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SPC58EC74C3FMC0X

STMicroelectronics

SPC58EC74C3FMC0X by STMicroelectronics

SPC58EC74C3FMC0X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and integrated cache, ideal for automotive applications. It features 64 DMA channels and supports various connectivity options like Ethernet and FlexRay. With an operating temp range of -40 °C to 105 °C, it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,677 parts In-Stock

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Vyrian

USA . 4,061 parts In-Stock

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Anansix

USA . 1,344 parts In-Stock

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AZTECH Wire

Italy . 465 parts In-Stock

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$20.500

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465

$20.500

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IDEA Electronic Components Group

UK . 389 parts In-Stock

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$31.573

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$28.416

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389

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Microchip USA

USA . 3,330 parts In-Stock

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$51.650

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$51.650

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MKK Technologies

India . 291 parts In-Stock

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$59.372

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291

$59.372

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DigiPath Technology Company

USA . 291 parts In-Stock

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$59.372

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291

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Perfect Parts

USA . 56,000 parts In-Stock

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56,000

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Corphita

USA . 2,183 parts In-Stock

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Parana Technologies

USA . 1,428 parts In-Stock

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$37.751

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RC Electronics

USA . 856 parts In-Stock

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Overview

Elevate your projects with the SPC58EC74C3FMC0X microcontroller from STMicroelectronics, a leader in innovation and quality. This 32-bit powerhouse offers unmatched performance and reliability, perfect for automotive applications where precision is key. With its robust design, integrated peripherals, and low power consumption, you can create smarter, more efficient systems that meet the demands of tomorrow. Choose SPC58EC74C3FMC0X for unrivaled value and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure reliability and reduce manufacturing costs.

Integrated Cache: YES

The presence of cache improves processing speed and efficiency, enhancing overall performance.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on the PCB.

Maximum Supply Voltage: 1.26 V

Low maximum voltage enhances safety and reduces power consumption, making it ideal for battery-operated devices.

On Chip Data RAM Width: 8

Enables efficient data handling, contributing to faster processing capabilities.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures reliability in automotive applications.

Package Shape: SQUARE

Square packages facilitate uniform design layout and simplify mounting on PCBs.

Bit Size: 32

A 32-bit architecture supports complex computations and processing of large data sets efficiently.

No. of Terminals: 292

A higher number of terminals allows for extensive connectivity and versatility in peripheral integration.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid arrays enable high-density connections, optimal for small form factor applications.

Minimum Supply Voltage: 1.14 V

Supports low voltage operation, which is beneficial in power-sensitive applications.

Maximum Operating Temperature: 105 °C

High operating temperature range ensures reliable performance in demanding environments.

CPU Family: E200Z4

Part of a reliable family of CPUs, ensuring optimal compatibility and support.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold, which is essential for outdoor and harsh environment applications.

ADC Channels: YES

Integrated ADC channels facilitate analog signal processing, broadening application areas.

DMA Channels: YES

DMA capability allows data transfer independently of the CPU, enhancing performance efficiency.

Terminal Position: BOTTOM

Bottom positioned terminals optimize space usage on the PCB and improve thermal performance.

ROM Words: 3,145,728

Large on-chip ROM allows for extensive program storage and functionality.

Maximum Seated Height: 1.8 mm

Low profile design is suitable for space-constrained applications.

Width: 17 mm

Compact dimensions facilitate integration into smaller devices.

Data EEPROM Size: 128K

Ample EEPROM space for data storage ensures flexibility in applications needing data retention.

Boundary Scan: YES

Supports boundary scan testing, improving reliability and reducing manufacturing test costs.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Rich peripheral set enhances versatility for various applications, making it ideal for complex projects.

Maximum Clock Frequency: 40 MHz

Higher clock frequency allows for faster processing, making it suitable for high-speed applications.

Length: 17 mm

Compact size allows for flexible PCB layouts and integration into tight spaces.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance per watt, enhancing energy efficiency.

No. of Timers: 12

Multiple timers increase functionality for scheduling and event management in applications.

RAM Bytes: 393216

Significant RAM capacity supports complex applications and multitasking.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining performance.

Terminal Form: BALL

Ball grid array form enhances thermal performance and reduces inductive effects.

Analog To Digital Convertors: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple high-resolution ADC channels enable accurate analog measurements for diverse applications.

Maximum Supply Current: 50 mA

Low maximum current consumption aids in prolonging battery life for portable applications.

Nominal Supply Voltage: 1.2 V

Low nominal voltage contributes to energy efficiency across various applications.

No. of DMA Channels: 64

A high number of DMA channels improves data handling capabilities, beneficial for complex tasks.

No. of Serial I/Os: 18

Extensive serial I/O options enhance connectivity with a variety of devices and components.

PWM Channels: YES

Inclusion of PWM channels enables precise control in tasks such as motor control and signal modulation.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Diverse connectivity options ensure compatibility with various networks and peripherals.

ROM Programmability: FLASH

Flash programmability allows for easy updating and reprogramming of firmware, enhancing usability.

Terminal Pitch: 0.8 mm

Fine pitch allows for denser designs on PCB, enabling compact products.

Format: FLOATING POINT

Floating point format improves processing for applications requiring complex mathematical computations.

Speed: 160 rpm

Sufficient speed for a variety of motor control applications, optimizing system performance.

Low Power Mode: YES

Low power mode extends battery life, crucial for portable and energy-sensitive devices.

On Chip Program ROM Width: 8

8-bit ROM width facilitates efficient data processing and instruction handling.

Technical Specifications

Microcontrollers SPC58EC74C3FMC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B292

Length:

17 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

292

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA292,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

RAM Bytes:

393216

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.8 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC74C3FMC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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