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SPC584C80E3G0C1X

STMicroelectronics

SPC584C80E3G0C1X by STMicroelectronics

SPC584C80E3G0C1X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates in extreme temps from -40 °C to 105 °C. It features integrated cache, DMA channels, and supports various connectivity options like CAN and UART. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,466 parts In-Stock

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6,466

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Anansix

USA . 2,527 parts In-Stock

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2,527

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Digiode

USA . 155 parts In-Stock

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155

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Distributors (Availability)

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AZTECH Wire

Italy . 152 parts In-Stock

1+ parts

$13.060

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152

$13.060

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IDEA Electronic Components Group

UK . 304 parts In-Stock

1+ parts

$19.890

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$17.901

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304

$19.890

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$17.901

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MKK Technologies

India . 1,656 parts In-Stock

1+ parts

$37.403

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1,656

$37.403

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DigiPath Technology Company

USA . 1,656 parts In-Stock

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$37.403

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1,656

$37.403

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Microchip USA

USA . 2,978 parts In-Stock

1+ parts

$51.883

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2,978

$51.883

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Corphita

USA . 4,592 parts In-Stock

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4,592

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Parana Technologies

USA . 943 parts In-Stock

1+ parts

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$23.782

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943

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$23.782

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Overview

Elevate your designs with the SPC584C80E3G0C1X microcontroller from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance, low-power solution delivers exceptional reliability across demanding applications, thanks to its AEC-Q100 screening level. With integrated features that enhance connectivity and processing efficiency, it empowers engineers to create cutting-edge automotive and industrial systems while enjoying unmatched quality and support.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that provides excellent protection for the microcontroller, making it suitable for various applications.

Integrated Cache: YES

The presence of integrated cache enhances the performance by allowing faster data access, making this microcontroller ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for a more compact design, enabling easier integration into smaller devices.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage ensures reduced power consumption, which is essential for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit RAM width offers efficient data handling for various applications, making it versatile for different tasks.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures reliability and robustness in automotive applications, enhancing safety.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCBs, making layout design simpler and more efficient.

Bit Size: 32

A 32-bit architecture allows for processing larger data sets and more complex calculations, ideal for advanced applications.

No. of Terminals: 100

A higher number of terminals provides increased connectivity options, making the microcontroller suitable for more complex integration.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Thin profile and fine pitch styles facilitate high-density designs, perfect for modern, compact devices.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage enhances the microcontroller’s efficiency, suitable for low-power applications.

Maximum Operating Temperature: 105 °C

High operating temperature range allows the microcontroller to function reliably in demanding environments.

CPU Family: E200Z4

The E200Z4 CPU family is optimized for low power and high performance, making this microcontroller suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The capability to operate in low temperatures makes this product ideal for outdoor and extreme environmental applications.

ADC Channels: YES

Integrated ADC channels facilitate direct sensing of analog signals, making the microcontroller versatile for various applications.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer without burdening the CPU, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal configuration allows for better conductivity and heat dissipation, improving reliability.

ROM Words: 4,194,304

A large ROM capacity enables the storage of complex programs and firmware, accommodating extensive applications.

Maximum Seated Height: 1.2 mm

A low seated height aids in low-profile designs, benefiting compact electronic device applications.

Width: 14 mm

Compact width enhances PCB layout capabilities, allowing for space-efficient designs.

Data EEPROM Size: 128K

Sufficient EEPROM storage enables the retention of user settings and calibration data, essential for many applications.

Boundary Scan: YES

Support for boundary scan enhances testing and debugging capabilities, ensuring device reliability and performance.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Versatile peripheral options provide extensive functionalities, making this microcontroller suitable for varied application requirements.

Maximum Clock Frequency: 40 MHz

High clock frequency supports fast processing speeds, enabling responsive and efficient applications.

Length: 14 mm

Compact dimensions allow for more flexible design implementations in limited spaces.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance and power consumption, making it an ideal choice for embedded systems.

No. of Timers: 12

Multiple timers support complex time-based operations, improving functionality for a variety of timing applications.

RAM Bytes: 393216

Ample RAM size supports the execution of memory-intensive applications, providing enhanced performance.

Technology: CMOS

CMOS technology enhances power efficiency, making this microcontroller suitable for portable, battery-driven devices.

Terminal Form: GULL WING

The gull wing leads provide reliable mechanical strength and stability, improving solder joint integrity.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADCs ensure accurate signal processing, crucial for sensing applications.

Maximum Supply Current: 50 mA

Relatively low supply current enhances battery life and reduces heat generation, ideal for energy-efficient designs.

Nominal Supply Voltage: 1.2 V

Low nominal voltage simplifies power supply requirements, enhancing design flexibility.

No. of DMA Channels: 64

A high number of DMA channels allows for efficient data transfers, freeing CPU resources for other tasks.

No. of Serial I/Os: 26

A variety of serial I/O options enables versatile communication interfaces for seamless integration with other devices.

PWM Channels: YES

PWM support is crucial for motor control applications, making this microcontroller suitable for robotics and automation.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Diverse connectivity options facilitate integration with various sensors and devices, enhancing the microcontroller's versatility.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and reprogramming, offering flexibility for evolving applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for higher density packaging on PCBs, maximizing design efficiency.

Format: FLOATING POINT

Support for floating-point operations enables complex calculations, ideal for sophisticated applications that require precision.

Speed: 180 rpm

Capable of supporting control applications at 180 rpm, useful for varied motor control scenarios.

Low Power Mode: YES

Low power mode significantly reduces energy consumption during idle times, extending battery life in portable devices.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM optimally supports efficient instruction processing in various applications.

Technical Specifications

Microcontrollers SPC584C80E3G0C1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

4194304

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C80E3G0C1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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