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SPC584G80E5PEC0X

STMicroelectronics

SPC584G80E5PEC0X by STMicroelectronics

SPC584G80E5PEC0X by STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 1.26V and operates b/w -40 °C to 125 °C. It features 96 DMA channels, 12 timers, and supports various connectivity options like Ethernet and I2C. Ideal for automotive applications requiring robust performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,998 parts In-Stock

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1,998

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Anansix

USA . 1,915 parts In-Stock

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1,915

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Digiode

USA . 975 parts In-Stock

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975

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Distributors (Availability)

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AZTECH Wire

Italy . 678 parts In-Stock

1+ parts

$10.090

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678

$10.090

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IDEA Electronic Components Group

UK . 2,056 parts In-Stock

1+ parts

$46.627

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$41.964

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2,056

$46.627

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$41.964

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Microchip USA

USA . 3,233 parts In-Stock

1+ parts

$62.102

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3,233

$62.102

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MKK Technologies

India . 1,515 parts In-Stock

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$87.678

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1,515

$87.678

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DigiPath Technology Company

USA . 1,515 parts In-Stock

1+ parts

$87.678

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1,515

$87.678

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Corphita

USA . 1,787 parts In-Stock

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1,787

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Parana Technologies

USA . 1,479 parts In-Stock

1+ parts

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$55.749

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1,479

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$55.749

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Overview

Elevate your automotive designs with the SPC584G80E5PEC0X microcontroller from STMicroelectronics—a leader in innovation and quality. With exceptional performance, this AEC-Q100 certified solution ensures reliability under extreme conditions, offering unmatched efficiency for sophisticated applications like advanced driver-assistance systems (ADAS) and electric vehicles. Invest in a product that combines cutting-edge technology with robust support, empowering you to drive your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material helps protect the microcontroller from environmental stress, ensuring longevity in various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing processes, making it suitable for modern electronic devices.

Maximum Supply Voltage: 1.26 V

The low maximum voltage contributes to low power consumption, enhancing energy efficiency in battery-operated devices.

Screening Level: AEC-Q100

This screening standard ensures high reliability in automotive applications, making the microcontroller suitable for critical automotive systems.

Package Shape: SQUARE

A square package shape facilitates easy integration into circuit boards and can improve thermal performance.

Bit Size: 32

A 32-bit architecture allows for more complex computing tasks, including better handling of data and tasks requiring significant processing power.

No. of Terminals: 144

A higher number of terminals provides versatility in connectivity options and peripheral integration, suitable for complex applications.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style enables effective thermal management and space-saving designs in advanced electronics.

Minimum Supply Voltage: 1.14 V

Operating at low voltages increases the microcontroller's compatibility with battery-powered systems, extending device life.

Maximum Operating Temperature: 125 °C

This elevated temperature capability allows usage in high-heat environments, especially useful in automotive and industrial applications.

CPU Family: SPC58

The SPC58 family is designed for high-performance processing needs, making it ideal for demanding tasks such as motor control or automotive applications.

Minimum Operating Temperature: -40 °C

This wide operating temperature range makes the microcontroller suitable for extreme conditions, enhancing its application in harsh environments.

ADC Channels: YES

The inclusion of ADC channels makes it ideal for applications requiring analog signal processing, such as sensors or instrumentation.

DMA Channels: YES

Direct Memory Access (DMA) support enhances data throughput and efficiency by allowing peripherals to access memory without CPU intervention.

Terminal Position: QUAD

Quad terminal positions provide flexible mounting options and improved connectivity for various circuit designs.

ROM Words: 4194304

A large ROM capacity enables complex applications to be programmed and stored directly on the device, facilitating advanced functionalities.

Maximum Seated Height: 1.2 mm

A low profile reduces the overall height of the assembled device, making it suitable for space-constrained applications.

Width: 20 mm

A compact width ensures it can easily fit into tight electronic designs.

Data EEPROM Size: 256K

The substantial EEPROM size allows for versatile data storage capabilities, essential for applications requiring persistent memory.

Peripherals: DMA(96), TIMER(12), RTC, WDT(4)

Multiple peripherals offer extensive functionality for timing operations, real-time monitoring, and data management, enhancing flexibility.

Maximum Clock Frequency: 40 MHz

A high clock frequency ensures faster processing speeds, making the microcontroller suitable for applications needing quick responses.

Length: 20 mm

The standardized length offers easy integration into electronic designs and compatibility with existing layouts.

Temperature Grade: AUTOMOTIVE

Grade suitable for automotive applications ensures robustness and reliability under demanding conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates CPU, memory, and peripherals on a single chip for versatile and efficient processing capabilities.

No. of Timers: 12

Multiple timers provide various timing solutions for managing events, scheduling tasks, or generating PWM signals for control applications.

RAM Bytes: 622592

Ample RAM supports complex algorithms and buffers data, enabling efficient processing for a wide range of applications.

Technology: CMOS

CMOS technology promotes low power consumption and high-density integration, critical for modern electronics.

Terminal Form: GULL WING

Gull wing terminals facilitate efficient soldering and assembly while ensuring strong mechanical connections.

Analog To Digital Converters: 5-Ch 12-Bit, 1-Ch 10-Bit

The high-resolution ADCs enable precise measurement and conversion of analog signals, essential for sensor applications.

Nominal Supply Voltage: 1.2 V

Operating at a nominal voltage aids in reducing power dissipation, an essential requirement for energy-efficient designs.

No. of DMA Channels: 96

A high number of DMA channels allows for significant data management capabilities, enhancing the performance of data-driven applications.

PWM Channels: YES

PWM support enables effective motor control and signal modulation, crucial for various applications including robotics and automotive control.

Connectivity: DSPI(10), ETHERNET, I2C, LIN(18)

Extensive connectivity options ensure the microcontroller can interface with various devices and networks, expanding its application flexibility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, ensuring adaptability to changing requirements.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for efficient use of board space, making it suitable for dense circuit layouts.

Speed: 160 rpm

Operating speed is beneficial for applications requiring quick motor response and control, particularly in automation.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports a wide range of programming languages and enhances compatibility with embedded system design.

Technical Specifications

Microcontrollers SPC584G80E5PEC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

SPC58

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of DMA Channels:

96

No. of Terminals:

144

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

622592

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

256K

Connectivity:

DSPI(10), ETHERNET, I2C, LIN(18)

Peripherals:

DMA(96), TIMER(12), RTC, WDT(4)

Analog To Digital Convertors:

5-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584G80E5PEC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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