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SPC584C70E7QMC1X

STMicroelectronics

SPC584C70E7QMC1X by STMicroelectronics

SPC584C70E7QMC1X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates in extreme temps from -40 °C to 125 °C. It features integrated cache, DMA channels, and supports various connectivity options like Ethernet and UART. Ideal for automotive applications, it ensures reliable performance with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,350 parts In-Stock

1+ parts

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6,350

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Digiode

USA . 4,437 parts In-Stock

1+ parts

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4,437

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Anansix

USA . 1,245 parts In-Stock

1+ parts

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1,245

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,148 parts In-Stock

1+ parts

$17.980

100+ parts

-

1k+ parts

-

10k+ parts

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1,148

$17.980

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IDEA Electronic Components Group

UK . 1,306 parts In-Stock

1+ parts

$23.673

100+ parts

-

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$21.306

10k+ parts

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1,306

$23.673

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$21.306

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MKK Technologies

India . 1,483 parts In-Stock

1+ parts

$44.516

100+ parts

-

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1,483

$44.516

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DigiPath Technology Company

USA . 1,483 parts In-Stock

1+ parts

$44.516

100+ parts

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1,483

$44.516

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Microchip USA

USA . 1,752 parts In-Stock

1+ parts

$54.983

100+ parts

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1,752

$54.983

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Corphita

USA . 4,127 parts In-Stock

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4,127

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Parana Technologies

USA . 1,678 parts In-Stock

1+ parts

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100+ parts

$28.305

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1,678

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$28.305

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Overview

Elevate your projects with the SPC584C70E7QMC1X microcontroller from STMicroelectronics—the epitome of reliability and performance. Engineered for the automotive sector, it excels in demanding environments with AEC-Q100 certification, ensuring top-notch quality. Its versatile applications span from industrial controls to advanced automotive systems. Experience the power of low voltage operation combined with high efficiency, unlocking unparalleled innovation and value for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance against environmental factors, making it suitable for various applications.

Integrated Cache: YES

The presence of integrated cache improves performance by reducing access times for frequently used data.

Surface Mount: YES

Surface mount technology allows compact design and ease of assembly, ideal for space-constrained applications.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage enhances safety and extends battery life in portable devices.

On Chip Data RAM Width: 8

An 8-bit RAM width provides efficient data handling suitable for various control tasks.

Screening Level: AEC-Q100

This automotive-grade screening level ensures reliability and performance in harsh environments.

Package Shape: SQUARE

The square package shape is space-efficient, facilitating compact designs in electronic systems.

Bit Size: 32

A 32-bit architecture allows for processing larger data types and improved computational capabilities.

No. of Terminals: 176

A higher number of terminals provides enhanced connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This versatile package style supports efficient heat dissipation and is optimized for modern PCB layouts.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage ensures compatibility with battery-powered applications.

Maximum Operating Temperature: 125 °C

This high operating temperature tolerance allows it to function reliably in demanding environments.

CPU Family: E200Z4

The E200Z4 family is known for its efficiency and effective control capabilities in embedded systems.

Minimum Operating Temperature: -40 °C

Extreme temperature operation enables usage in outdoor or industrial applications.

ADC Channels: YES

The inclusion of ADC channels allows for effective analog signal processing, enhancing the device's versatility.

DMA Channels: YES

Direct Memory Access capabilities reduce CPU loading, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning ensures better electrical performance and simplifies PCB layout.

ROM Words: 2097152

A large ROM capacity supports extensive program storage, allowing for complex applications.

Maximum Seated Height: 1.6 mm

The compact height allows for streamlined designs in low-profile applications.

Width: 24 mm

The moderate width is conducive to versatile mounting options in various designs.

Data EEPROM Size: 128K

Sufficient EEPROM size enables storage of configuration parameters and other critical data.

Boundary Scan: YES

Boundary scan functionality enhances debugging capabilities, simplifying testing and ensuring reliability.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Rich peripheral support aids in versatile application development, enabling advanced control and monitoring functions.

Maximum Clock Frequency: 40 MHz

A high clock frequency results in faster processing and overall improved performance.

Length: 24 mm

A balanced length ensures compatibility with various form factors while maintaining performance.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers efficient instruction execution and lower power consumption.

No. of Timers: 12

Multiple timers support intricate time-based functionalities, enhancing control capabilities.

RAM Bytes: 393216

Robust RAM provisions allow for efficient data management and real-time application performance.

Technology: CMOS

CMOS technology ensures lower power consumption and better performance, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals deliver enhanced soldering characteristics and mechanical strength.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

Versatile ADC configurations facilitate high-quality analog-to-digital conversion for various applications.

Maximum Supply Current: 50 mA

A manageable supply current is beneficial for power-sensitive applications.

Nominal Supply Voltage: 1.2 V

The nominal voltage offers a balance between performance and power efficiency.

No. of DMA Channels: 64

A higher number of DMA channels enhances data transfer capabilities without burdening the CPU.

No. of Serial I/Os: 18

Multiple serial I/O options provide flexibility for communication with various peripherals.

PWM Channels: YES

PWM channels enable versatile signal generation, ideal for motor control and other applications.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Rich connectivity options support integration with various communication protocols for enhanced functionality.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, increasing the product's versatility.

Terminal Pitch: 0.5 mm

A small terminal pitch is suitable for densely packed PCB designs.

Format: FLOATING POINT

Support for floating-point format enhances mathematical processing capabilities for complex calculations.

Speed: 180 rpm

High-speed performance enables rapid response times in control applications.

Low Power Mode: YES

The low power mode feature extends runtime in battery-powered devices, enhancing efficiency.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports efficient instruction handling for various applications.

Technical Specifications

Microcontrollers SPC584C70E7QMC1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

176

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C70E7QMC1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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