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SPC584C70E3FMC1X

STMicroelectronics

SPC584C70E3FMC1X by STMicroelectronics

SPC584C70E3FMC1X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and integrated cache, ideal for automotive applications. It features 64 DMA channels and supports various connectivity options like Ethernet and UART. With an operating temp range of -40 °C to 105 °C, it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,012 parts In-Stock

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4,012

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Anansix

USA . 2,431 parts In-Stock

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2,431

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Digiode

USA . 189 parts In-Stock

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189

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Distributors (Availability)

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AZTECH Wire

Italy . 1,073 parts In-Stock

1+ parts

$10.660

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1,073

$10.660

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Microchip USA

USA . 3,768 parts In-Stock

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$43.982

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3,768

$43.982

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IDEA Electronic Components Group

UK . 518 parts In-Stock

1+ parts

$73.909

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$66.518

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518

$73.909

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$66.518

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MKK Technologies

India . 2,182 parts In-Stock

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$138.981

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2,182

$138.981

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DigiPath Technology Company

USA . 2,182 parts In-Stock

1+ parts

$138.981

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2,182

$138.981

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Corphita

USA . 4,660 parts In-Stock

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4,660

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Parana Technologies

USA . 1,793 parts In-Stock

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$88.370

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1,793

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$88.370

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Overview

Unlock unparalleled performance with the SPC584C70E3FMC1X microcontroller from STMicroelectronics, a leader in innovation and reliability. Designed for automotive and industrial applications, this robust 32-bit solution stands out for its low power consumption and high efficiency. Benefit from seamless connectivity options and advanced features that empower your designs to achieve new heights. Trust in ST's commitment to quality and elevate your projects with cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and is lightweight, making it suitable for various applications.

Integrated Cache: YES

The presence of integrated cache allows for faster data retrieval, enhancing overall processing speed.

Surface Mount: YES

Surface mount technology enables compact circuit designs, saving space on PCBs.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage ensures low power consumption, making it ideal for battery-operated applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width is suitable for handling a variety of data efficiently within the microcontroller.

Screening Level: AEC-Q100

This AEC-Q100 screening level indicates that the microcontroller is suited for automotive applications, ensuring reliability under harsh conditions.

Package Shape: SQUARE

A square package shape allows for improved mounting flexibility in circuit design.

Bit Size: 32

A 32-bit architecture enables advanced computing capabilities, allowing for efficient processing of complex applications.

No. of Terminals: 100

A higher number of terminals facilitates greater connectivity options and peripheral integration.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The specified package style supports efficient heat dissipation and is adapted for high-density layouts.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage enhances power efficiency, particularly in low-power applications.

Maximum Operating Temperature: 105 °C

This temperature rating allows the microcontroller to operate effectively in high-temperature environments.

CPU Family: E200Z4

The E200Z4 CPU family provides an optimized performance for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this microcontroller suitable for extreme environments.

ADC Channels: YES

Integrated ADC channels are useful for applications requiring analog signal processing.

DMA Channels: YES

DMA channels improve data transfer rates, freeing up CPU resources for other tasks.

Terminal Position: QUAD

The quad terminal position offers flexible layout designs, aiding in efficient PCB routing.

ROM Words: 2097152

A large ROM capacity allows for extensive program storage, ideal for complex applications.

Maximum Seated Height: 1.2 mm

The low seated height is beneficial for compact designs, enhancing overall device form factor.

Width: 14 mm

The compact width allows for efficient use of space on the circuit board.

Data EEPROM Size: 128K

An ample EEPROM size supports data storage for various application parameters.

Boundary Scan: YES

Boundary scan functionality facilitates debugging and testing of complex circuit boards.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

A rich set of peripherals enables comprehensive functionality for various applications.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz allows for high-speed processing, enhancing performance.

Length: 14 mm

The compact length is advantageous for space-constrained designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a RISC architecture provides efficient instruction processing and faster execution times.

No. of Timers: 12

Multiple timers allow for precise timing control, essential in various applications.

RAM Bytes: 393216

A large RAM size enables complex data processing and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving reliability.

Terminal Form: GULL WING

Gull wing terminals simplify soldering and enhance surface mounting capabilities.

Analog To Digital Converters: 4-Ch 12-Bit, 1-Ch 10-Bit

The multiple ADC channels provide flexibility for analog signal processing in embedded applications.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA allows for efficient energy management in low-power applications.

Nominal Supply Voltage: 1.2 V

Optimized for low nominal supply voltage, enhancing overall power efficiency.

No. of DMA Channels: 64

A high number of DMA channels increases data handling capabilities, crucial for data-intensive applications.

No. of Serial I/Os: 18

This allows for extensive serial communication options, enhancing flexibility in interfaces.

PWM Channels: YES

PWM channels are essential for controlling motors and other devices requiring precise timing.

Connectivity: ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Multiple connectivity options broaden the scope for integration in networked and industrial systems.

ROM Programmability: FLASH

Flash programmability enables quick updates and changes to the stored program.

Terminal Pitch: 0.5 mm

A smaller terminal pitch allows for denser layouts, optimizing PCB space.

Format: FLOATING POINT

Support for floating-point operations allows for handling complex calculations efficiently.

Speed: 160 rpm

The supported operational speed makes it ideal for applications requiring precise control.

Low Power Mode: YES

Low power mode is advantageous for energy conservation in battery-powered devices.

On Chip Program ROM Width: 8

The 8-bit program ROM width allows for supporting various programming scenarios.

Technical Specifications

Microcontrollers SPC584C70E3FMC1X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

18

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ETHERNET, FLEXRAY(2), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C70E3FMC1X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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