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SPC56EL54L3CBFSY

STMicroelectronics

SPC56EL54L3CBFSY by STMicroelectronics

SPC56EL54L3CBFSY by STMicroelectronics is a 32-bit microcontroller with 64-bit external data bus width, operating at up to 40 MHz. Ideal for automotive applications, it features 98304 bytes of RAM, flash ROM programmability, and ADC/DMA channels for efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,057 parts In-Stock

1+ parts

-

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10,057

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-

-

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Digiode

USA . 3,094 parts In-Stock

1+ parts

-

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-

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3,094

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Anansix

USA . 2,703 parts In-Stock

1+ parts

-

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2,703

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Greenchips

USA . 33 parts In-Stock

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33

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SIE Connect GmbH - GreenChips

Germany . 33 parts In-Stock

1+ parts

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33

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,702 parts In-Stock

1+ parts

$13.580

100+ parts

-

1k+ parts

-

10k+ parts

-

1,702

$13.580

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-

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AZTECH Wire

Italy . 1,066 parts In-Stock

1+ parts

$18.890

100+ parts

-

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1,066

$18.890

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IDEA Electronic Components Group

UK . 1,933 parts In-Stock

1+ parts

$43.301

100+ parts

-

1k+ parts

$38.971

10k+ parts

-

1,933

$43.301

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$38.971

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Microchip USA

USA . 2,850 parts In-Stock

1+ parts

$43.856

100+ parts

-

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2,850

$43.856

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MKK Technologies

India . 1,302 parts In-Stock

1+ parts

$81.424

100+ parts

-

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1,302

$81.424

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DigiPath Technology Company

USA . 1,302 parts In-Stock

1+ parts

$81.424

100+ parts

-

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1,302

$81.424

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-

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Corphita

USA . 1,067 parts In-Stock

1+ parts

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1,067

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Parana Technologies

USA . 650 parts In-Stock

1+ parts

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100+ parts

$51.773

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650

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$51.773

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Overview

Unleash the power of innovation with the SPC56EL54L3CBFSY microcontroller by STMicroelectronics. Crafted with precision and expertise, this cutting-edge device is designed to elevate your projects to new heights. Ideal for a wide range of applications, from automotive to industrial, this microcontroller offers unparalleled performance and reliability. Experience seamless integration, efficient operation, and unmatched flexibility with this state-of-the-art product. Elevate your designs and exceed expectations with the SPC56EL54L3CBFSY microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection, making the product resistant to impact and moisture.

Maximum Supply Voltage: 3.63 V

Higher supply voltage allows for better performance and stability in various operating conditions.

Bit Size: 32

32-bit processing capability offers enhanced speed and efficiency in executing commands and handling data.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller means this product integrates various functions in a single chip, reducing overall component count and complexity.

Maximum Clock Frequency: 40 MHz

Higher clock frequency enables faster operation and response times, crucial for time-sensitive applications.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature ranges, ensuring reliability and performance in challenging environments.

RAM Bytes: 98304

Large RAM size allows for efficient data storage and processing, accommodating complex algorithms and applications.

ROM Programmability: FLASH

Flash programmability offers flexibility in updating firmware and software, enabling customization and future-proofing of the product.

Technical Specifications

Microcontrollers SPC56EL54L3CBFSY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

16

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

786432

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

311.6 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC56EL54L3CBFSY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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