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SPC564L60L3BCOQY

STMicroelectronics

SPC564L60L3BCOQY by STMicroelectronics

SPC564L60L3BCOQY by STMicroelectronics is a 32-bit microcontroller with 1048576 ROM words and 131072 RAM bytes. It operates at a max clock frequency of 40 MHz, suitable for industrial applications requiring high-speed processing. With PWM and ADC channels, it offers versatile I/O capabilities in a compact FLATPACK package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,844 parts In-Stock

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2,844

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Vyrian

USA . 2,594 parts In-Stock

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2,594

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Anansix

USA . 1,923 parts In-Stock

1+ parts

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1,923

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 102 parts In-Stock

1+ parts

$9.010

100+ parts

-

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102

$9.010

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Vigor

Singapore . 1,380 parts In-Stock

1+ parts

$9.350

100+ parts

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1,380

$9.350

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Microchip USA

USA . 2,173 parts In-Stock

1+ parts

$31.735

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2,173

$31.735

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IDEA Electronic Components Group

UK . 1,237 parts In-Stock

1+ parts

$39.994

100+ parts

-

1k+ parts

$35.995

10k+ parts

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1,237

$39.994

-

$35.995

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MKK Technologies

India . 1,569 parts In-Stock

1+ parts

$75.207

100+ parts

-

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10k+ parts

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1,569

$75.207

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DigiPath Technology Company

USA . 1,569 parts In-Stock

1+ parts

$75.207

100+ parts

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1,569

$75.207

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Corphita

USA . 4,774 parts In-Stock

1+ parts

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4,774

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Parana Technologies

USA . 2,109 parts In-Stock

1+ parts

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100+ parts

$47.819

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2,109

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$47.819

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Overview

Elevate your projects with the cutting-edge SPC564L60L3BCOQY microcontroller by STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics offers top-of-the-line solutions for a wide range of applications. The SPC564L60L3BCOQY boasts impressive features such as high performance, low power consumption, and versatile functionality, making it the ideal choice for your next project. Experience the value and benefits that this advanced microcontroller brings to the table – unlock endless possibilities and take your designs to the next level with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 3.63 V

A higher maximum supply voltage provides flexibility in power supply options and compatibility with different voltage sources.

Address Bus Width: 32

A wider address bus allows for larger memory addressing capabilities, essential for handling complex algorithms and data processing tasks.

Bit Size: 32

A 32-bit architecture enables high-performance computing and efficient processing of large data sets.

Power Supplies (V): 3.3

Operating at 3.3V ensures compatibility with standard power sources and reduces the need for additional voltage regulation circuitry.

No. of Terminals: 100

Having a high number of terminals allows for versatile connectivity options and integration with various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack design with low profile and fine pitch terminals enables compact and efficient PCB layout, saving space and improving signal integrity.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3V ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105 °C, the microcontroller can withstand industrial-level thermal conditions.

CPU Family: SPC56

The SPC56 CPU family offers high performance and reliability, suitable for demanding embedded system applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes the microcontroller suitable for use in extreme environments.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its functionality.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency and reduce processor workload, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and component placement, facilitating easier assembly and maintenance.

ROM Words: 1048576

With a large ROM capacity of 1048576 words, the microcontroller can store extensive program code and data for complex applications.

Width: 14 mm

A compact width of 14mm allows for integration into space-constrained designs without compromising functionality.

External Data Bus Width: 64

A wide external data bus width of 64 bits enables high-speed data transfer and efficient communication with external memory devices.

Maximum Clock Frequency: 40 MHz

Operating at a maximum clock frequency of 40MHz, the microcontroller can deliver fast processing speeds for real-time applications.

Length: 14 mm

A compact length of 14mm complements the width dimension, allowing for a small footprint in the final product design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions, making the microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripheral functions on a single chip, simplifying system design and reducing component count.

RAM Bytes: 131072

A generous RAM size of 131072 bytes enables efficient data storage and processing, supporting multitasking and complex algorithms.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, optimizing the overall performance and efficiency of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form factor enables easy and reliable soldering connections on the PCB, ensuring robust electrical connections.

Maximum Supply Current: 279 mA

The maximum supply current of 279mA indicates efficient power management and low power consumption during operation.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and stable operation.

PWM Channels: YES

Pulse Width Modulation channels provide precise control over analog outputs, making the microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible firmware updates, enhancing the versatility and longevity of the microcontroller.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5mm enables high-density mounting and efficient use of PCB real estate, essential for compact designs.

Speed: 80 rpm

Operating at a speed of 80 rpm, the microcontroller provides fast and responsive performance for real-time control applications.

No. of I/O Lines: 16

The availability of 16 I/O lines allows for versatile input/output configurations, enabling flexible interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers SPC564L60L3BCOQY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

16

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

279 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC564L60L3BCOQY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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