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SPC56EC70L7C9E0X

STMicroelectronics

SPC56EC70L7C9E0X by STMicroelectronics

SPC56EC70L7C9E0X by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 40 MHz. Ideal for automotive applications, it features 27-Ch 10-Bit ADCs, CAN(6), and low power mode. With 262144 RAM bytes and DMA(32) peripherals, it offers high performance in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,070 parts In-Stock

1+ parts

-

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3,070

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Digiode

USA . 1,401 parts In-Stock

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1,401

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Anansix

USA . 1,162 parts In-Stock

1+ parts

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1,162

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 5,768 parts In-Stock

1+ parts

$14.650

100+ parts

-

1k+ parts

-

10k+ parts

-

5,768

$14.650

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-

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AZTECH Wire

Italy . 602 parts In-Stock

1+ parts

$15.770

100+ parts

-

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-

602

$15.770

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Microchip USA

USA . 2,538 parts In-Stock

1+ parts

$47.362

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-

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2,538

$47.362

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IDEA Electronic Components Group

UK . 797 parts In-Stock

1+ parts

$66.558

100+ parts

-

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$59.902

10k+ parts

-

797

$66.558

-

$59.902

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MKK Technologies

India . 1,720 parts In-Stock

1+ parts

$125.159

100+ parts

-

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1,720

$125.159

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DigiPath Technology Company

USA . 1,720 parts In-Stock

1+ parts

$125.159

100+ parts

-

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1,720

$125.159

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QUARKTWIN TECHNOLOGY LTD

USA . 26,234 parts In-Stock

1+ parts

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26,234

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Corphita

USA . 3,058 parts In-Stock

1+ parts

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3,058

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 266 parts In-Stock

1+ parts

-

100+ parts

$79.581

1k+ parts

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10k+ parts

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266

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$79.581

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Overview

Unleash the power of innovation with the SPC56EC70L7C9E0X microcontroller from STMicroelectronics. This cutting-edge device offers unparalleled quality and reliability, backed by the renowned reputation of its manufacturer. Ideal for automotive applications, this microcontroller delivers superior performance and efficiency, making it a top choice for professionals looking to elevate their designs. Experience the value and benefits of advanced technology with the SPC56EC70L7C9E0X – where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Support for up to 3.6V supply voltage provides flexibility in power requirements.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB space.

Bit Size: 32

32-bit architecture offers increased performance and capability.

No. of Terminals: 176

Ample terminals for connecting various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack design with low profile and fine pitch enables compact PCB layout.

Minimum Supply Voltage: 3 V

Support for as low as 3V supply voltage for power efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature suitable for automotive and industrial applications.

CPU Family: E200Z4

E200Z4 CPU family offers efficient processing power for various tasks.

No. of External Interrupts: 24

Multiple external interrupts enable efficient handling of external events and communications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature suitable for harsh environments and extended applications.

ADC Channels: YES

On-board ADC channels for analog signal processing capabilities.

DMA Channels: YES

Support for Direct Memory Access (DMA) channels for efficient data transfer and processing.

Terminal Position: QUAD

Quad terminal position for robust connectivity and stability.

ROM Words: 2097152

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low seated height for space-constrained designs.

Width: 24 mm

Compact width for efficient PCB layout.

Data EEPROM Size: 64K

Sufficient Data EEPROM size for storing configuration and data.

Boundary Scan: YES

Boundary scan capability for efficient testing and debugging.

Peripherals: DMA(32), RTC, TIMER(12), WDT

Rich set of peripherals including DMA, Real-Time Clock, Timers, and Watchdog Timer for enhanced functionality.

Maximum Clock Frequency: 40 MHz

High clock frequency for fast processing and operation.

Length: 24 mm

Compact length for space-efficient designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating for reliable operation in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing (RISC) architecture for efficient processing.

RAM Bytes: 262144

Large RAM capacity for data storage and manipulation during operation.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for reliable solder joints and connectivity.

Analog To Digital Convertors: 27-Ch 10-Bit; 5-Ch 12-Bit

On-board ADCs with multiple channels and high resolution for precise analog-to-digital conversion.

Maximum Supply Current: 300 mA

Support for up to 300mA supply current for powering external components.

Nominal Supply Voltage: 3.3 V

Stable 3.3V nominal supply voltage for consistent operation.

No. of DMA Channels: 32

Multiple DMA channels for efficient data transfer and processing.

PWM Channels: YES

Support for Pulse Width Modulation (PWM) channels for precise control of output signals.

Connectivity: CAN(6), ETHERNET, I2C, SCI(10), SPI(8)

Multiple connectivity options including CAN, Ethernet, I2C, SCI, and SPI for versatile communication.

ROM Programmability: FLASH

Flash ROM programmability for easy and quick updates to the program memory.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm for compact PCB design.

Format: FIXED POINT

Fixed-point format for efficient numerical computation and accuracy.

Speed: 120 rpm

High speed operation at 120 revolutions per minute for quick processing.

Low Power Mode: YES

Low power mode for energy-saving operation and extended battery life.

On Chip Program ROM Width: 8

8-bit wide program ROM for storing program instructions efficiently.

No. of I/O Lines: 147

Abundant I/O lines for connecting external devices and peripherals.

Technical Specifications

Microcontrollers SPC56EC70L7C9E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5V NOMINAL SUPPLY, ALSO HAVING SHARED 19-CHANNELS OF ADC

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

24

No. of I/O Lines:

147

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

262144

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(6), ETHERNET, I2C, SCI(10), SPI(8)

Peripherals:

DMA(32), RTC, TIMER(12), WDT

Analog To Digital Convertors:

27-Ch 10-Bit; 5-Ch 12-Bit

Trade Compliance

SPC56EC70L7C9E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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