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SPC584C80E3G0C0X

STMicroelectronics

SPC584C80E3G0C0X by STMicroelectronics

SPC584C80E3G0C0X microcontroller by STMicroelectronics features a 32-bit E200Z4 CPU, operates at 1.14-1.26V, and supports up to 40 MHz clock speed. With integrated DMA channels and ADCs, it's ideal for automotive applications requiring high performance and reliability. Its AEC-Q100 screening ensures durability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,192 parts In-Stock

1+ parts

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6,192

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Digiode

USA . 3,177 parts In-Stock

1+ parts

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3,177

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Anansix

USA . 1,992 parts In-Stock

1+ parts

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1,992

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,708 parts In-Stock

1+ parts

$16.250

100+ parts

-

1k+ parts

-

10k+ parts

-

7,708

$16.250

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AZTECH Wire

Italy . 243 parts In-Stock

1+ parts

$19.180

100+ parts

-

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243

$19.180

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Microchip USA

USA . 287 parts In-Stock

1+ parts

$20.180

100+ parts

-

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287

$20.180

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IDEA Electronic Components Group

UK . 823 parts In-Stock

1+ parts

$73.631

100+ parts

-

1k+ parts

$66.268

10k+ parts

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823

$73.631

-

$66.268

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MKK Technologies

India . 2,007 parts In-Stock

1+ parts

$138.459

100+ parts

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2,007

$138.459

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DigiPath Technology Company

USA . 2,007 parts In-Stock

1+ parts

$138.459

100+ parts

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1k+ parts

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2,007

$138.459

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Corphita

USA . 2,336 parts In-Stock

1+ parts

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2,336

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Parana Technologies

USA . 1,259 parts In-Stock

1+ parts

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100+ parts

$88.037

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1,259

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$88.037

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Overview

Elevate your projects with the SPC584C80E3G0C0X microcontroller from STMicroelectronics, a trusted leader in innovation and quality. Engineered for versatility and reliability, this powerful 32-bit device is perfect for automotive applications, offering enhanced performance in demanding environments. With features like integrated cache and low power consumption, it empowers developers to create efficient solutions that push boundaries while ensuring durability and longevity in any application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material ensures longevity and protection for internal components.

Integrated Cache: YES

Enhanced performance due to faster access to frequently used data and instructions.

Surface Mount: YES

Facilitates easy and cost-effective PCB assembly, saving space and improving reliability.

Maximum Supply Voltage: 1.26 V

Low operating voltage reduces power consumption, making it ideal for battery-powered applications.

On Chip Data RAM Width: 8

Efficient data processing capability, allowing for better performance in embedded applications.

Screening Level: AEC-Q100

Suitable for automotive applications, ensuring high reliability and compliance with industry standards.

Package Shape: SQUARE

Compact form factor aids in efficient use of board space for complex designs.

Bit Size: 32

Supports a wider data range and more complex computations, enhancing processing capabilities.

No. of Terminals: 100

Provides extensive connectivity options for peripherals and interfaces, supporting versatile applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Allows for efficient heat dissipation and integration into compact designs.

Minimum Supply Voltage: 1.14 V

Enables operation in low-power environments, expanding application opportunities.

Maximum Operating Temperature: 105 °C

Ability to operate in high-temperature conditions ensures robustness in various environments.

CPU Family: E200Z4

Optimized architecture for automotive and industrial applications, providing efficiency and power management.

Minimum Operating Temperature: -40 °C

Ideal for extreme environments, making it suitable for outdoor and automotive applications.

ADC Channels: YES

Provides capability for real-world signal processing, crucial for sensor applications.

DMA Channels: YES

Supports efficient data transfer without CPU intervention, improving system responsiveness.

Terminal Position: QUAD

Facilitates easier routing and integration on the PCB for complex designs.

ROM Words: 4194304

Large program storage capacity allows for complex applications and firmware.

Maximum Seated Height: 1.2 mm

Low profile design supports dense layouts and compact systems.

Width: 14 mm

Compact width enables placement in space-constrained applications.

Data EEPROM Size: 128K

Ample non-volatile memory for storing settings and configuration data.

Boundary Scan: YES

Enables efficient testing and debugging in complex PCB designs, enhancing reliability.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Rich peripheral set supports diverse functionality required in modern applications.

Maximum Clock Frequency: 40 MHz

Delivers fast processing speed for real-time applications, improving system performance.

Length: 14 mm

Compact length suitable for integration into smaller devices and reduces PCB footprint.

Peripheral IC Type: MICROCONTROLLER, RISC

Low power consumption and high efficiency, ideal for embedded systems.

No. of Timers: 12

Multiple timers allow for precise control of time-sensitive applications.

RAM Bytes: 393216

Sufficient RAM capacity for data processing and storage in complex operations.

Technology: CMOS

Power-efficient technology leads to lower heat generation and better battery life.

Terminal Form: GULL WING

Common and reliable terminal design for easy soldering and assembly.

Analog To Digital Convertors: 4-Ch 12-Bit, 1-Ch 10-Bit

Allows for accurate signal digitization, essential for sensor interfacing.

Maximum Supply Current: 50 mA

Low supply current enhances power efficiency and extends battery life in portable applications.

Nominal Supply Voltage: 1.2 V

Optimized voltage for operation under low power conditions, enhancing energy efficiency.

No. of DMA Channels: 64

High number of DMA channels enables advanced multitasking capabilities.

No. of Serial I/Os: 26

Versatile connectivity options support various communication protocols.

PWM Channels: YES

Support for pulse-width modulation enables motor control and signal generation.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Comprehensive communication interfaces facilitate compatibility with a variety of devices.

ROM Programmability: FLASH

Allows for easy firmware updates and flexibility in programming.

Terminal Pitch: 0.5 mm

Fine pitch enables higher pin density in compact designs.

Format: FLOATING POINT

Enhanced mathematical precision beneficial for complex calculations and operations.

Speed: 180 rpm

Reliable operational speed suitable for various control applications.

Low Power Mode: YES

Energy-saving mode for extended battery life, ideal for portable and remote applications.

On Chip Program ROM Width: 8

Enables efficient storage and retrieval of instructions for faster execution.

Technical Specifications

Microcontrollers SPC584C80E3G0C0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C80E3G0C0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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