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SPC56EL54L5CBFSY

STMicroelectronics

SPC56EL54L5CBFSY by STMicroelectronics

SPC56EL54L5CBFSY by STMicroelectronics is a 32-bit microcontroller with 3.3V power supply, 40MHz clock frequency, and 64-bit external data bus width. Ideal for automotive applications due to its automotive temperature grade and flash ROM programmability for enhanced performance in vehicles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,594 parts In-Stock

1+ parts

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7,594

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Digiode

USA . 2,326 parts In-Stock

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2,326

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Anansix

USA . 970 parts In-Stock

1+ parts

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970

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 274 parts In-Stock

1+ parts

$12.660

100+ parts

-

1k+ parts

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274

$12.660

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Vigor

Singapore . 2,524 parts In-Stock

1+ parts

$14.660

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-

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2,524

$14.660

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IDEA Electronic Components Group

UK . 2,312 parts In-Stock

1+ parts

$38.002

100+ parts

-

1k+ parts

$34.201

10k+ parts

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2,312

$38.002

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$34.201

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Microchip USA

USA . 1,695 parts In-Stock

1+ parts

$46.817

100+ parts

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1,695

$46.817

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MKK Technologies

India . 1,797 parts In-Stock

1+ parts

$71.459

100+ parts

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1,797

$71.459

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DigiPath Technology Company

USA . 1,797 parts In-Stock

1+ parts

$71.459

100+ parts

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1,797

$71.459

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Corphita

USA . 4,491 parts In-Stock

1+ parts

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4,491

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Parana Technologies

USA . 1,134 parts In-Stock

1+ parts

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100+ parts

$45.437

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1,134

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$45.437

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Overview

Discover the innovative SPC56EL54L5CBFSY microcontroller by STMicroelectronics, a leading manufacturer known for its cutting-edge technology and reliable products. Designed for a wide range of applications in the automotive industry, this high-quality microcontroller offers exceptional value with its advanced features and benefits. With superior performance and efficiency, customers can trust this product to deliver seamless operation and optimize their projects. Upgrade your systems with the SPC56EL54L5CBFSY and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.63 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wider range of systems.

Address Bus Width: 32

A wider address bus allows for the handling of larger amounts of memory and data, making the microcontroller suitable for complex applications.

Package Shape: SQUARE

Square packages are often more space-efficient and easier to handle during assembly, making the microcontroller suitable for compact designs.

Bit Size: 32

A 32-bit architecture enables the microcontroller to process larger chunks of data at once, improving overall performance and speed.

Power Supplies (V): 3.3

The 3.3V power supply is a common standard in electronics, making the microcontroller compatible with a wide range of devices and systems.

No. of Terminals: 144

Having a high number of terminals allows for versatile connectivity options and integration with various peripherals, enhancing the functionality of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

These package styles offer a compact and low-profile design, suitable for space-constrained applications while also providing high connection density.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures that the microcontroller can operate efficiently even with lower power sources, increasing its versatility.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance allows the microcontroller to withstand harsh environmental conditions and maintain reliability in extreme circumstances.

CPU Family: SPC56

Being part of a specific CPU family ensures compatibility with existing hardware and software ecosystems, making integration easier for developers.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function reliably in cold environments, expanding its range of potential applications.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels enables the microcontroller to interface with analog sensors and signals, broadening its utility in various sensing applications.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency by allowing peripherals to directly access memory without CPU involvement, boosting overall system performance.

Terminal Position: QUAD

A quad terminal position offers convenient placement and connection options, facilitating PCB layout and reducing wiring complexity during assembly.

ROM Words: 786432

With a large ROM capacity, the microcontroller can store a substantial amount of program code and data, enabling complex algorithms and applications to be implemented.

Width: 20 mm

The compact width dimension allows for flexibility in board layout and design, accommodating space-constrained applications and compact form factors.

External Data Bus Width: 64

A wide external data bus width allows for faster data transfer between the microcontroller and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency enables the microcontroller to execute instructions quickly and efficiently, making it suitable for demanding real-time applications.

Length: 20 mm

The compact length dimension contributes to overall space efficiency and design flexibility, enabling the microcontroller to fit into compact and tightly packed layouts.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, the microcontroller meets stringent temperature and quality standards required for reliable operation in automotive environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and functions on a single chip, providing a cost-effective and space-efficient solution for embedded applications.

RAM Bytes: 98304

The sizable RAM capacity allows the microcontroller to efficiently store and manipulate data during program execution, supporting complex algorithms and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-powered and noise-sensitive applications.

Terminal Form: GULL WING

Gull-wing terminals provide secure and reliable connections on the PCB, reducing the risk of solder joint failures and ensuring long-term reliability in operation.

Maximum Supply Current: 311.6 mA

The specified maximum supply current rating indicates the power consumption of the microcontroller under load, helping in estimating power requirements for the system.

Nominal Supply Voltage: 3.3 V

Having a consistent nominal supply voltage simplifies system design and ensures stable operation, as all components can be designed around this standard voltage level.

PWM Channels: YES

The availability of Pulse-Width Modulation channels enables the microcontroller to generate precise analog output signals, making it suitable for controlling motors, LEDs, and other devices.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and convenient firmware updates and modifications, ensuring flexibility and adaptability in the field for the microcontroller.

Terminal Pitch: 0.5 mm

A narrow terminal pitch facilitates high-density connections on the PCB, enabling compact designs and reducing PCB footprint for the microcontroller.

Speed: 120 rpm

The specified speed rating indicates the processing capability of the microcontroller, allowing for efficient execution of instructions and tasks within the specified operating parameters.

No. of I/O Lines: 16

Having 16 input/output lines provides sufficient connectivity for interfacing with external devices and peripherals, enhancing the versatility and flexibility of the microcontroller in system integration.

Technical Specifications

Microcontrollers SPC56EL54L5CBFSY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

16

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

786432

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

311.6 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC56EL54L5CBFSY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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