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SPC584B64E7EDC0X

STMicroelectronics

SPC584B64E7EDC0X by STMicroelectronics

SPC584B64E7EDC0X by STMicroelectronics is a 32-bit microcontroller with integrated cache, supporting up to 40 MHz clock frequency. It features AEC-Q100 screening, operates from -40 °C to 105 °C, and includes multiple connectivity options like CAN and Ethernet. Ideal for automotive applications, it ensures low power consumption with a nominal voltage of 1.2 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,959 parts In-Stock

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3,959

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Digiode

USA . 3,767 parts In-Stock

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3,767

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Anansix

USA . 466 parts In-Stock

1+ parts

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466

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 995 parts In-Stock

1+ parts

$14.840

100+ parts

-

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995

$14.840

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IDEA Electronic Components Group

UK . 2,012 parts In-Stock

1+ parts

$23.300

100+ parts

-

1k+ parts

$20.970

10k+ parts

-

2,012

$23.300

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$20.970

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MKK Technologies

India . 145 parts In-Stock

1+ parts

$43.814

100+ parts

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145

$43.814

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DigiPath Technology Company

USA . 145 parts In-Stock

1+ parts

$43.814

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145

$43.814

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Microchip USA

USA . 2,294 parts In-Stock

1+ parts

$44.884

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2,294

$44.884

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Component Stockers USA

USA . 447 parts In-Stock

1+ parts

$198.690

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447

$198.690

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Corphita

USA . 1,830 parts In-Stock

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1,830

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Parana Technologies

USA . 792 parts In-Stock

1+ parts

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$27.859

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792

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$27.859

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Overview

Unlock unparalleled performance with the SPC584B64E7EDC0X microcontroller from STMicroelectronics, a trusted leader in innovation. Designed for demanding applications, it combines robust features like integrated cache and low power consumption with exceptional reliability, meeting AEC-Q100 standards. Ideal for automotive, industrial, and IoT solutions, this advanced microcontroller empowers your projects with speed and efficiency, ensuring you stay ahead in a competitive market. Experience the value of precision engineering and elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a durable and lightweight enclosure, enhancing the microcontroller's reliability in various applications.

Integrated Cache: YES

The integrated cache improves data access speeds, resulting in enhanced performance and efficient execution of applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easier automated assembly, making it suitable for modern electronics manufacturing.

Maximum Supply Voltage: 1.26 V

A low maximum supply voltage aids in power efficiency, making this microcontroller ideal for battery-powered devices.

On Chip Data RAM Width: 8

An 8-bit RAM width supports efficient data processing for a variety of applications, offering a balance between performance and resource utilization.

Screening Level: AEC-Q100

AEC-Q100 certification ensures the microcontroller can withstand automotive-grade conditions, making it suitable for automotive applications.

Package Shape: SQUARE

A square package shape optimizes space on the PCB, making it easier to design compact electronic solutions.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle more complex calculations and larger data models, providing significant performance advantages.

No. of Terminals: 176

A high number of terminals allows for extensive connectivity and peripheral support, enabling rich feature sets in applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

This package style promotes efficient heat dissipation and low profile design, making it well-suited for compact environments.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage extends the microcontroller's application range into low-power and energy-efficient devices.

Maximum Operating Temperature: 105 °C

High operational temperature range ensures reliability in demanding environments, suitable for industrial and automotive applications.

CPU Family: E200Z4

The E200Z4 CPU family provides a robust architecture with advanced processing capabilities, ideal for high-performance applications.

Minimum Operating Temperature: -40 °C

A wide temperature range (-40 °C to 105 °C) ensures operation in extreme conditions, making it suitable for outdoor and industrial tasks.

ADC Channels: YES

Integrated ADC channels allow for direct analog signal processing, enhancing the microcontroller's capability in sensor applications.

DMA Channels: YES

Built-in DMA channels enable efficient data transfer without CPU intervention, optimizing performance in data-intensive applications.

Terminal Position: QUAD

Quad terminal positioning aids in better mounting stability and improves the overall performance of the connection on the PCB.

ROM Words: 1572864

A large number of ROM words allows for extensive programmability and functionality, supporting complex applications and large software stacks.

Maximum Seated Height: 1.6 mm

A low seated height enhances the microcontroller's compatibility with compact devices and space-constrained designs.

Width: 24 mm

Standard width facilitates easy integration into existing designs, ensuring compatibility with various PCB layouts.

Data EEPROM Size: 64K

A sizable EEPROM allows for non-volatile storage of configuration data and user settings, critical for many embedded applications.

Boundary Scan: YES

Boundary scan capability helps in testing and debugging manufactured PCBs, thus improving reliability and reducing post-production issues.

Peripherals: DMA(64), RTC, TIMER(8), WDT(2)

A rich set of peripheral options enhances the microcontroller's versatility, enabling it to handle diverse functionality in embedded systems.

Maximum Clock Frequency: 40 MHz

A high clock frequency supports fast processing speeds, ideal for applications requiring swift computations and real-time responses.

Length: 24 mm

The compact length supports space-efficient designs, facilitating integration into smaller electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures streamlined instruction sets for efficient processing, enhancing performance.

RAM Bytes: 131072

A generous amount of RAM allows for smoother multitasking and more robust memory handling in complex applications.

Technology: CMOS

CMOS technology provides low power consumption alongside high-speed performance, making it well-suited for portable applications.

Terminal Form: GULL WING

Gull wing terminals facilitate reliable surface mounting and enhance ease of soldering, improving manufacturing efficiency.

Analog To Digital Convertors: 3-Ch 12-Bit, 1-Ch 10-Bit

Multiple and high-resolution ADCs support precise analog signal measurement, essential for sensor applications in many systems.

Maximum Supply Current: 55 mA

A maximum supply current that balances performance with efficiency, suited for power-sensitive applications.

Nominal Supply Voltage: 1.2 V

This nominal voltage aligns with low-power design principles, enhancing the microcontroller's utility in energy-efficient products.

No. of DMA Channels: 64

64 DMA channels provide extensive capability for high-throughput tasks, maximizing efficiency in data handling.

No. of Serial I/Os: 23

A high count of serial I/Os delivers versatile communication options for connecting various peripherals, increasing application flexibility.

PWM Channels: YES

The inclusion of PWM channels enables precise control over analog devices, enhancing functionalities in motors and lights.

Connectivity: CAN(8), DSPI(7), ETHERNET, I2C, LIN(14)

Diverse connectivity options allow for integration across various communication protocols, broadening the microcontroller's application range.

ROM Programmability: FLASH

Flash programmability provides easy and efficient updating of firmware, improving the microcontroller's lifespan and adaptability.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density layouts, enabling more functionality in compact PCB designs.

Format: FLOATING POINT

Support for floating-point operations enhances computational accuracy for complex mathematical processing.

Speed: 120 rpm

The ability to achieve speeds up to 120 rpm indicates the microcontroller's efficiency in control applications, especially for motors.

Low Power Mode: YES

Low power mode contributes to energy efficiency, making it suitable for battery-operated and energy-sensitive devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width complements the microcontroller's processing capabilities, balancing performance and resource needs.

Technical Specifications

Microcontrollers SPC584B64E7EDC0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

64

No. of Serial I/Os:

23

No. of Terminals:

176

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

1572864

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(8), DSPI(7), ETHERNET, I2C, LIN(14)

Peripherals:

DMA(64), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

3-Ch 12-Bit, 1-Ch 10-Bit

Trade Compliance

SPC584B64E7EDC0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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