Loading...

SPC584B70E1EH00X

STMicroelectronics

SPC584B70E1EH00X by STMicroelectronics

SPC584B70E1EH00X from STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.26V and operates in extreme temperatures (-40 °C to 105 °C). It features integrated cache, DMA channels, and supports various connectivity options like CAN and Ethernet. Ideal for automotive applications, it ensures reliability with AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,591 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,591

-

-

-

-

Anansix

USA . 2,473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,473

-

-

-

-

Digiode

USA . 1,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,745

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 49 parts In-Stock

1+ parts

$15.190

100+ parts

-

1k+ parts

-

10k+ parts

-

49

$15.190

-

-

-

IDEA Electronic Components Group

UK . 171 parts In-Stock

1+ parts

$30.151

100+ parts

-

1k+ parts

$27.136

10k+ parts

-

171

$30.151

-

$27.136

-

Microchip USA

USA . 2,830 parts In-Stock

1+ parts

$31.647

100+ parts

-

1k+ parts

-

10k+ parts

-

2,830

$31.647

-

-

-

MKK Technologies

India . 2,120 parts In-Stock

1+ parts

$56.697

100+ parts

-

1k+ parts

-

10k+ parts

-

2,120

$56.697

-

-

-

DigiPath Technology Company

USA . 2,120 parts In-Stock

1+ parts

$56.697

100+ parts

-

1k+ parts

-

10k+ parts

-

2,120

$56.697

-

-

-

Corphita

USA . 3,265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,265

-

-

-

-

Parana Technologies

USA . 1,052 parts In-Stock

1+ parts

-

100+ parts

$36.050

1k+ parts

-

10k+ parts

-

1,052

-

$36.050

-

-

Overview

Unlock unparalleled performance with the SPC584B70E1EH00X microcontroller from STMicroelectronics, a leader in innovative technologies. Designed for demanding applications, this high-quality device offers durability and efficiency with its AEC-Q100 screening level. Ideal for automotive and industrial solutions, it ensures reliable operation even in extreme temperatures. Experience cutting-edge capabilities, enhanced connectivity, and low power consumption—empowering your projects like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable plastic/epoxy material provides good protection against environmental factors, making it suitable for various applications.

Integrated Cache: YES

The presence of an integrated cache helps improve processing speeds and overall efficiency, allowing for faster data access.

Surface Mount: YES

Surface mount technology allows for compact design and arrangement on PCB, facilitating high-density integration.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage ensures energy efficiency and can extend the product's usability in low-power applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows for handling simpler data types efficiently, which is beneficial in embedded applications.

Screening Level: AEC-Q100

Complying with AEC-Q100 standards ensures reliability and robustness in automotive applications, giving consumers peace of mind.

Package Shape: SQUARE

The square package allows for efficient use of PCB space, enabling compact designs that can maximize functionality.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle larger data sets and execute more complex operations, enhancing application capabilities.

No. of Terminals: 64

Having 64 terminals allows for a wide range of input/output operations, providing versatility for various interfacing needs.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style supports efficient thermal management and compatibility with modern PCB layouts, which is essential for high-performance applications.

Minimum Supply Voltage: 1.14 V

Lower minimum supply voltage allows for operation in a wider range of power supply conditions, contributing to system adaptability.

Maximum Operating Temperature: 105 °C

The ability to operate at high temperatures ensures reliability in demanding environments, making it suitable for industrial applications.

CPU Family: E200Z4

The E200Z4 CPU family is well-regarded for its performance and efficiency, making it suitable for a variety of control applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enhances robustness in extreme environmental conditions, ideal for automotive and outdoor applications.

ADC Channels: YES

Having built-in ADC channels allows for efficient analog-to-digital conversions directly on-chip, reducing external components.

DMA Channels: YES

Support for DMA channels enables efficient data transfer without CPU intervention, improving overall performance and reducing latency.

Terminal Position: QUAD

Quad-terminal positioning enhances connectivity options and PCB layout flexibility, making it adaptable for various designs.

ROM Words: 2097152

A large ROM capacity allows for extensive program storage, accommodating complex firmware and large codebases.

Maximum Seated Height: 1.2 mm

The low height profile facilitates compact designs with minimal space constraints on PCB layouts.

Width: 10 mm

The compact width allows it to fit into tight spaces on PCBs, making it ideal for space-constrained applications.

Data EEPROM Size: 64K

64K of EEPROM supports non-volatile data storage, allowing critical data retention even when power is lost.

Boundary Scan: YES

Boundary scan capability aids in efficient debugging and testing of PCB assemblies, improving manufacturing processes.

Peripherals: DMA(64), RTC, TIMER(8), WDT(2)

An array of peripherals enhances the microcontroller's capabilities, allowing for sophisticated timing, real-time clock functionality, and improved resource management.

Maximum Clock Frequency: 40 MHz

The high clock frequency allows for faster processing speeds, enabling high-performance applications.

Length: 10 mm

Alongside its width, the compact length ensures it is suitable for tight spaces, making it a versatile choice for embedded designs.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers high performance with low power consumption, making it ideal for energy-sensitive applications.

RAM Bytes: 131072

The substantial RAM size allows for more complex programs and data manipulation, enhancing application performance.

Technology: CMOS

CMOS technology contributes to lower power consumption and higher density of integration, valuable for modern electronic designs.

Terminal Form: GULL WING

Gull-wing terminals are easy to solder and provide reliable mechanical connections, improving manufacturability.

Analog To Digital Converters: 3-Ch 12-Bit, 1-Ch 10-Bit

High-resolution ADCs enable precise analog signal measurements, enhancing functionality for applications requiring accurate data capture.

Maximum Supply Current: 55 mA

A relatively low supply current is advantageous for battery-powered applications, promoting longer operational life.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage is optimized for low-power designs, further enhancing energy efficiency.

No. of DMA Channels: 64

Having a large number of DMA channels facilitates efficient data management without CPU interference, improving system throughput.

No. of Serial I/Os: 23

Having 23 serial I/O channels allows for flexible communication options, enhancing connectivity with other devices.

PWM Channels: YES

The inclusion of PWM channels allows for versatile control of motors and other devices, expanding the microcontroller's application potential.

Connectivity: CAN(8), DSPI(7), ETHERNET, I2C, LIN(14)

Rich connectivity options enable integration into various communication protocols, making it suitable for complex systems.

ROM Programmability: FLASH

Flash programmability allows for easy software updates and reprogramming, adding flexibility to product development.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for more connections in compact layouts, facilitating high-density PCB designs.

Format: FLOATING POINT

Support for floating-point operations improves performance in complex mathematical computations, beneficial for application-specific tasks.

Speed: 120 rpm

Designed for moderate-speed applications, the specified speed makes it versatile for many types of use cases.

Low Power Mode: YES

The low power mode feature extends battery life in portable applications by reducing energy consumption during idle periods.

On Chip Program ROM Width: 8

An 8-bit program ROM width ensures compatibility with a variety of programming languages and ease of use in embedded systems.

Technical Specifications

Microcontrollers SPC584B70E1EH00X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of Serial I/Os:

23

No. of Terminals:

64

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(8), DSPI(7), ETHERNET, I2C, LIN(14)

Peripherals:

DMA(64), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

3-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584B70E1EH00X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20