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SPC584B64E1NH00X

STMicroelectronics

SPC584B64E1NH00X by STMicroelectronics

SPC584B64E1NH00X from STMicroelectronics is a 32-bit microcontroller designed for low-power applications, operating b/w 1.14V and 1.26V. It features up to 40 MHz clock speed, ADC & PWM channels, making it ideal for embedded systems. Its compact flatpack design ensures efficient thermal management in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,956 parts In-Stock

1+ parts

-

100+ parts

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2,956

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-

-

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Digiode

USA . 2,795 parts In-Stock

1+ parts

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-

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2,795

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Anansix

USA . 414 parts In-Stock

1+ parts

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414

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 330 parts In-Stock

1+ parts

$8.490

100+ parts

-

1k+ parts

-

10k+ parts

-

330

$8.490

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IDEA Electronic Components Group

UK . 1,020 parts In-Stock

1+ parts

$20.913

100+ parts

-

1k+ parts

$18.821

10k+ parts

-

1,020

$20.913

-

$18.821

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Microchip USA

USA . 3,357 parts In-Stock

1+ parts

$31.462

100+ parts

-

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3,357

$31.462

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MKK Technologies

India . 500 parts In-Stock

1+ parts

$39.325

100+ parts

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500

$39.325

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DigiPath Technology Company

USA . 500 parts In-Stock

1+ parts

$39.325

100+ parts

-

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500

$39.325

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Component Stockers USA

USA . 687 parts In-Stock

1+ parts

$148.560

100+ parts

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687

$148.560

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Parana Technologies

USA . 245 parts In-Stock

1+ parts

-

100+ parts

$25.004

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245

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$25.004

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Corphita

USA . 230 parts In-Stock

1+ parts

-

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230

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Overview

Unlock unparalleled performance with the SPC584B64E1NH00X microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for precision and efficiency, this cutting-edge component excels in various applications, from automotive to industrial automation. With its compact, easy-to-integrate design, you’ll enjoy enhanced reliability and power savings, empowering your projects with speed and versatility that stand out in today’s competitive landscape.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for a compact design, making it ideal for space-constrained applications.

Maximum Supply Voltage: 1.26 V

A maximum supply voltage of 1.26 V ensures low power consumption, beneficial for battery-operated devices.

Package Shape: SQUARE

The square package shape facilitates efficient use of PCB space and simplifies layout design.

Bit Size: 32

The 32-bit architecture enables efficient processing and higher performance for complex applications.

No. of Terminals: 64

With 64 terminals, this microcontroller provides ample connectivity options for various peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style enhances thermal performance and is suited for high-density applications.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage allows for flexibility in power supply options and energy-efficient designs.

ADC Channels: YES

Built-in ADC channels enable easy interfacing with analog sensors, expanding the application's capabilities.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer, freeing up processor resources for other tasks.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity, making it versatile for various circuit layouts.

Width: 10 mm

A compact width of 10 mm is suitable for tight spaces, assuring compatibility with various designs.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz ensures fast processing speeds, suitable for demanding applications.

Length: 10 mm

The 10 mm length contributes to a small form factor, ideal for portable electronic designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Based on RISC architecture, this microcontroller offers efficient instruction execution for better performance.

Terminal Form: GULL WING

The gull wing terminal form provides effective soldering capabilities, improving reliability in assembly.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V further optimizes power efficiency, crucial for low-power applications.

PWM Channels: YES

Inclusion of PWM channels allows for precise control of motors and lights, enhancing design versatility.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch is conducive to high-density designs, accommodating more interconnections in smaller areas.

Speed: 120 rpm

A speed rating of 120 rpm indicates reliable performance for applications involving motor control or similar tasks.

Technical Specifications

Microcontrollers SPC584B64E1NH00X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Speed:

120 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

SPC584B64E1NH00X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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