Loading...

SPC584C70E5QMC1X

STMicroelectronics

SPC584C70E5QMC1X by STMicroelectronics

SPC584C70E5QMC1X microcontroller from STMicroelectronics features a 32-bit E200Z4 CPU, operates at a max of 1.26V, and includes integrated cache for efficient processing. With AEC-Q100 screening, it's ideal for automotive applications. It supports multiple connectivity options like Ethernet and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,392 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,392

-

-

-

-

Digiode

USA . 3,397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,397

-

-

-

-

Anansix

USA . 1,659 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,659

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,203 parts In-Stock

1+ parts

$14.960

100+ parts

-

1k+ parts

-

10k+ parts

-

1,203

$14.960

-

-

-

Microchip USA

USA . 1,937 parts In-Stock

1+ parts

$53.861

100+ parts

-

1k+ parts

-

10k+ parts

-

1,937

$53.861

-

-

-

IDEA Electronic Components Group

UK . 109 parts In-Stock

1+ parts

$73.149

100+ parts

-

1k+ parts

$65.834

10k+ parts

-

109

$73.149

-

$65.834

-

MKK Technologies

India . 1,630 parts In-Stock

1+ parts

$137.552

100+ parts

-

1k+ parts

-

10k+ parts

-

1,630

$137.552

-

-

-

DigiPath Technology Company

USA . 1,630 parts In-Stock

1+ parts

$137.552

100+ parts

-

1k+ parts

-

10k+ parts

-

1,630

$137.552

-

-

-

Corphita

USA . 1,986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,986

-

-

-

-

Parana Technologies

USA . 1,789 parts In-Stock

1+ parts

-

100+ parts

$87.461

1k+ parts

-

10k+ parts

-

1,789

-

$87.461

-

-

Overview

Unlock limitless possibilities with the SPC584C70E5QMC1X microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for robust performance across diverse applications, it ensures reliability with AEC-Q100 certification and operates seamlessly in extreme conditions. Experience enhanced efficiency, superior connectivity options, and integrated features that accelerate your designs while reducing power consumption. Elevate your projects with a trusted name that guarantees quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable materials ensure longer life and reliability in various applications.

Integrated Cache: YES

The presence of cache improves processing speed and performance, making it suitable for complex tasks.

Surface Mount: YES

Surface mount design facilitates easier assembly and higher circuit density.

Maximum Supply Voltage: 1.26 V

Low supply voltage enhances energy efficiency, which is critical for battery-operated devices.

On Chip Data RAM Width: 8

Wide RAM allows for efficient data handling and processing capabilities.

Screening Level: AEC-Q100

Compliance with AEC-Q100 indicates suitability for automotive applications, ensuring robustness under harsh conditions.

Package Shape: SQUARE

Square package shape can optimize space utilization on PCB designs.

Bit Size: 32

32-bit architecture allows for advanced processing and handling of larger data sizes.

No. of Terminals: 144

A higher number of terminals facilitates complex connectivity options for multiple peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This style supports advanced thermal management and space-efficient installations.

Minimum Supply Voltage: 1.14 V

This low minimum supply voltage supports flexible power management in various devices.

Maximum Operating Temperature: 125 °C

High temperature rating ensures reliability in high-heat environments, making it suitable for automotive and industrial applications.

CPU Family: E200Z4

Part of a recognized CPU family known for high performance and efficiency.

Minimum Operating Temperature: -40 °C

Wide operating temperature range increases the product's adaptability in extreme conditions.

ADC Channels: YES

Built-in ADC channels allow for effective data conversion, enhancing performance in sensing applications.

DMA Channels: YES

Direct Memory Access capabilities facilitate efficient data transfer and improved processing speed.

Terminal Position: QUAD

Quad terminal position improves soldering and signal integrity.

ROM Words: 2,097,152

Large ROM capacity supports complex software applications and functionalities.

Maximum Seated Height: 1.2 mm

Low profile design is ideal for space-constrained applications.

Width: 20 mm

Standard width allows for compatibility with various PCBs.

Data EEPROM Size: 128K

Adequate EEPROM size ensures ample storage for configuration settings and data retention.

Boundary Scan: YES

Boundary scan capability simplifies debugging and testing processes.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Rich peripheral integrations enhance operational capabilities and flexibility for a variety of applications.

Maximum Clock Frequency: 40 MHz

Higher clock frequency allows for faster processing speeds which is essential for real-time applications.

Length: 20 mm

Standard length ensures ease of integration into existing systems.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance while reducing power consumption.

No. of Timers: 12

Multiple timers enable precise timing control for various application requirements.

RAM Bytes: 393216

Ample RAM capacity allows for handling large data sets and complex applications.

Technology: CMOS

CMOS technology ensures low power consumption and high density.

Terminal Form: GULL WING

Gull wing terminals improve soldering reliability and reduce manufacturing defects.

Analog To Digital Convertors: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple ADC channels allow for versatile analog signal processing in embedded systems.

Maximum Supply Current: 50 mA

Decent power draw for demanding applications while maintaining energy efficiency.

Nominal Supply Voltage: 1.2 V

Nominal voltage ensures stable performance while optimizing power consumption.

No. of DMA Channels: 64

A large number of DMA channels enhances data processing efficiency.

No. of Serial I/Os: 18

High number of serial I/O ports is essential for extensive connectivity in embedded applications.

PWM Channels: YES

PWM capabilities enable control over motors and other devices, enhancing functionality.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Versatile connectivity options allow easy integration into various systems and protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in firmware management.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports high-density designs and modern PCB layouts.

Format: FLOATING POINT

Supports advanced mathematical computations, making it ideal for processing-intensive applications.

Speed: 180 rpm

Fast operational speed is suitable for applications requiring quick responses.

Low Power Mode: YES

Low power mode extends battery life in portable applications and improves energy management.

On Chip Program ROM Width: 8

8-bit program ROM width enhances compatibility with existing software frameworks.

Technical Specifications

Microcontrollers SPC584C70E5QMC1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

144

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.87SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C70E5QMC1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20