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SPC56AP60L3CEFAY

STMicroelectronics

SPC56AP60L3CEFAY by STMicroelectronics

STMicroelectronics SPC56AP60L3CEFAY is a 32-bit microcontroller with 5.5V max supply voltage, 40MHz clock frequency, and 65 I/O lines. It is used in applications requiring high-speed processing, such as automotive control systems and industrial automation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,292 parts In-Stock

1+ parts

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7,292

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Anansix

USA . 2,218 parts In-Stock

1+ parts

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1k+ parts

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2,218

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Digiode

USA . 852 parts In-Stock

1+ parts

-

100+ parts

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852

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,099 parts In-Stock

1+ parts

$10.660

100+ parts

-

1k+ parts

-

10k+ parts

-

1,099

$10.660

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-

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Microchip USA

USA . 1,937 parts In-Stock

1+ parts

$26.176

100+ parts

-

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-

10k+ parts

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1,937

$26.176

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IDEA Electronic Components Group

UK . 1,455 parts In-Stock

1+ parts

$40.850

100+ parts

-

1k+ parts

$36.765

10k+ parts

-

1,455

$40.850

-

$36.765

-

Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$50.564

100+ parts

$46.013

1k+ parts

$41.462

10k+ parts

-

300

$50.564

$46.013

$41.462

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MKK Technologies

India . 1,888 parts In-Stock

1+ parts

$76.815

100+ parts

-

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10k+ parts

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1,888

$76.815

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DigiPath Technology Company

USA . 1,888 parts In-Stock

1+ parts

$76.815

100+ parts

-

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10k+ parts

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1,888

$76.815

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Vigor

Singapore . 4,000 parts In-Stock

1+ parts

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4,000

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Parana Technologies

USA . 2,192 parts In-Stock

1+ parts

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100+ parts

$48.842

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2,192

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$48.842

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Corphita

USA . 1,378 parts In-Stock

1+ parts

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1,378

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Overview

Unleash the power of innovation with the SPC56AP60L3CEFAY microcontroller by STMicroelectronics. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. Whether you're in automotive, industrial, or consumer electronics, this microcontroller delivers exceptional value with its advanced features and capabilities. Elevate your projects to new heights with the SPC56AP60L3CEFAY and experience the difference that quality makes.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and secure mounting of the microcontroller on a PCB, allowing for efficient use of space in the design.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage allows for flexibility in the power supply design and operation of the microcontroller.

Address Bus Width: 32

A wider address bus width enables the microcontroller to access a larger memory space, improving its performance in handling complex operations.

Package Shape: SQUARE

The square package shape provides uniformity in dimensions, making it easy to integrate the microcontroller into various electronic systems.

Bit Size: 32

A 32-bit microcontroller can perform more complex calculations and operations compared to lower bit sizes, making it suitable for advanced applications.

No. of Terminals: 100

Having a higher number of terminals allows for more connectivity options and peripheral integration, enhancing the functionality of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style provides a compact and low-profile design for the microcontroller, making it suitable for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The lower minimum supply voltage ensures reliable operation even under lower power supply conditions, increasing the versatility of the microcontroller.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals to digital data, enabling it to interface with a wide range of sensors and components.

DMA Channels: YES

DMA channels help offload data transfer tasks from the CPU, improving overall system performance and efficiency.

Terminal Position: QUAD

The quad terminal positioning offers multiple connection points for easier PCB layout and soldering, enhancing the ease of integration of the microcontroller.

Width: 14 mm

A compact width dimension allows for easy placement of the microcontroller on a PCB while saving space for other components.

External Data Bus Width: 32

With a wide external data bus width, the microcontroller can efficiently transfer data to and from external devices, improving overall system performance.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency enables the microcontroller to process instructions at a faster rate, making it suitable for high-speed applications.

Length: 14 mm

A compact length dimension allows for efficient use of PCB real estate, especially in space-constrained designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers improved performance, power efficiency, and simplified instruction set, making it a suitable choice for embedded applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making the microcontroller reliable and energy-efficient.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections, ensuring reliable electrical connections and durability in varying environmental conditions.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a standard voltage level widely used in electronic systems, offering compatibility and ease of integration.

PWM Channels: YES

PWM channels allow the microcontroller to generate precise analog voltage levels, enabling tasks such as motor control and LED dimming.

Terminal Pitch: 0.5 mm

A tight terminal pitch of 0.5mm allows for compact PCB design and efficient use of space, especially in densely populated electronic systems.

Speed: 64 rpm

With a speed of 64 rpm, the microcontroller can efficiently process instructions and data, making it suitable for a wide range of applications that require high-speed operation.

No. of I/O Lines: 65

Having 65 I/O lines provides ample connectivity options for interfacing with external devices and components, enhancing the versatility and functionality of the microcontroller.

Technical Specifications

Microcontrollers SPC56AP60L3CEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC56AP60L3CEFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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