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SPC56EL70L3CBFSY

STMicroelectronics

SPC56EL70L3CBFSY by STMicroelectronics

SPC56EL70L3CBFSY microcontroller by STMicroelectronics features 32-bit architecture, 16-bit address bus, and 40 MHz clock frequency. Ideal for applications requiring high-speed processing, such as automotive engine control units and industrial automation systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,833 parts In-Stock

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9,833

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Anansix

USA . 847 parts In-Stock

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847

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Digiode

USA . 372 parts In-Stock

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372

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Distributors (Availability)

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AZTECH Wire

Italy . 105 parts In-Stock

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$9.770

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105

$9.770

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IDEA Electronic Components Group

UK . 2,319 parts In-Stock

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$79.482

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$71.534

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2,319

$79.482

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$71.534

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MKK Technologies

India . 1,568 parts In-Stock

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$149.462

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1,568

$149.462

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DigiPath Technology Company

USA . 1,568 parts In-Stock

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$149.462

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1,568

$149.462

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QUARKTWIN TECHNOLOGY LTD

USA . 14,758 parts In-Stock

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14,758

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Corphita

USA . 4,513 parts In-Stock

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Microchip USA

USA . 1,439 parts In-Stock

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1,439

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Parana Technologies

USA . 1,193 parts In-Stock

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$95.033

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1,193

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$95.033

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Unlock the potential of your electronic projects with the SPC56EL70L3CBFSY microcontroller by STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers cutting-edge technology in a compact package. This versatile microcontroller is perfect for a wide range of applications, offering advanced features such as ADC and DMA channels, PWM channels, and a maximum clock frequency of 40 MHz. With its low profile and fine pitch package style, this microcontroller is ideal for space-constrained designs. Elevate your projects with the value and performance that the SPC56EL70L3CBFSY brings to the table.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller and lighter packaging, making this microcontroller suitable for compact and lightweight electronic devices.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage offers flexibility in powering the microcontroller, allowing it to be used in various voltage environments.

Address Bus Width: 16

A wider address bus allows for a larger memory capacity and more efficient data processing, increasing the overall performance of the microcontroller.

Package Shape: SQUARE

The square package shape is easy to handle and integrate into circuit designs, providing a neat and organized layout for the electronic device.

Bit Size: 32

A 32-bit architecture enables the microcontroller to process data in larger chunks, enhancing the speed and efficiency of the device's operations.

No. of Terminals: 100

Having a higher number of terminals allows for more connectivity options and peripheral device integration, making the microcontroller versatile for various applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact and low-profile design, making it ideal for space-constrained applications and ensuring efficient heat dissipation.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage requirement ensures efficient power consumption and compatibility with a wide range of power sources, increasing the microcontroller's versatility.

ADC Channels: YES

Analog-to-digital converter (ADC) channels enable the microcontroller to process analog signals, making it suitable for interfacing with sensors and other analog devices.

DMA Channels: YES

Direct memory access (DMA) channels facilitate efficient data transfer between memory and peripherals without CPU intervention, enhancing the microcontroller's overall performance.

Terminal Position: QUAD

A quad terminal position provides multiple points of contact for secure and reliable connections, ensuring stable operation in demanding environmental conditions.

ROM Words: 524288

A large ROM capacity allows for storing a significant amount of program code and data, enabling complex algorithms and applications to be implemented on the microcontroller.

Width: 14 mm

The compact width of the microcontroller makes it suitable for space-constrained designs, offering flexibility in integrating the device into various electronic products.

External Data Bus Width: 8

An external data bus width of 8 bits allows for efficient data transfer between the microcontroller and external memory devices, enhancing the overall performance of the system.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency enables fast processing speeds and real-time operations, making the microcontroller suitable for applications that require quick response times.

Length: 14 mm

The compact length of the microcontroller offers flexibility in designing compact electronic devices, ensuring a space-saving solution for various applications.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC (Reduced Instruction Set Computing) architecture offers simplified instructions and efficient data processing, enhancing the microcontroller's performance and power efficiency.

Technology: CMOS

Complementary metal-oxide-semiconductor (CMOS) technology provides low power consumption and high noise immunity, making the microcontroller reliable and energy-efficient.

Terminal Form: GULL WING

Gull wing terminal form provides a secure and reliable connection for soldering the microcontroller onto circuit boards, ensuring long-term stability and durability.

Nominal Supply Voltage: 3 V

The nominal supply voltage requirement offers compatibility with standard power sources, making the microcontroller easy to integrate into existing electronic designs.

PWM Channels: YES

Pulse-width modulation (PWM) channels allow for precise control of analog signals, making the microcontroller suitable for applications that require accurate voltage or current regulation.

Terminal Pitch: 0.5 mm

A fine terminal pitch provides a high density of terminals for efficient connectivity, allowing for a compact and space-saving layout in electronic designs.

Speed: 120 rpm

With a speed of 120 revolutions per minute, this microcontroller can efficiently process data and execute instructions at a fast pace, ensuring rapid performance in various applications.

No. of I/O Lines: 83

Having a high number of input/output (I/O) lines offers flexibility in connecting to external devices and peripherals, making the microcontroller versatile for a wide range of applications.

Technical Specifications

Microcontrollers SPC56EL70L3CBFSY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

8

Length:

14 mm

No. of I/O Lines:

83

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

524288

Speed:

120 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC56EL70L3CBFSY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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