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SPC584B64E3ND00X

STMicroelectronics

SPC584B64E3ND00X by STMicroelectronics

SPC584B64E3ND00X by STMicroelectronics is a 32-bit microcontroller with 40 MHz clock frequency, ADC and DMA channels. It has a square package shape, 100 terminals, and operates at supply voltages b/w 1.14V to 1.26V. Ideal for applications requiring high-speed processing and precise analog-to-digital conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 2,000 parts In-Stock

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2,000

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Distributors (In-Stock)

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Vyrian

USA . 8,686 parts In-Stock

1+ parts

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8,686

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Digiode

USA . 2,704 parts In-Stock

1+ parts

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2,704

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Anansix

USA . 2,355 parts In-Stock

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2,355

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Nova Conductors

Japan . 21 parts In-Stock

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21

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Distributors (Availability)

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AZTECH Wire

Italy . 722 parts In-Stock

1+ parts

$9.310

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-

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722

$9.310

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Corohmni

South Africa . 1,030 parts In-Stock

1+ parts

$29.975

100+ parts

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1,030

$29.975

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Ampacity Inc.

Singapore . 1,552 parts In-Stock

1+ parts

$33.000

100+ parts

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1,552

$33.000

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Microchip USA

USA . 2,259 parts In-Stock

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$38.762

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2,259

$38.762

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IDEA Electronic Components Group

UK . 748 parts In-Stock

1+ parts

$58.388

100+ parts

-

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$52.549

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748

$58.388

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$52.549

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Aztec Data Supply Inc.

USA . 2,462 parts In-Stock

1+ parts

$73.696

100+ parts

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2,462

$73.696

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MKK Technologies

India . 447 parts In-Stock

1+ parts

$109.794

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447

$109.794

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DigiPath Technology Company

USA . 447 parts In-Stock

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$109.794

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447

$109.794

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Argo Parts USA

USA . 4,290 parts In-Stock

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4,290

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Continental Prestige Electronics

USA . 2,812 parts In-Stock

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2,812

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Parana Technologies

USA . 1,970 parts In-Stock

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$69.812

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1,970

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$69.812

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Corphita

USA . 1,728 parts In-Stock

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1,728

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Discover the power and precision of the SPC584B64E3ND00X microcontroller by STMicroelectronics. With a 32-bit architecture and advanced features like ADC and DMA channels, this device offers unparalleled performance in a compact package. From automotive to industrial applications, this microcontroller delivers reliability and efficiency. Trust STMicroelectronics, a leader in semiconductor innovation, to provide cutting-edge solutions for your projects. Upgrade your designs with the SPC584B64E3ND00X and experience the difference in quality and value that only STMicroelectronics can deliver.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, making this microcontroller suitable for small and portable devices.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and also ensures safe operation within specified voltage limits.

Package Shape: SQUARE

Square packages are easy to handle and provide efficient use of PCB real estate, making integration into circuit designs convenient.

Bit Size: 32

A 32-bit microcontroller offers high computational capabilities, making it suitable for applications requiring complex calculations and processing.

No. of Terminals: 100

Having 100 terminals allows for versatile connectivity options and interfacing with other components in a system.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The package styles offer flexibility in mounting options, heat dissipation capabilities, and compatibility with various PCB layouts.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures reliable operation even under low power conditions and helps in extending battery life for portable devices.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides good corrosion resistance, ensuring long-term reliability of the connections in the microcontroller.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors and signals, enhancing its versatility in capturing real-world data.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals and memory without CPU intervention, enhancing system performance and responsiveness.

Terminal Position: QUAD

Quad terminal position allows for secure and stable mounting on the PCB, ensuring reliable connections and robust mechanical support.

Width: 14 mm

The compact width dimension makes this microcontroller suitable for applications where space constraints are a concern.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency of 40 MHz enables fast processing and execution of instructions, making the microcontroller suitable for high-speed applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering during assembly processes, leading to robust connections and long-term reliability.

Length: 14 mm

The compact length dimension complements the width dimension, making this microcontroller suitable for applications demanding small form factors.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient and streamlined instruction execution, leading to high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and reliability during PCB assembly and operation, ensuring secure connections and long-term durability.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage specification indicates the optimal operating voltage for the microcontroller, ensuring stable and efficient performance.

PWM Channels: YES

PWM channels allow for precise control of analog signals, making this microcontroller suitable for applications requiring accurate modulation and control.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting on the PCB, making this microcontroller suitable for compact and miniaturized designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microcontroller is sensitive to moisture, requiring proper handling and storage to prevent damage during assembly and operation.

Speed: 120 rpm

The speed specification may refer to the maximum clock speed or processing speed of the microcontroller, indicating its performance capabilities for various applications.

Technical Specifications

Microcontrollers SPC584B64E3ND00X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

120 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC584B64E3ND00X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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