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SPC56EL60L3CBFSR

STMicroelectronics

SPC56EL60L3CBFSR by STMicroelectronics

SPC56EL60L3CBFSR by STMicroelectronics is a 32-bit microcontroller with 1048576 ROM words, 131072 RAM bytes, and 64 external data bus width. Ideal for automotive applications due to its temperature grade of -40 to 125 °C, it offers PWM channels, ADC and DMA channels for versatile control systems. With a max clock frequency of 40 MHz, this microcontroller is suitable for high-speed operations in automotive electronics.

Median Price

$13.610

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 1,000 parts In-Stock

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Vyrian

USA . 6,111 parts In-Stock

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6,111

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Digiode

USA . 1,502 parts In-Stock

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1,502

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TME

Poland . 1,000 parts In-Stock

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-

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$13.610

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1,000

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$13.610

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Anansix

USA . 151 parts In-Stock

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151

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ComSIT Distribution GmbH

Germany . 11 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 2,956 parts In-Stock

1+ parts

$13.580

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2,956

$13.580

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AZTECH Wire

Italy . 229 parts In-Stock

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$21.890

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229

$21.890

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Microchip USA

USA . 3,262 parts In-Stock

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$43.336

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3,262

$43.336

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IDEA Electronic Components Group

UK . 1,744 parts In-Stock

1+ parts

$69.780

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$62.802

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1,744

$69.780

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$62.802

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MKK Technologies

India . 873 parts In-Stock

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$131.217

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873

$131.217

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DigiPath Technology Company

USA . 873 parts In-Stock

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$131.217

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873

$131.217

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Component Stockers USA

USA . 557 parts In-Stock

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$208.740

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557

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Parana Technologies

USA . 1,505 parts In-Stock

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$83.433

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Corphita

USA . 1,358 parts In-Stock

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1,358

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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Overview

Unleash the power of innovation with the SPC56EL60L3CBFSR microcontroller by STMicroelectronics. This cutting-edge device offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for automotive applications, this microcontroller provides seamless performance and efficiency, making it the perfect choice for a wide range of projects. Experience the value and benefits that only STMicroelectronics can deliver, and elevate your designs to new heights with the SPC56EL60L3CBFSR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product reliable for long-term use.

Maximum Supply Voltage: 3.63 V

Higher maximum supply voltage allows for versatility in power input, accommodating a wide range of applications.

Address Bus Width: 32

A wider address bus width allows for efficient data transfer and processing, enhancing performance.

Bit Size: 32

32-bit architecture provides high-speed processing capabilities, making the product suitable for complex tasks.

ROM Words: 1048576

Large ROM capacity enables storing a significant amount of program memory, enhancing the versatility of the product.

RAM Bytes: 131072

Ample RAM size allows for efficient data storage and manipulation, improving overall system performance.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast data processing and execution, making the product suitable for real-time applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product integrates various peripherals on a single chip, reducing system complexity and cost.

Technical Specifications

Microcontrollers SPC56EL60L3CBFSR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

16

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

311.6 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC56EL60L3CBFSR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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