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SPC584C80E5F0C1X

STMicroelectronics

SPC584C80E5F0C1X by STMicroelectronics

SPC584C80E5F0C1X microcontroller by STMicroelectronics features a 32-bit E200Z4 CPU, operates at 1.14-1.26V, and supports up to 40 MHz clock speed. With integrated DMA channels and ADCs, it's ideal for automotive applications requiring robust performance. Its AEC-Q100 screening ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,597 parts In-Stock

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7,597

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Digiode

USA . 4,672 parts In-Stock

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4,672

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Anansix

USA . 454 parts In-Stock

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454

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Distributors (Availability)

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AZTECH Wire

Italy . 498 parts In-Stock

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$14.540

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498

$14.540

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Microchip USA

USA . 3,565 parts In-Stock

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$54.422

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3,565

$54.422

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IDEA Electronic Components Group

UK . 1,720 parts In-Stock

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$62.983

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$56.685

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1,720

$62.983

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$56.685

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MKK Technologies

India . 1,390 parts In-Stock

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$118.436

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1,390

$118.436

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DigiPath Technology Company

USA . 1,390 parts In-Stock

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$118.436

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1,390

$118.436

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Corphita

USA . 3,921 parts In-Stock

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3,921

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Parana Technologies

USA . 2,350 parts In-Stock

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$75.306

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2,350

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$75.306

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Overview

Unlock the potential of your projects with the SPC584C80E5F0C1X microcontroller from STMicroelectronics. Renowned for its unmatched quality and reliability, STMicroelectronics delivers a powerhouse that excels in automotive and industrial applications. With advanced features like integrated cache, versatile connectivity, and robust performance under extreme temperatures, this microcontroller enhances efficiency while reducing energy consumption. Experience superior design flexibility and seamless integration, empowering you to innovate with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for diverse applications.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, enabling faster data access and execution.

Surface Mount: YES

Surface mounting allows for smaller packaging and simpler assembly processes, which is ideal for space-constrained applications.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage enhances energy efficiency, making it suitable for battery-operated and low-power devices.

On Chip Data RAM Width: 8

The 8-bit RAM width supports efficient data handling, which is essential for processing tasks in embedded systems.

Screening Level: AEC-Q100

This screening level certifies reliability in automotive applications, ensuring performance in harsh conditions.

Package Shape: SQUARE

Square package shapes are space-efficient and allow for easier circuit board layout.

Bit Size: 32

A 32-bit bit size supports larger data handling and provides better performance for complex algorithms and processes.

No. of Terminals: 144

A higher number of terminals allows for more peripheral connections, enabling greater extensibility in system design.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This style allows for better thermal management and compact designs, which is useful in high-performance applications.

Minimum Supply Voltage: 1.14 V

This low minimum supply voltage caters to power-sensitive applications, extending battery life.

Maximum Operating Temperature: 105 °C

The ability to operate at high temperatures makes this microcontroller suitable for challenging environments.

CPU Family: E200Z4

The E200Z4 CPU family provides robust performance and is well-suited for a variety of applications.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures reliable operation in extreme conditions, particularly useful in industrial applications.

ADC Channels: YES

Integrated ADC channels enable efficient data conversion, making it useful for sensor-based applications.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: QUAD

Quad terminal positioning facilitates flexible PCB layout and better signal integrity.

ROM Words: 4194304

This exceptionally large ROM capacity supports complex applications and extensive firmware.

Maximum Seated Height: 1.2 mm

A low seated height is useful for designing thin and compact products.

Width: 20 mm

A standard width allows for compatibility with a majority of PCB designs.

Data EEPROM Size: 128K

This significant EEPROM size enables storage of configuration settings and other critical data.

Boundary Scan: YES

Boundary scan capabilities aid in testing and debugging, enhancing reliability during production.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Multiple built-in peripherals enhance functionality and reduce system complexity, saving on additional components.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency improves processing speed, enabling performance in demanding applications.

Length: 20 mm

Standard length assists in making the microcontroller suitable for various standard PCB layouts.

Peripheral IC Type: MICROCONTROLLER, RISC

This type offers efficient performance and low power consumption, ideal for embedded systems.

No. of Timers: 12

Multiple timers support complex applications needing precise timing and event control.

RAM Bytes: 393216

Ample RAM provides sufficient workspace for complex applications, improving performance.

Technology: CMOS

CMOS technology delivers low power consumption and high noise immunity, making it ideal for portable devices.

Terminal Form: GULL WING

Gull wing terminals allow for easier soldering and handling during PCB assembly.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple ADC channels support high-resolution sensor data conversion, critical for precision applications.

Maximum Supply Current: 50 mA

This moderate maximum supply current aids in maintaining energy efficiency, especially in battery-powered devices.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2V is suited for low power applications, extending battery life significantly.

No. of DMA Channels: 64

A large number of DMA channels allows multiple data streams to transfer simultaneously, improving data handling efficiency.

No. of Serial I/Os: 26

Having 26 serial I/O lines provides flexibility and expansion capabilities for connecting various peripherals.

PWM Channels: YES

Integrated PWM channels facilitate motor control and other applications requiring precise signal generation.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Versatile connectivity options support integration into various communication networks, enhancing application flexibility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, providing longevity and adaptability.

Terminal Pitch: 0.5 mm

A tight terminal pitch enables higher component density, which is great for compact designs.

Format: FLOATING POINT

Floating point format enhances numerical computation capabilities, essential for applications requiring precise calculations.

Speed: 160 rpm

This specified speed can indicate performance capabilities in motor control or other rotating applications.

Low Power Mode: YES

Low power mode enhances the microcontroller's efficiency, prolonging battery life in portable applications.

On Chip Program ROM Width: 8

An 8-bit ROM width contributes to efficient instruction execution, facilitating complex operations within the microcontroller.

Technical Specifications

Microcontrollers SPC584C80E5F0C1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

144

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.87SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C80E5F0C1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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