Loading...

SPC584C70E3F001X

STMicroelectronics

SPC584C70E3F001X by STMicroelectronics

SPC584C70E3F001X by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and an operating temp range of -40 °C to 105 °C. It features integrated cache, DMA channels, and supports various connectivity options like CAN and UART. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,282 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,282

-

-

-

-

Digiode

USA . 3,779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,779

-

-

-

-

Anansix

USA . 2,033 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,033

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 338 parts In-Stock

1+ parts

$8.410

100+ parts

-

1k+ parts

-

10k+ parts

-

338

$8.410

-

-

-

IDEA Electronic Components Group

UK . 2,092 parts In-Stock

1+ parts

$34.545

100+ parts

-

1k+ parts

$31.091

10k+ parts

-

2,092

$34.545

-

$31.091

-

MKK Technologies

India . 909 parts In-Stock

1+ parts

$64.960

100+ parts

-

1k+ parts

-

10k+ parts

-

909

$64.960

-

-

-

DigiPath Technology Company

USA . 909 parts In-Stock

1+ parts

$64.960

100+ parts

-

1k+ parts

-

10k+ parts

-

909

$64.960

-

-

-

Corphita

USA . 4,530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,530

-

-

-

-

Parana Technologies

USA . 2,185 parts In-Stock

1+ parts

-

100+ parts

$41.304

1k+ parts

-

10k+ parts

-

2,185

-

$41.304

-

-

Overview

Elevate your projects with the SPC584C70E3F001X microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for automotive applications, this powerful 32-bit MCU delivers exceptional performance while ensuring reliability with AEC-Q100 certification. Its low power consumption and robust features make it ideal for complex tasks, empowering you to create advanced solutions that stand the test of time. Unlock new possibilities with ST's trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures reliability and resistance to environmental factors, making it suitable for various applications.

Integrated Cache: YES

The inclusion of integrated cache improves data access speeds, enhancing overall performance in computing tasks.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and supports high-density designs.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption, essential for battery-powered applications.

On Chip Data RAM Width: 8

This specification facilitates efficient data management and processing for various applications.

Screening Level: AEC-Q100

This high automotive qualification ensures the chip's reliability under extreme conditions, making it ideal for automotive applications.

Package Shape: SQUARE

A square package shape is conducive to modular designs and efficient thermal management.

Bit Size: 32

The 32-bit architecture enables handling of larger data sizes and improved computational capabilities.

No. of Terminals: 100

A higher number of terminals allows for better connectivity and supports multiple functions and interfaces.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style offers a compact footprint with efficient heat dissipation, making it suitable for space-constrained environments.

Minimum Supply Voltage: 1.14 V

Operating at a low minimum voltage enhances compatibility with various low-power designs.

Maximum Operating Temperature: 105 °C

The capability to function at high temperatures makes this microcontroller suitable for demanding industrial applications.

CPU Family: E200Z4

The E200Z4 CPU family is designed for high performance in embedded systems, ensuring efficient processing.

Minimum Operating Temperature: -40 °C

Operating in extreme cold conditions is critical for automotive and outdoor applications.

ADC Channels: YES

The presence of ADC channels supports advanced sensing applications, allowing for precise analog measurements.

DMA Channels: YES

DMA channels help streamline data transfers, reducing CPU workload and enhancing system efficiency.

Terminal Position: QUAD

Quad terminal positioning improves ease of soldering and helps maintain a compact design.

ROM Words: 2097152

A large ROM capacity provides ample space for complex programs and applications, making it versatile.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a thinner profile, ideal for modern embedded devices.

Width: 14 mm

A compact width aids in space-saving designs, fitting easily into smaller circuits.

Data EEPROM Size: 128K

Generous EEPROM size allows for extensive data storage and quick retrieval, benefiting applications requiring data persistence.

Boundary Scan: YES

Boundary scan capability facilitates debugging and testing, essential for speeding up the development process.

Peripherals: DMA(64), RTC, TIMER(12), WDT(3)

Diverse peripheral support enables a wide range of functionalities, making it adaptable to different project needs.

Maximum Clock Frequency: 40 MHz

A clock frequency of 40 MHz ensures fast processing speeds for demanding applications.

Length: 14 mm

Short length is beneficial for compact device designs, ensuring efficient use of board space.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances efficiency and performance in processing tasks, making it ideal for embedded systems.

No. of Timers: 12

Multiple timers allow for diverse time-based functions and applications, increasing versatility.

RAM Bytes: 393216

Ample RAM capacity supports more complex computations and larger data handling efficiently.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, crucial for reliable operation.

Terminal Form: GULL WING

Gull wing terminals simplify surface mount soldering, enhancing production efficiency.

Analog To Digital Convertors: 4-Ch 12-Bit, 1-Ch 10-Bit

Multiple ADC channels with high resolution ensure accurate analog signal processing for a variety of applications.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA allows for robust performance in power-sensitive applications.

Nominal Supply Voltage: 1.2 V

Operating at a nominal supply voltage of 1.2 V enhances power efficiency, making it suitable for battery-operated devices.

No. of DMA Channels: 64

With 64 DMA channels, it supports high data throughput, essential for sophisticated embedded systems.

No. of Serial I/Os: 26

A high number of serial I/Os allow for extensive connectivity options, enhancing interfacing capabilities.

PWM Channels: YES

PWM channels enable precise control in applications such as motor control and signal modulation.

Connectivity: CAN(8), I2C, SPI(8), UART(18)

Robust connectivity options like CAN and UART facilitate communication in complex systems, enhancing integration capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, providing flexibility in firmware management.

Terminal Pitch: 0.5 mm

A smaller terminal pitch contributes to a denser design, accommodating more components in a limited space.

Format: FLOATING POINT

Floating point capability allows for sophisticated calculations and better handling of real-world data.

Speed: 160 rpm

The specified speed of 160 rpm indicates good performance for applications involving motor control or rotating systems.

Low Power Mode: YES

The availability of a low power mode is vital for extending the operational life of battery-powered devices and minimizing energy consumption.

On Chip Program ROM Width: 8

The 8-bit width for on-chip program ROM is effective for efficient storage and execution of program instructions.

Technical Specifications

Microcontrollers SPC584C70E3F001X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

160 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(8), I2C, SPI(8), UART(18)

Peripherals:

DMA(64), RTC, TIMER(12), WDT(3)

Analog To Digital Convertors:

4-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584C70E3F001X Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20