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SPC58EC70E1F001X

STMicroelectronics

SPC58EC70E1F001X by STMicroelectronics

SPC58EC70E1F001X from STMicroelectronics is a 32-bit microcontroller ideal for automotive applications, featuring AEC-Q100 screening. It supports up to 40 MHz clock speed, has 393 KB RAM, and integrates multiple connectivity options like CAN and UART. Its low power mode ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,071 parts In-Stock

1+ parts

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100+ parts

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3,071

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Digiode

USA . 2,525 parts In-Stock

1+ parts

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2,525

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Anansix

USA . 1,291 parts In-Stock

1+ parts

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1,291

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 40 parts In-Stock

1+ parts

$17.611

100+ parts

-

1k+ parts

$15.850

10k+ parts

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40

$17.611

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$15.850

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AZTECH Wire

Italy . 1,003 parts In-Stock

1+ parts

$21.160

100+ parts

-

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1,003

$21.160

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MKK Technologies

India . 1,920 parts In-Stock

1+ parts

$33.116

100+ parts

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1,920

$33.116

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DigiPath Technology Company

USA . 1,920 parts In-Stock

1+ parts

$33.116

100+ parts

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1,920

$33.116

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Corphita

USA . 4,900 parts In-Stock

1+ parts

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4,900

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Parana Technologies

USA . 1,859 parts In-Stock

1+ parts

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100+ parts

$21.056

1k+ parts

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1,859

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$21.056

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Overview

Elevate your projects with the SPC58EC70E1F001X microcontroller from STMicroelectronics, a leader in innovation and reliability. Boasting exceptional quality and AEC-Q100 screening, this 32-bit powerhouse delivers robust performance for automotive and industrial applications. With integrated cache, versatile connectivity options, and low power modes, it ensures efficiency without compromising speed. Experience unparalleled value and reliability that empowers your designs to excel in every environment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliability in various operating conditions.

Integrated Cache: YES

The presence of integrated cache enhances processing speed and efficiency during data handling.

Surface Mount: YES

Surface mount capability allows for compact design and minimizes board space usage.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage helps in reducing power consumption, making it ideal for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit wide RAM allows for efficient data processing and storage.

Screening Level: AEC-Q100

Adhering to AEC-Q100 standards ensures high reliability, making it suitable for automotive applications.

Package Shape: SQUARE

Square package shape provides uniform placement and optimizes PCB layouts.

Bit Size: 32

32-bit architecture enables efficient handling of complex calculations and larger data sizes.

No. of Terminals: 64

A higher number of terminals allows for extensive connectivity options with peripheral devices.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The versatile package style supports various mounting and thermal management needs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage enhances the flexibility of power supplies used with the microcontroller.

Maximum Operating Temperature: 105 °C

Capability to operate at high temperatures broadens application range in demanding environments.

CPU Family: E200Z4

Part of the efficient E200Z4 family, optimized for embedded applications with performance needs.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in extreme conditions, suitable for industrial applications.

ADC Channels: YES

Integrated analog-to-digital converters (ADC) make it easy to interface with sensors and collect data.

DMA Channels: YES

Integrated DMA channels improve data transfer efficiency, reducing CPU load for higher performance.

Terminal Position: QUAD

Quad terminal positioning allows for easier soldering and improved connection integrity on PCBs.

ROM Words: 2,097,152

Ample ROM word capacity provides significant space for firmware and complex application development.

Maximum Seated Height: 1.2 mm

The low seated height contributes to a compact design, ideal for space-constrained applications.

Width: 10 mm

Compact width facilitates integration into tight spaces and reduces overall board footprint.

Data EEPROM Size: 128K

Sufficient EEPROM size supports storage of important configuration data and user settings.

Boundary Scan: YES

Boundary scan capability allows for easier testing and debugging of the microcontroller in PCBs.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Diverse peripheral support enables complex applications with synchronized timing and data management.

Maximum Clock Frequency: 40 MHz

A high clock frequency allows for fast processing and real-time performance in applications.

Length: 10 mm

Compact length helps in fitting this microcontroller into confined spaces while maintaining functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers a simplified instruction set, leading to efficient performance and lower power usage.

No. of Timers: 12

Multiple timers enable the scheduling of tasks and timing events effectively within applications.

RAM Bytes: 393216

Large RAM capacity allows for the execution of complex programs with significant data manipulation.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: GULL WING

Gull wing terminals facilitate efficient soldering and create robust electrical connections.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple analog channels provide flexibility for a variety of sensor inputs with good resolution.

Maximum Supply Current: 50 mA

Low maximum supply current aids in energy efficiency, prolonging battery life in portable applications.

Nominal Supply Voltage: 1.2 V

A nominal voltage of 1.2 V makes it compatible with common low-power systems.

No. of DMA Channels: 64

An extensive number of DMA channels allows simultaneous data transfers, enhancing speed and efficiency.

No. of Serial I/Os: 26

Plenty of serial I/O lines provide versatile communication interfaces with other devices.

PWM Channels: YES

PWM channels make it suitable for motor control and other applications requiring precise signal modulation.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Diverse connectivity options from multiple protocols facilitate interfacing with a wide range of devices.

ROM Programmability: FLASH

FLASH programmability enables easy updates and modifications to firmware as applications evolve.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for tighter component placement, enabling higher-density PCB designs.

Format: FLOATING POINT

Floating point format enhances numerical calculations, making the microcontroller suitable for complex algorithms.

Speed: 160 rpm

The defined speed is ideal for applications requiring controlled motion, such as robotics and automation.

Low Power Mode: YES

Low power mode extends device operational life and reduces energy consumption in idle states.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates efficient management of program instructions.

Technical Specifications

Microcontrollers SPC58EC70E1F001X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC58EC70E1F001X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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