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SPC584B70E3NDC0Y

STMicroelectronics

SPC584B70E3NDC0Y by STMicroelectronics

SPC584B70E3NDC0Y by STMicroelectronics is a 32-bit microcontroller designed for efficient performance with a max clock frequency of 40 MHz. It features ADC and DMA channels, making it ideal for advanced applications in embedded systems. Its compact flatpack design ensures easy integration into various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,005 parts In-Stock

1+ parts

-

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7,005

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Digiode

USA . 3,170 parts In-Stock

1+ parts

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3,170

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Anansix

USA . 2,802 parts In-Stock

1+ parts

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2,802

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,174 parts In-Stock

1+ parts

$16.030

100+ parts

-

1k+ parts

-

10k+ parts

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1,174

$16.030

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-

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AZTECH Wire

Italy . 789 parts In-Stock

1+ parts

$17.580

100+ parts

-

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789

$17.580

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IDEA Electronic Components Group

UK . 532 parts In-Stock

1+ parts

$32.241

100+ parts

-

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$29.017

10k+ parts

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532

$32.241

-

$29.017

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Microchip USA

USA . 1,908 parts In-Stock

1+ parts

$51.804

100+ parts

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1,908

$51.804

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MKK Technologies

India . 369 parts In-Stock

1+ parts

$60.628

100+ parts

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369

$60.628

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DigiPath Technology Company

USA . 369 parts In-Stock

1+ parts

$60.628

100+ parts

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369

$60.628

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Component Stockers USA

USA . 344 parts In-Stock

1+ parts

$239.240

100+ parts

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344

$239.240

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Corphita

USA . 3,158 parts In-Stock

1+ parts

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3,158

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Parana Technologies

USA . 2,035 parts In-Stock

1+ parts

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100+ parts

$38.550

1k+ parts

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10k+ parts

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2,035

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$38.550

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Overview

Unlock the potential of your projects with the SPC584B70E3NDC0Y microcontroller from STMicroelectronics—a leader in innovative semiconductor solutions. This high-performance 32-bit microcontroller boasts a compact design and versatile features, making it perfect for automotive, industrial, and consumer applications. Experience unparalleled reliability and efficiency while benefiting from advanced functionalities like ADC and PWM channels. Elevate your designs and streamline your development process with ST's trusted quality and commitment to excellence!

Feature Benefit Bullets

Surface Mount: YES

The surface mount option makes this microcontroller ideal for modern PCB designs, allowing for compact layouts and automated assembly.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps to reduce power consumption, making it suitable for battery-powered applications.

Package Shape: SQUARE

The square package shape provides a balanced footprint for easier integration into various circuit layouts.

Bit Size: 32

The 32-bit architecture allows for robust processing capabilities, enabling more complex applications and higher performance.

No. of Terminals: 100

With 100 terminals, this microcontroller offers ample I/O options, facilitating connection to multiple peripherals and sensors.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The flatpack and thin profile design make it suitable for space-constrained applications while ensuring efficient thermal dissipation.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures compatibility with various low-power systems, improving energy efficiency.

ADC Channels: YES

Inclusion of ADC channels allows for direct interaction with analog signals, making it suitable for sensor-based applications.

DMA Channels: YES

The presence of DMA channels enhances data transfer efficiency, reducing processor overhead and increasing overall system performance.

Terminal Position: QUAD

A quad terminal position enhances accessibility for connections, making it easier to interface with a variety of components.

Width: 14 mm

The compact width makes it suitable for applications with limited space, enabling more flexible PCB designs.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz allows for faster processing speeds, improving response times in real-time applications.

Length: 14 mm

The compact length complements its width, ensuring a small overall footprint while providing sufficient processing power.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture contributes to an efficient instruction set, allowing for faster execution and lower power consumption.

Terminal Form: GULL WING

Gull wing terminals provide a reliable connection and facilitate easy soldering, enhancing manufacturing efficiency.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage is optimal for low-power applications, ensuring longevity and efficiency in battery-operated devices.

PWM Channels: YES

PWM channel availability enables easy implementation of motor control and dimming applications, broadening the range of use cases.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density connections, making it suitable for complex designs with numerous components.

Speed: 120 rpm

The 120 rpm capability indicates good performance in applications requiring rotational control, such as motor applications.

Technical Specifications

Microcontrollers SPC584B70E3NDC0Y attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

14 mm

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Speed:

120 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC584B70E3NDC0Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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