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SPC564L70L5BBOSY

STMicroelectronics

SPC564L70L5BBOSY by STMicroelectronics

SPC564L70L5BBOSY by STMicroelectronics is a 32-bit microcontroller with 144 terminals, 16-bit address bus, and 8-bit external data bus. It operates at a max clock frequency of 40 MHz and features ADC and DMA channels. This microcontroller is ideal for applications requiring high-speed processing and precise analog-to-digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,795 parts In-Stock

1+ parts

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4,795

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Anansix

USA . 2,464 parts In-Stock

1+ parts

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2,464

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Digiode

USA . 2,340 parts In-Stock

1+ parts

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2,340

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 344 parts In-Stock

1+ parts

$19.930

100+ parts

-

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344

$19.930

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Microchip USA

USA . 1,646 parts In-Stock

1+ parts

$48.389

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1,646

$48.389

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IDEA Electronic Components Group

UK . 1,890 parts In-Stock

1+ parts

$63.011

100+ parts

-

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$56.710

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1,890

$63.011

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$56.710

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MKK Technologies

India . 516 parts In-Stock

1+ parts

$118.488

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516

$118.488

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DigiPath Technology Company

USA . 516 parts In-Stock

1+ parts

$118.488

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516

$118.488

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 2,242 parts In-Stock

1+ parts

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$75.339

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2,242

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$75.339

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Corphita

USA . 907 parts In-Stock

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907

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Overview

Unleash the power of innovation with the SPC564L70L5BBOSY microcontroller by STMicroelectronics. This top-of-the-line product offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this microcontroller provides customers with unmatched value, superior performance, and cutting-edge technology. Elevate your projects to new heights with the SPC564L70L5BBOSY and experience the difference that a high-quality microcontroller can make.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easier PCB assembly and space-saving design.

Maximum Supply Voltage: 3.63 V

Supports a wide range of input voltages for flexibility in power supply design.

Address Bus Width: 16

Allows for efficient memory addressing and data transfer within the processor.

Package Shape: SQUARE

Square shape enables compact placement on the PCB, saving space.

Bit Size: 32

Offers high computational capability and supports advanced applications.

No. of Terminals: 144

Provides ample I/O options for connecting external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style ensures a low-profile design and fine pitch for compact PCB layout.

Minimum Supply Voltage: 3.3 V

Supports low power operation and compatibility with various power sources.

ADC Channels: YES

Integrated ADC channels enable analog sensor interfacing and data conversion.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU load.

Terminal Position: QUAD

Quad terminal positions facilitate secure and stable connectivity on the PCB.

ROM Words: 524288

Large ROM size allows for extensive program storage and data handling.

Width: 19.8 mm

Compact width size enables space-efficient PCB design and layout.

External Data Bus Width: 8

8-bit external data bus width supports efficient data transfer and processing.

Maximum Clock Frequency: 40 MHz

High clock frequency provides fast processing speed for real-time applications.

Length: 19.8 mm

Similar to width, the compact length allows for space-saving PCB design.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller design offer efficient processing and control capabilities.

Technology: CMOS

CMOS technology ensures low power consumption and reliable performance.

Terminal Form: GULL WING

Gull wing terminal form provides robust mechanical connection and ease of soldering.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent performance and power efficiency.

PWM Channels: YES

PWM channels enable precise control of analog signals for motor and LED applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density PCB layout and compact design.

Speed: 120 rpm

Operates at a speed of 120 revolutions per minute for motor control applications.

No. of I/O Lines: 115

Ample I/O lines ensure versatile connectivity for interfacing with various peripherals.

Technical Specifications

Microcontrollers SPC564L70L5BBOSY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

8

Length:

19.8 mm

No. of I/O Lines:

115

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

524288

Speed:

120 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19.8 mm

Peripheral IC Type:

Trade Compliance

SPC564L70L5BBOSY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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