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SPC584B70E5EHC0Y

STMicroelectronics

SPC584B70E5EHC0Y by STMicroelectronics

SPC584B70E5EHC0Y microcontroller from STMicroelectronics features a 32-bit E200Z4 CPU, operates at 1.14-1.26V, and supports up to 40MHz clock speed. With integrated DMA channels and AEC-Q100 screening, it's ideal for automotive applications. Its compact design includes 144 terminals in a thin profile package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,604 parts In-Stock

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6,604

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Digiode

USA . 4,877 parts In-Stock

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4,877

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Anansix

USA . 1,383 parts In-Stock

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1,383

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 843 parts In-Stock

1+ parts

$8.430

100+ parts

-

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843

$8.430

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Microchip USA

USA . 1,486 parts In-Stock

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$47.800

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1,486

$47.800

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IDEA Electronic Components Group

UK . 1,701 parts In-Stock

1+ parts

$50.740

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-

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$45.666

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1,701

$50.740

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$45.666

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MKK Technologies

India . 1,612 parts In-Stock

1+ parts

$95.413

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1,612

$95.413

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DigiPath Technology Company

USA . 1,612 parts In-Stock

1+ parts

$95.413

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1,612

$95.413

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Corphita

USA . 3,933 parts In-Stock

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3,933

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Parana Technologies

USA . 619 parts In-Stock

1+ parts

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$60.667

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619

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$60.667

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Overview

Unlock unparalleled performance with the SPC584B70E5EHC0Y microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for automotive and industrial applications, this advanced MCU delivers exceptional reliability and efficiency under extreme conditions. With integrated features like DMA channels and robust connectivity options, it empowers developers to create cutting-edge, low-power designs that drive success. Elevate your projects with STMicroelectronics—where quality meets innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and cost-effectiveness, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves the performance and speed of data processing, which is essential for advanced applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling high-density circuit board layouts.

Maximum Supply Voltage: 1.26 V

A maximum supply voltage of 1.26 V supports low-power applications, enhancing energy efficiency.

On Chip Data RAM Width: 8

An 8-bit RAM width allows for efficient data handling and processing in embedded systems.

Screening Level: AEC-Q100

AEC-Q100 certification ensures reliability and robustness in automotive applications.

Package Shape: SQUARE

The square package shape aids in uniform heat dissipation and efficient use of PCB space.

Bit Size: 32

A 32-bit architecture provides a higher processing capability, suitable for complex applications.

No. of Terminals: 144

With 144 terminals, it enables multiple connections for extensive functionalities and peripheral interfaces.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This diverse package style allows for better thermal management and space efficiency.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage of 1.14 V supports low-power consumption applications.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature allows the microcontroller to function reliably in harsh environments.

CPU Family: E200Z4

The E200Z4 family provides robust processing capabilities tailored for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

A wide temperature range from -40 °C ensures operation in extreme conditions, ideal for outdoor or industrial applications.

ADC Channels: YES

Integrated ADC channels facilitate the sensing of analog signals, essential for data acquisition applications.

DMA Channels: YES

With DMA channels, the microcontroller efficiently manages data transfers without CPU intervention, improving performance.

Terminal Position: QUAD

Quad terminal positioning allows for a stable connection and better power distribution.

ROM Words: 2097152

A large ROM capacity supports extensive program storage, enabling more complex applications.

Maximum Seated Height: 1.2 mm

Low seated height supports compact designs, crucial for modern electronics.

Width: 20 mm

A compact width allows for efficient circuit board layouts and space-saving designs.

Data EEPROM Size: 64K

64K of data EEPROM provides ample storage for non-volatile settings and data retention.

Boundary Scan: YES

Boundary scan capability enhances testability and fault detection in complex circuits.

Peripherals: DMA(64), RTC, TIMER(8), WDT(2)

Multiple integrated peripherals provide versatility for diverse applications, enhancing functionality.

Maximum Clock Frequency: 40 MHz

A 40 MHz clock frequency allows for faster operations and processing, improving overall performance.

Length: 20 mm

A compact length helps save space on the PCB, facilitating more efficient designs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance and efficiency, making it ideal for embedded system applications.

RAM Bytes: 131072

A substantial RAM capacity supports complex computations and high-speed data processing.

Technology: CMOS

CMOS technology provides low power consumption, high-density integration, and improved performance.

Terminal Form: GULL WING

Gull wing terminals enable easy soldering and robust mechanical stability on PCBs.

Analog To Digital Convertors: 3-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADCs facilitate accurate measurement and conversion of real-world signals.

Maximum Supply Current: 55 mA

A maximum supply current of 55 mA ensures adequate power for high-performance applications.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V optimizes power efficiency, beneficial for battery-operated devices.

No. of DMA Channels: 64

Having 64 DMA channels allows for extensive and efficient data movement within the microcontroller.

No. of Serial I/Os: 23

23 serial I/O interfaces offer flexibility and connectivity options for various peripherals.

PWM Channels: YES

Integrated PWM channels enable efficient control of motors and other devices, enhancing functionality.

Connectivity: CAN(8), DSPI(7), ETHERNET, I2C, LIN(14)

Versatile connectivity options allow integration in various networked applications, enhancing adaptability.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming, making the microcontroller versatile.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for dense placements on PCBs, maximizing space utilization.

Format: FLOATING POINT

Floating point format allows for precise calculations, critical for applications requiring high numerical accuracy.

Speed: 120 rpm

A speed of 120 rpm indicates reliability in motor control applications, ensuring smooth operation.

Low Power Mode: YES

Low power mode capabilities enhance energy efficiency, making it suitable for battery-powered devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports efficient code execution, suitable for various embedded applications.

Technical Specifications

Microcontrollers SPC584B70E5EHC0Y attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of Serial I/Os:

23

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(8), DSPI(7), ETHERNET, I2C, LIN(14)

Peripherals:

DMA(64), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

3-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584B70E5EHC0Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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