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SPC570S40E1CEFAR

STMicroelectronics

SPC570S40E1CEFAR by STMicroelectronics

SPC570S40E1CEFAR by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 3.63V and operates at up to 40 MHz. It features ADC and DMA channels, making it ideal for automotive applications. Its compact FLATPACK design ensures efficient space utilization.

Median Price

$6.400

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,000 parts In-Stock

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-

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1,000

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Vyrian

USA . 11,998 parts In-Stock

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11,998

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-

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Digiode

USA . 4,045 parts In-Stock

1+ parts

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4,045

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TME

Poland . 1,000 parts In-Stock

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-

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-

1k+ parts

$6.400

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1,000

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-

$6.400

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Anansix

USA . 870 parts In-Stock

1+ parts

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870

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Distributors (Availability)

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Component Stockers USA

USA . 4,863 parts In-Stock

1+ parts

$6.490

100+ parts

$6.490

1k+ parts

$6.490

10k+ parts

-

4,863

$6.490

$6.490

$6.490

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AZTECH Wire

Italy . 1,216 parts In-Stock

1+ parts

$19.990

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1,216

$19.990

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Microchip USA

USA . 113 parts In-Stock

1+ parts

$21.868

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113

$21.868

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IDEA Electronic Components Group

UK . 976 parts In-Stock

1+ parts

$50.105

100+ parts

-

1k+ parts

$45.095

10k+ parts

-

976

$50.105

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$45.095

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MKK Technologies

India . 2,040 parts In-Stock

1+ parts

$94.219

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2,040

$94.219

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DigiPath Technology Company

USA . 2,040 parts In-Stock

1+ parts

$94.219

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2,040

$94.219

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Corphita

USA . 4,762 parts In-Stock

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4,762

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Parana Technologies

USA . 2,061 parts In-Stock

1+ parts

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$59.908

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2,061

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$59.908

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Vigor

Singapore . 1,691 parts In-Stock

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1,691

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Overview

Unlock the future of innovation with the SPC570S40E1CEFAR microcontroller from STMicroelectronics. Renowned for their reliability and cutting-edge technology, STMicroelectronics delivers unmatched performance and versatility in a compact design. Perfect for automotive applications, industrial control, and IoT devices, this microcontroller ensures efficiency and seamless connectivity. Experience exceptional value that enhances your projects with speed, precision, and robust capabilities.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact designs and efficient use of space on PCBs, making this microcontroller a great choice for modern applications.

Maximum Supply Voltage: 3.63 V

With a maximum supply voltage of 3.63 V, this microcontroller supports a wide range of power supply options, ensuring versatility in application.

Package Shape: SQUARE

The square package shape offers uniformity in layout and can simplify thermal management in compact designs.

Bit Size: 32

A 32-bit architecture allows for higher performance and efficiency, making it suitable for applications requiring complex computations.

No. of Terminals: 64

With 64 terminals, this microcontroller provides ample I/O options, enabling the connection of multiple peripherals and functionalities.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This package style is designed for efficient heat dissipation and space-saving configurations, making it ideal for high-density applications.

Minimum Supply Voltage: 2.97 V

The minimum supply voltage ensures compatibility with more power-efficient designs, allowing the microcontroller to operate in battery-powered applications.

ADC Channels: YES

Integrated ADC channels facilitate analog-to-digital signal conversion, making it excellent for sensor interfacing and data acquisition tasks.

DMA Channels: YES

DMA channels enhance data transfer efficiency and processor performance by allowing peripherals to communicate with memory without CPU intervention.

Terminal Position: QUAD

The quad terminal position allows for easy PCB routing and a flexible layout, optimizing space and connectivity.

Width: 10 mm

Compact width makes it suitable for tight spaces while ensuring integration into small form factor devices.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz ensures swift processing capabilities, making it capable of handling demanding tasks in real time.

Length: 10 mm

The length of 10 mm contributes to a small footprint, ideal for space-constrained applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC-based microcontroller, it offers a reduced instruction set for efficient processing and power management.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder joints and ease of handling during assembly, enhancing manufacturing efficiency.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V offers compatibility with numerous modern components, making for an efficient system design.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density layouts while maintaining soldering integrity, suitable for advanced applications.

Speed: 80 rpm

While this specification may pertain to mechanical applications, a speed rating of 80 rpm indicates suitability for certain control applications without exceeding limits.

Technical Specifications

Microcontrollers SPC570S40E1CEFAR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of Terminals:

64

PWM Channels:

NO

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

80 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

SPC570S40E1CEFAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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