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SPC564L60L5CCFQR

STMicroelectronics

SPC564L60L5CCFQR by STMicroelectronics

SPC564L60L5CCFQR by STMicroelectronics is a 32-bit microcontroller with 3.3V power supply, 40MHz clock frequency, and 131072 bytes of RAM. Ideal for automotive applications due to its -40 to 125 °C operating temperature range, ADC and DMA channels, and FLASH ROM programmability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,573 parts In-Stock

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4,573

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Digiode

USA . 2,297 parts In-Stock

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2,297

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Anansix

USA . 716 parts In-Stock

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716

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Distributors (Availability)

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Vigor

Singapore . 4,900 parts In-Stock

1+ parts

$10.520

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4,900

$10.520

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IDEA Electronic Components Group

UK . 1,962 parts In-Stock

1+ parts

$17.934

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$16.141

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1,962

$17.934

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$16.141

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AZTECH Wire

Italy . 739 parts In-Stock

1+ parts

$21.570

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739

$21.570

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MKK Technologies

India . 2,147 parts In-Stock

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$33.725

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2,147

$33.725

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DigiPath Technology Company

USA . 2,147 parts In-Stock

1+ parts

$33.725

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2,147

$33.725

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Microchip USA

USA . 2,038 parts In-Stock

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$35.715

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2,038

$35.715

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Parana Technologies

USA . 1,947 parts In-Stock

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$21.443

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1,947

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$21.443

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Corphita

USA . 1,503 parts In-Stock

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1,503

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Overview

Unlock the power of innovation with the SPC564L60L5CCFQR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality microcontrollers that are perfect for a wide range of applications. From automotive to industrial, this microcontroller offers exceptional value, benefits, and advantages to customers looking for reliable performance and cutting-edge technology. Trust STMicroelectronics to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the microcontroller, making it suitable for various environments and applications.

Maximum Supply Voltage: 3.63 V

Higher maximum supply voltage allows for flexibility in power supply options and can handle different voltage levels without damage.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable operation of the microcontroller and its integrated circuits.

Maximum Operating Temperature: 125 °C

With a wide operating temperature range of -40 to 125 °C, this microcontroller can function effectively in harsh environmental conditions.

ADC Channels: YES

Integrated ADC channels provide the ability to convert analog signals to digital data, expanding the capabilities of the microcontroller for various sensor interfacing applications.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfer between memory and peripherals without CPU intervention, improving overall system performance.

ROM Words: 1048576

Large ROM capacity of 1048576 words allows for storing a significant amount of program code and data, enabling complex applications to be implemented.

RAM Bytes: 131072

Generous RAM capacity of 131072 bytes provides ample space for storing temporary data and variables, supporting efficient program execution and multitasking.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency of 40 MHz allows for fast processing and execution of instructions, making the microcontroller suitable for real-time applications.

Technology: CMOS

CMOS technology used in the microcontroller provides low power consumption, high noise immunity, and compatibility with a wide range of applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and features into a single chip, simplifying system design and reducing component count.

Technical Specifications

Microcontrollers SPC564L60L5CCFQR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

16

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

279 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC564L60L5CCFQR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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