Screening Level: AEC-Q100

Compliance with AEC-Q100 screening ensures reliability and performance in automotive applications, making it a trusted choice.

Package Shape: SQUARE

The square package shape is conducive for efficient PCB placement and routing, optimizing space in electronic designs.

Bit Size: 32

A 32-bit architecture allows for handling more complex instructions and larger data types, enhancing overall performance.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for various peripherals, increasing flexibility in design.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style facilitates better thermal management and allows for high-density mounting, ideal for modern designs.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage expands the range of applications, especially in low-power and energy-conserving devices.

Maximum Operating Temperature: 105 °C

Operating at a high temperature threshold ensures reliability in demanding conditions, suitable for industrial applications.

CPU Family: E200Z4

A robust CPU family ensures high performance for real-time processing, advantageous for responsive applications.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme low temperatures increases versatility for outdoor and industrial applications.

ADC Channels: YES

Integrated ADC channels enhance the microcontroller's capability to process analog signals, useful in sensor applications.

DMA Channels: YES

The presence of DMA channels offloads data transfer tasks from the CPU, improving overall system efficiency and performance.

Terminal Position: QUAD

Quad terminal positioning offers good balance and is effective for heat dissipation, enhancing longevity of the product.

ROM Words: 3145728

A large ROM capacity allows for extensive firmware storage, supporting complex applications without constraints.

Maximum Seated Height: 1.2 mm

A low seated height is suitable for space-constrained applications and enables more compact device designs.

Width: 14 mm

The compact width facilitates efficient PCB layout, making it easier to integrate into smaller devices.

Data EEPROM Size: 128K

A substantial EEPROM size allows for flexible data storage solutions, particularly for settings and calibration constants.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, ensuring high reliability during manufacturing.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Diverse peripherals enhance functionality, allowing for multi-tasking and real-time clock features, ideal for comprehensive applications.

Maximum Clock Frequency: 40 MHz

A high clock frequency ensures speedy execution of instructions, improving performance for time-sensitive applications.

Length: 14 mm

A compact length makes it easier to design space-efficient PCBs, essential for modern electronics.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture allows for efficient processing with a reduced instruction set, leading to high performance and low power consumption.

No. of Timers: 12

Multiple timers provide flexibility in managing various timing-related functions, crucial for real-time control applications.

RAM Bytes: 393216

Ample RAM allows for more complex data processing and better handling of multiple tasks simultaneously.

Technology: CMOS

CMOS technology contributes to lower power consumption and increased transistor density, enhancing overall performance.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability, improving resilience in demanding environments.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Having multiple ADCs with varying resolutions allows for precise sensor data acquisition, crucial for various applications.

Maximum Supply Current: 50 mA

A moderate maximum supply current enables a balance between performance and power consumption, making it suitable for battery-operated systems.

Nominal Supply Voltage: 1.2 V

Working at a nominal supply voltage of 1.2 V is ideal for low-power applications, maximizing battery life.

No. of DMA Channels: 64

With 64 DMA channels, the microcontroller can handle multiple data transfers simultaneously, optimizing processing capabilities.

No. of Serial I/Os: 26

Having 26 serial I/O lines provides ample communication interfaces for connectivity to various peripherals, increasing versatility.

PWM Channels: YES

The inclusion of PWM channels allows for precise control of motors and other devices, enhancing the product's applicable use cases.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Diverse connectivity options facilitate easy integration with multiple device types, enhancing interoperability in complex systems.

ROM Programmability: FLASH

Flash programmability allows for easier updates and flexible firmware management, ensuring long-term adaptability.

Terminal Pitch: 0.5 mm

A small terminal pitch enables high-density designs, making it suitable for compact and modern electronic products.

Format: FLOATING POINT

Floating point support allows for more precise calculations, making the microcontroller ideal for advanced mathematical operations.

Speed: 120 rpm

A speed rating of 120 rpm ensures efficient, controlled operation for applications requiring precise timing.

Low Power Mode: YES

The availability of a low power mode enhances energy efficiency, extending battery life in portable applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for straightforward programming and debugging, making it user-friendly for developers.

Technical Specifications

Microcontrollers SPC58EC74E3E0C1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC74E3E0C1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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