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SPC56AP54L3BEFBR

STMicroelectronics

SPC56AP54L3BEFBR by STMicroelectronics

STMicroelectronics SPC56AP54L3BEFBR microcontroller features 32-bit address and external data bus width, with 40 MHz max clock frequency. Ideal for applications requiring ADC and DMA channels, it operates at a speed of 64 rpm with a supply voltage range of 1.8V to 3.6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,013 parts In-Stock

1+ parts

-

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6,013

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Digiode

USA . 3,242 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,242

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Anansix

USA . 1,039 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,039

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 169 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

169

$1.000

-

-

-

Vigor

Singapore . 1,350 parts In-Stock

1+ parts

$6.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,350

$6.330

-

-

-

AZTECH Wire

Italy . 327 parts In-Stock

1+ parts

$13.150

100+ parts

-

1k+ parts

-

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-

327

$13.150

-

-

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Microchip USA

USA . 3,444 parts In-Stock

1+ parts

$20.236

100+ parts

-

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10k+ parts

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3,444

$20.236

-

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IDEA Electronic Components Group

UK . 197 parts In-Stock

1+ parts

$56.252

100+ parts

-

1k+ parts

$50.627

10k+ parts

-

197

$56.252

-

$50.627

-

MKK Technologies

India . 920 parts In-Stock

1+ parts

$105.779

100+ parts

-

1k+ parts

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10k+ parts

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920

$105.779

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-

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DigiPath Technology Company

USA . 920 parts In-Stock

1+ parts

$105.779

100+ parts

-

1k+ parts

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920

$105.779

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RC Electronics

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

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2,700

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

1+ parts

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100+ parts

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2,400

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Corphita

USA . 1,902 parts In-Stock

1+ parts

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1,902

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Parana Technologies

USA . 430 parts In-Stock

1+ parts

-

100+ parts

$67.258

1k+ parts

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430

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$67.258

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Overview

Experience top-notch quality and unparalleled performance with the SPC56AP54L3BEFBR microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics ensures reliability and innovation in every product. Ideal for a wide range of applications, this microcontroller offers customers exceptional value, benefits, and advantages. Unlock limitless possibilities and elevate your projects with the SPC56AP54L3BEFBR microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact mounting of the microcontroller on a PCB, making it suitable for small and densely populated electronics projects.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltage, providing flexibility in power supply options for different applications.

Address Bus Width: 32

A wider address bus allows for larger memory addressing capacity, enabling more complex programs and data handling.

Package Shape: SQUARE

The square package shape helps in efficient use of PCB space and allows for easier alignment during assembly.

Bit Size: 32

A 32-bit microcontroller can perform operations on larger data sizes and execute more complex instructions compared to lower bit microcontrollers.

No. of Terminals: 100

Having a higher number of terminals provides more I/O options for connecting to external devices and peripherals, enhancing the microcontroller's versatility.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low-profile, fine pitch package style offers compact size, low profile design, and fine pitch for high-density mounting, suitable for space-constrained applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for efficient power consumption, making it suitable for battery-powered and low-power applications.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels enables the microcontroller to read analog sensor values, making it suitable for applications that require analog signal processing.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfer between peripherals and memory without CPU intervention, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position provides better stability and alignment during soldering and assembly, ensuring reliable connections in the final product.

Width: 14 mm

Compact width enables space-efficient PCB layout and integration into small electronic devices.

External Data Bus Width: 32

A wider external data bus allows for faster data transfer between the microcontroller and external memory or peripherals, improving overall system performance.

Maximum Clock Frequency: 40 MHz

Higher clock frequency allows for faster data processing and execution of instructions, making the microcontroller suitable for applications that require high-speed operation.

Length: 14 mm

Compact length facilitates space-saving PCB design and integration in small form factor electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computer) architecture provides efficient instruction execution, enhancing the microcontroller's performance for embedded applications.

Technology: CMOS

CMOS technology offers low power consumption, higher noise immunity, and faster operation, making the microcontroller energy efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides reliable soldering connections and facilitates automated assembly processes, ensuring high-quality manufacturing.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures proper functioning of the microcontroller within specified voltage limits, improving system reliability.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of analog signals such as motor speed or LED brightness, adding versatility to the microcontroller for various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch provides high-density mounting capability, allowing for compact PCB design and integration in space-constrained applications.

Speed: 64 rpm

Operating at 64 revolutions per minute (rpm) allows for quick data processing and response time, making the microcontroller suitable for real-time control applications.

No. of I/O Lines: 65

Having 65 I/O lines provides ample interfacing options for connecting to various sensors, actuators, and external devices, enhancing the microcontroller's versatility in different applications.

Technical Specifications

Microcontrollers SPC56AP54L3BEFBR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC56AP54L3BEFBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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